LPC2919FBD144/01551 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM9®
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 108
auf Bestellung 2341 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 18+ | 30.55 EUR |
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Technische Details LPC2919FBD144/01551 NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 144LQFP, Packaging: Bulk, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 768KB (768K x 8), RAM Size: 80K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM9®, Data Converters: A/D 16x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V, Connectivity: CANbus, EBI/EMI, LINbus, SPI, UART/USART, Peripherals: POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Part Status: Active, Number of I/O: 108.