LPC2460FBD208,551 NXP USA Inc.
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Bulk
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
auf Bestellung 148 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
20+ | 24.73 EUR |
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Technische Details LPC2460FBD208,551 NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP, Packaging: Tray, Package / Case: 208-LQFP, Mounting Type: Surface Mount, Speed: 72MHz, RAM Size: 96K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM7®, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V, Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG, Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT, Supplier Device Package: 208-LQFP (28x28), Part Status: Not For New Designs, Number of I/O: 160, DigiKey Programmable: Not Verified.
Weitere Produktangebote LPC2460FBD208,551
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Verfügbarkeit |
Preis ohne MwSt |
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LPC2460FBD208,551 | Hersteller : NXP Semiconductors | MCU 16-bit/32-bit ARM7TDMI-S RISC ROMLess 3.3V 208-Pin LQFP Tray |
Produkt ist nicht verfügbar |
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LPC2460FBD208,551 | Hersteller : NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFP Packaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 72MHz RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 8x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Part Status: Not For New Designs Number of I/O: 160 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC2460FBD208,551 | Hersteller : NXP Semiconductors | ARM Microcontrollers - MCU ARM7 USBHOST/ENET ROMLESS |
Produkt ist nicht verfügbar |