LPC18S10FBD144551 NXP USA Inc.
Hersteller: NXP USA Inc.Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 352 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 39+ | 12.4 EUR |
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Technische Details LPC18S10FBD144551 NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP, Packaging: Bulk, Package / Case: 144-LQFP, Mounting Type: Surface Mount, Speed: 180MHz, RAM Size: 136K x 8, Operating Temperature: -40°C ~ 85°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 8x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT, Supplier Device Package: 144-LQFP (20x20), Part Status: Active, Number of I/O: 83, DigiKey Programmable: Not Verified.