Suchergebnisse für "je150901401" : 3
Art der Ansicht :
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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268-5401-11-1102JH | 3M Electronic Solutions Division |
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Produkt ist nicht verfügbar |
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268-5401-11-1102JH | 3M |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: CLCC Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS), Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Beryllium Copper Part Status: Obsolete |
Produkt ist nicht verfügbar |
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268-5401-11-1102JH | 3M Interconnect Solutions |
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Produkt ist nicht verfügbar |
268-5401-11-1102JH |
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Hersteller: 3M Electronic Solutions Division
IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE
IC & Component Sockets END USE-LCC 24.13+/-0.25 A BASE
Produkt ist nicht verfügbar
268-5401-11-1102JH |
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Hersteller: 3M
Description: CONN SOCKET CLCC 68POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: CLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Description: CONN SOCKET CLCC 68POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: CLCC
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
268-5401-11-1102JH |
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Hersteller: 3M Interconnect Solutions
Conn LCC Socket SKT 68 POS 2.54mm Solder ST Thru-Hole Box
Conn LCC Socket SKT 68 POS 2.54mm Solder ST Thru-Hole Box
Produkt ist nicht verfügbar