HD6417705BP100BV Renesas Electronics Corporation
Hersteller: Renesas Electronics CorporationDescription: IC MCU 32BIT ROMLESS 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 32K x 8
Operating Temperature: -20°C ~ 75°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: SH-3
Data Converters: A/D 4x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (12x12)
Number of I/O: 105
DigiKey Programmable: Not Verified
auf Bestellung 1635 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 7+ | 70.39 EUR |
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Technische Details HD6417705BP100BV Renesas Electronics Corporation
Description: IC MCU 32BIT ROMLESS 208TFBGA, Packaging: Tray, Package / Case: 208-TFBGA, Mounting Type: Surface Mount, Speed: 100MHz, RAM Size: 32K x 8, Operating Temperature: -20°C ~ 75°C (TA), Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: SH-3, Data Converters: A/D 4x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V, Connectivity: EBI/EMI, FIFO, IrDA, SCI, USB, Peripherals: DMA, POR, PWM, WDT, Supplier Device Package: 208-TFBGA (12x12), Number of I/O: 105, DigiKey Programmable: Not Verified.