![ESQ-125-23-L-T ESQ-125-23-L-T](https://media.digikey.com/Photos/Samtec%20Photos/ESQ-125-23-L-T.jpg)
ESQ-125-23-L-T Samtec Inc.
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Description: CONN SOCKET 75POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Voltage Rating: 550VAC
Current Rating (Amps): 5.7A per Contact
Mounting Type: Through Hole
Number of Positions: 75
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.190" (4.83mm)
Insulation Height: 0.535" (13.60mm)
Row Spacing - Mating: 0.100" (2.54mm)
Number of Rows: 3
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1+ | 37.07 EUR |
10+ | 32.13 EUR |
100+ | 26.48 EUR |
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Technische Details ESQ-125-23-L-T Samtec Inc.
Description: CONN SOCKET 75POS 0.1 GOLD PCB, Packaging: Bulk, Connector Type: Elevated Socket, Voltage Rating: 550VAC, Current Rating (Amps): 5.7A per Contact, Mounting Type: Through Hole, Number of Positions: 75, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Forked, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Length - Post: 0.190" (4.83mm), Insulation Height: 0.535" (13.60mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 3.