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ESHF-110-01-F-D-TH-LC Samtec Inc.


eshf.pdf Hersteller: Samtec Inc.
Description: CONN HEADER VERT 20POS 1.27MM
Features: Board Lock, Keying Slot
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 20
Number of Rows: 2
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Shape: Square
Contact Length - Post: 0.075" (1.91mm)
Insulation Height: 0.210" (5.33mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
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Technische Details ESHF-110-01-F-D-TH-LC Samtec Inc.

Description: CONN HEADER VERT 20POS 1.27MM, Features: Board Lock, Keying Slot, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Shape: Square, Contact Length - Post: 0.075" (1.91mm), Insulation Height: 0.210" (5.33mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.120" (3.05mm).