DRA752APP1ABCRQ1 Texas Instruments
Hersteller: Texas Instruments
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 760-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: CANbus, I²C, McASP, SPI, UART
Type: Floating Point
Operating Temperature: -40°C ~ 125°C (TJ)
Non-Volatile Memory: ROM (256kB)
On-Chip RAM: 2.5MB
Voltage - I/O: 1.35V, 1.8V, 3.3V
Voltage - Core: 1.15V
Clock Rate: 1.5GHz
Supplier Device Package: 760-FCBGA (23x23)
Description: PROTOTYPE
Packaging: Bulk
Package / Case: 760-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: CANbus, I²C, McASP, SPI, UART
Type: Floating Point
Operating Temperature: -40°C ~ 125°C (TJ)
Non-Volatile Memory: ROM (256kB)
On-Chip RAM: 2.5MB
Voltage - I/O: 1.35V, 1.8V, 3.3V
Voltage - Core: 1.15V
Clock Rate: 1.5GHz
Supplier Device Package: 760-FCBGA (23x23)
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Technische Details DRA752APP1ABCRQ1 Texas Instruments
Description: PROTOTYPE, Packaging: Bulk, Package / Case: 760-BFBGA, FCBGA, Mounting Type: Surface Mount, Interface: CANbus, I²C, McASP, SPI, UART, Type: Floating Point, Operating Temperature: -40°C ~ 125°C (TJ), Non-Volatile Memory: ROM (256kB), On-Chip RAM: 2.5MB, Voltage - I/O: 1.35V, 1.8V, 3.3V, Voltage - Core: 1.15V, Clock Rate: 1.5GHz, Supplier Device Package: 760-FCBGA (23x23).