DF2238RBR13 Renesas Electronics Corporation
Hersteller: Renesas Electronics Corporation
Description: IC MCU 16BIT 256KB FLSH 112LFBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 13MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -20°C ~ 75°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: H8S/2000
Data Converters: A/D 8x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SCI, SmartCard
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 72
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLSH 112LFBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 13MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -20°C ~ 75°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: H8S/2000
Data Converters: A/D 8x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: I2C, SCI, SmartCard
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LFBGA (10x10)
Part Status: Obsolete
Number of I/O: 72
DigiKey Programmable: Not Verified
auf Bestellung 1242 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 67.33 EUR |
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Technische Details DF2238RBR13 Renesas Electronics Corporation
Description: IC MCU 16BIT 256KB FLSH 112LFBGA, Packaging: Tray, Package / Case: 112-LFBGA, Mounting Type: Surface Mount, Speed: 13MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 16K x 8, Operating Temperature: -20°C ~ 75°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: H8S/2000, Data Converters: A/D 8x10b; D/A 2x8b, Core Size: 16-Bit, Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V, Connectivity: I2C, SCI, SmartCard, Peripherals: POR, PWM, WDT, Supplier Device Package: 112-LFBGA (10x10), Part Status: Obsolete, Number of I/O: 72, DigiKey Programmable: Not Verified.