CY9AF114NBGL-GK9E1 Infineon Technologies
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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Technische Details CY9AF114NBGL-GK9E1 Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 112BGA, Packaging: Tray, Package / Case: 112-LFBGA, Mounting Type: Surface Mount, Speed: 40MHz, Program Memory Size: 256KB (256K x 8), RAM Size: 32K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 16x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, LVD, POR, PWM, WDT, Supplier Device Package: 112-PFBGA (10x10), Number of I/O: 83, DigiKey Programmable: Not Verified.