BD9596BMWV-ME2 Rohm Semiconductor
Hersteller: Rohm Semiconductor
Description: PMIC, INTEL CHIP
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 3.5V ~ 5.5V
Applications: General Purpose
Current - Supply: 22mA
Supplier Device Package: UQFN88MV0100
Description: PMIC, INTEL CHIP
Packaging: Tape & Reel (TR)
Package / Case: 88-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 3.5V ~ 5.5V
Applications: General Purpose
Current - Supply: 22mA
Supplier Device Package: UQFN88MV0100
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Technische Details BD9596BMWV-ME2 Rohm Semiconductor
Description: PMIC, INTEL CHIP, Packaging: Tape & Reel (TR), Package / Case: 88-VFQFN Exposed Pad, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 95°C, Voltage - Supply: 3.5V ~ 5.5V, Applications: General Purpose, Current - Supply: 22mA, Supplier Device Package: UQFN88MV0100.