BAV70SRA147 NXP USA Inc.
Hersteller: NXP USA Inc.Description: NEXPERIA BAV70 - HIGH-SPEED SWI
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 2 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 355mA (DC)
Supplier Device Package: DFN1412-6
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
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Technische Details BAV70SRA147 NXP USA Inc.
Description: NEXPERIA BAV70 - HIGH-SPEED SWI, Packaging: Bulk, Package / Case: 6-XFDFN Exposed Pad, Mounting Type: Surface Mount, Speed: Fast Recovery =< 500ns, > 200mA (Io), Reverse Recovery Time (trr): 4 ns, Technology: Standard, Diode Configuration: 2 Pair Common Cathode, Current - Average Rectified (Io) (per Diode): 355mA (DC), Supplier Device Package: DFN1412-6, Operating Temperature - Junction: 150°C (Max), Voltage - DC Reverse (Vr) (Max): 100 V, Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA, Current - Reverse Leakage @ Vr: 500 nA @ 80 V.