Technische Details 822-AG11D TE Connectivity
Description: CONN IC DIP SOCKET 22POS GOLD, Packaging: Tube, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Material - Post: Copper Alloy, Part Status: Obsolete.
Weitere Produktangebote 822-AG11D
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
822-AG11D | Hersteller : TE Connectivity | 822AG11D-TEC Unclassified |
Produkt ist nicht verfügbar |
||
822-AG11D | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 22POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 80.0µin (2.03µm) Contact Material - Post: Copper Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |