5591S, 210MMX0, 3MX1, 5MM 3M Interconnect Solutions
Hersteller: 3M Interconnect Solutions
Therm.cond. pad, filled silicone polymer, filler material: ceramic, single light adhesive, with polyester liner, heat coefficientt: 1,0W/m-K 0,3 m
Therm.cond. pad, filled silicone polymer, filler material: ceramic, single light adhesive, with polyester liner, heat coefficientt: 1,0W/m-K 0,3 m
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Technische Details 5591S, 210MMX0, 3MX1, 5MM 3M Interconnect Solutions
Therm.cond. pad, filled silicone polymer, filler material: ceramic, single light adhesive, with polyester liner, heat coefficientt: 1,0W/m-K 0,3 m.