Suchergebnisse für "558090" : 19
Art der Ansicht :
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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203558-0907 | Molex | Headers & Wire Housings PicoClasp Hdr SMT SR RA 9CKT W/PL Au0.38 |
auf Bestellung 5625 Stücke: Lieferzeit 10-14 Tag (e) |
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2035580907 | Molex |
Description: CONN HEADER SMD R/A 9POS 1MM Packaging: Tape & Reel (TR) Features: Pick and Place, Solder Retention Connector Type: Header Voltage Rating: 50V Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount, Right Angle Number of Positions: 9 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Friction Lock Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Rectangular Insulation Height: 0.185" (4.70mm) Shrouding: Shrouded - 4 Wall Insulation Material: Polyamide (PA), Nylon |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-P | Samtec Inc. |
Description: CONN HDR 50POS 0.05 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Row Spacing: 0.050" (1.27mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.648" (16.469mm) Length - Post (Mating): 0.090" (2.286mm) Length - Stack Height: 0.558" (14.173mm) |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-P | Samtec | Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-P-FR | Samtec | Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-P-TR | Samtec Inc. |
Description: .050" FLEX STACK, FLEXIBLE MICRO Packaging: Tape & Reel (TR) Color: Black Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Row Spacing: 0.050" (1.27mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.648" (16.469mm) Length - Post (Mating): 0.090" (2.286mm) Length - Stack Height: 0.558" (14.173mm) |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-P-TR | Samtec | Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-TR | Samtec Inc. |
Description: CONN HDR 50POS 0.05 STACK SMD Packaging: Tape & Reel (TR) Color: Black Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Row Spacing: 0.050" (1.27mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.648" (16.469mm) Length - Post (Mating): 0.090" (2.286mm) Length - Stack Height: 0.558" (14.173mm) |
Produkt ist nicht verfügbar |
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FW-25-05-L-D-558-090-TR | Samtec | Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
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FW-25-05-LM-D-558-090-P | Samtec Inc. |
Description: CONN HDR 50POS 0.05 STACK SMD Packaging: Tube Color: Black Mounting Type: Surface Mount Pitch: 0.050" (1.27mm) Row Spacing: 0.050" (1.27mm) Termination: Solder Contact Finish - Post (Mating): Gold Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm) Part Status: Active Number of Rows: 2 Number of Positions: 50 Length - Overall Pin: 0.648" (16.469mm) Length - Post (Mating): 0.090" (2.286mm) Length - Stack Height: 0.558" (14.173mm) |
Produkt ist nicht verfügbar |
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FW-25-05-LM-D-558-090-P | Samtec | Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch |
Produkt ist nicht verfügbar |
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SB558090AL | Tripp Lite |
Description: MOUNTING BRACKETS Packaging: Bulk For Use With/Related Products: Cabinet Racks Accessory Type: Mounting Brackets |
Produkt ist nicht verfügbar |
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SB558090TG | Tripp Lite |
Description: MOUNTING BRACKETS Packaging: Bulk For Use With/Related Products: Cabinet Racks Accessory Type: Mounting Brackets |
Produkt ist nicht verfügbar |
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SB558090UTG | Tripp Lite |
Description: MOTORS & SOLENOIDS Packaging: Bulk |
Produkt ist nicht verfügbar |
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44A0811-10-90-1KF | TE Connectivity Raychem Cable Protection |
Description: HOOK-UP DL STRND 10AWG WHT/BLACK Packaging: Bulk Voltage: 600V Wire Gauge: 10 AWG Jacket (Insulation) Material: Polyvinylidene Fluoride (PVDF) Conductor Strand: 37/26 Operating Temperature: -65°C ~ 150°C Cable Type: Hook-Up, Dual Wall Jacket (Insulation) Diameter: 0.155" (3.94mm) Jacket (Insulation) Thickness: 0.005" (0.13mm) Conductor Material: Copper, Tinned Jacket Color: White, Black Stripe Part Status: Active Qualification: MIL-W-81044 and MIL-C-27500 |
Produkt ist nicht verfügbar |
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44A0811-10-90-1KF | TE Connectivity / Raychem | Hook-up Wire 44A0811-10-90-1KF PRICE PER FOOT |
Produkt ist nicht verfügbar |
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IRL6342PBF | Infineon Technologies |
Description: MOSFET N-CH 30V 9.9A 8SO Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 9.9A (Ta) Rds On (Max) @ Id, Vgs: 14.6mOhm @ 9.9A, 4.5V Power Dissipation (Max): 2.5W (Ta) Vgs(th) (Max) @ Id: 1.1V @ 10µA Supplier Device Package: 8-SO Part Status: Discontinued at Digi-Key Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 1025 pF @ 25 V |
Produkt ist nicht verfügbar |
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MP2-HP10-54P1-LR | 3M Electronic Solutions Division | Hard Metric Connectors MP2/HDR/PWR/10P/5R/ PRFT/4.60MM/30PDNI |
Produkt ist nicht verfügbar |
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MTXDOT-WW1-B10-TR-250 | Multi-Tech Systems Inc. |
Description: XDOT ADVANCED WITH UFL AND TRACE Packaging: Tape & Reel (TR) Package / Case: 58-SMD Module Sensitivity: -148dBm Mounting Type: Surface Mount Frequency: 864MHz, 865MHz, 868MHz, 915MHz, 920MHz, 923MHz Memory Size: 384kB Flash, 160kB SRAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.4V ~ 3.57V Power - Output: 21dBm Protocol: EDGE, LoRa™, LoRaWAN Antenna Type: PCB Trace, Antenna Not Included, U.FL RF Family/Standard: Cellular Serial Interfaces: I2C, SPI, UART |
Produkt ist nicht verfügbar |
203558-0907 |
Hersteller: Molex
Headers & Wire Housings PicoClasp Hdr SMT SR RA 9CKT W/PL Au0.38
Headers & Wire Housings PicoClasp Hdr SMT SR RA 9CKT W/PL Au0.38
auf Bestellung 5625 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 3.68 EUR |
10+ | 3.2 EUR |
100+ | 2.87 EUR |
500+ | 2.82 EUR |
1300+ | 2.39 EUR |
2600+ | 2.36 EUR |
3900+ | 1.99 EUR |
2035580907 |
Hersteller: Molex
Description: CONN HEADER SMD R/A 9POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 9
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Rectangular
Insulation Height: 0.185" (4.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Description: CONN HEADER SMD R/A 9POS 1MM
Packaging: Tape & Reel (TR)
Features: Pick and Place, Solder Retention
Connector Type: Header
Voltage Rating: 50V
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount, Right Angle
Number of Positions: 9
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Friction Lock
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Rectangular
Insulation Height: 0.185" (4.70mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Polyamide (PA), Nylon
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-P |
Hersteller: Samtec Inc.
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-P |
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-P-FR |
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-P-TR |
Hersteller: Samtec Inc.
Description: .050" FLEX STACK, FLEXIBLE MICRO
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Description: .050" FLEX STACK, FLEXIBLE MICRO
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-P-TR |
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-TR |
Hersteller: Samtec Inc.
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Produkt ist nicht verfügbar
FW-25-05-L-D-558-090-TR |
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Produkt ist nicht verfügbar
FW-25-05-LM-D-558-090-P |
Hersteller: Samtec Inc.
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Description: CONN HDR 50POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.648" (16.469mm)
Length - Post (Mating): 0.090" (2.286mm)
Length - Stack Height: 0.558" (14.173mm)
Produkt ist nicht verfügbar
FW-25-05-LM-D-558-090-P |
Hersteller: Samtec
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Board to Board & Mezzanine Connectors Flexible Micro Board Stacking Header, 0.050" Pitch
Produkt ist nicht verfügbar
SB558090AL |
Hersteller: Tripp Lite
Description: MOUNTING BRACKETS
Packaging: Bulk
For Use With/Related Products: Cabinet Racks
Accessory Type: Mounting Brackets
Description: MOUNTING BRACKETS
Packaging: Bulk
For Use With/Related Products: Cabinet Racks
Accessory Type: Mounting Brackets
Produkt ist nicht verfügbar
SB558090TG |
Hersteller: Tripp Lite
Description: MOUNTING BRACKETS
Packaging: Bulk
For Use With/Related Products: Cabinet Racks
Accessory Type: Mounting Brackets
Description: MOUNTING BRACKETS
Packaging: Bulk
For Use With/Related Products: Cabinet Racks
Accessory Type: Mounting Brackets
Produkt ist nicht verfügbar
SB558090UTG |
Produkt ist nicht verfügbar
44A0811-10-90-1KF |
Hersteller: TE Connectivity Raychem Cable Protection
Description: HOOK-UP DL STRND 10AWG WHT/BLACK
Packaging: Bulk
Voltage: 600V
Wire Gauge: 10 AWG
Jacket (Insulation) Material: Polyvinylidene Fluoride (PVDF)
Conductor Strand: 37/26
Operating Temperature: -65°C ~ 150°C
Cable Type: Hook-Up, Dual Wall
Jacket (Insulation) Diameter: 0.155" (3.94mm)
Jacket (Insulation) Thickness: 0.005" (0.13mm)
Conductor Material: Copper, Tinned
Jacket Color: White, Black Stripe
Part Status: Active
Qualification: MIL-W-81044 and MIL-C-27500
Description: HOOK-UP DL STRND 10AWG WHT/BLACK
Packaging: Bulk
Voltage: 600V
Wire Gauge: 10 AWG
Jacket (Insulation) Material: Polyvinylidene Fluoride (PVDF)
Conductor Strand: 37/26
Operating Temperature: -65°C ~ 150°C
Cable Type: Hook-Up, Dual Wall
Jacket (Insulation) Diameter: 0.155" (3.94mm)
Jacket (Insulation) Thickness: 0.005" (0.13mm)
Conductor Material: Copper, Tinned
Jacket Color: White, Black Stripe
Part Status: Active
Qualification: MIL-W-81044 and MIL-C-27500
Produkt ist nicht verfügbar
44A0811-10-90-1KF |
Hersteller: TE Connectivity / Raychem
Hook-up Wire 44A0811-10-90-1KF PRICE PER FOOT
Hook-up Wire 44A0811-10-90-1KF PRICE PER FOOT
Produkt ist nicht verfügbar
IRL6342PBF |
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 9.9A 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9.9A (Ta)
Rds On (Max) @ Id, Vgs: 14.6mOhm @ 9.9A, 4.5V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 1.1V @ 10µA
Supplier Device Package: 8-SO
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1025 pF @ 25 V
Description: MOSFET N-CH 30V 9.9A 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9.9A (Ta)
Rds On (Max) @ Id, Vgs: 14.6mOhm @ 9.9A, 4.5V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 1.1V @ 10µA
Supplier Device Package: 8-SO
Part Status: Discontinued at Digi-Key
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1025 pF @ 25 V
Produkt ist nicht verfügbar
MP2-HP10-54P1-LR |
Hersteller: 3M Electronic Solutions Division
Hard Metric Connectors MP2/HDR/PWR/10P/5R/ PRFT/4.60MM/30PDNI
Hard Metric Connectors MP2/HDR/PWR/10P/5R/ PRFT/4.60MM/30PDNI
Produkt ist nicht verfügbar
MTXDOT-WW1-B10-TR-250 |
Hersteller: Multi-Tech Systems Inc.
Description: XDOT ADVANCED WITH UFL AND TRACE
Packaging: Tape & Reel (TR)
Package / Case: 58-SMD Module
Sensitivity: -148dBm
Mounting Type: Surface Mount
Frequency: 864MHz, 865MHz, 868MHz, 915MHz, 920MHz, 923MHz
Memory Size: 384kB Flash, 160kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.57V
Power - Output: 21dBm
Protocol: EDGE, LoRa™, LoRaWAN
Antenna Type: PCB Trace, Antenna Not Included, U.FL
RF Family/Standard: Cellular
Serial Interfaces: I2C, SPI, UART
Description: XDOT ADVANCED WITH UFL AND TRACE
Packaging: Tape & Reel (TR)
Package / Case: 58-SMD Module
Sensitivity: -148dBm
Mounting Type: Surface Mount
Frequency: 864MHz, 865MHz, 868MHz, 915MHz, 920MHz, 923MHz
Memory Size: 384kB Flash, 160kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.57V
Power - Output: 21dBm
Protocol: EDGE, LoRa™, LoRaWAN
Antenna Type: PCB Trace, Antenna Not Included, U.FL
RF Family/Standard: Cellular
Serial Interfaces: I2C, SPI, UART
Produkt ist nicht verfügbar