5519, 155MMX0, 21MX2, 0MM 3M Interconnect Solutions
Hersteller: 3M Interconnect Solutions
Therm.cond. pad,illed silicone elastomer, filler material: ceramic, good fit, easy to adhere on both sides, heat coefficient: 4,1 W/m-K 0,21 m
Therm.cond. pad,illed silicone elastomer, filler material: ceramic, good fit, easy to adhere on both sides, heat coefficient: 4,1 W/m-K 0,21 m
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Technische Details 5519, 155MMX0, 21MX2, 0MM 3M Interconnect Solutions
Therm.cond. pad,illed silicone elastomer, filler material: ceramic, good fit, easy to adhere on both sides, heat coefficient: 4,1 W/m-K 0,21 m.