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4608X-AP1-122LF Bourns Inc.
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Description: RNET - THK FILM CONF SIP
Packaging: Tape & Box (TB)
Resistance (Ohms): 1.2k
Tolerance: ±2%
Power Per Element: 1W
Circuit Type: Bussed
Number of Pins: 8
Package / Case: 8-SIP
Temperature Coefficient: ±100ppm/°C
Size / Dimension: 0.798" L x 0.098" W (20.27mm x 2.49mm)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 125°C
Supplier Device Package: 8-SIP
Height - Seated (Max): 0.200" (5.08mm)
Resistor-Ratio-Drift: 50ppm/°C
Number of Resistors: 7
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Technische Details 4608X-AP1-122LF Bourns Inc.
Description: RNET - THK FILM CONF SIP, Packaging: Tape & Box (TB), Resistance (Ohms): 1.2k, Tolerance: ±2%, Power Per Element: 1W, Circuit Type: Bussed, Number of Pins: 8, Package / Case: 8-SIP, Temperature Coefficient: ±100ppm/°C, Size / Dimension: 0.798" L x 0.098" W (20.27mm x 2.49mm), Mounting Type: Through Hole, Operating Temperature: -55°C ~ 125°C, Supplier Device Package: 8-SIP, Height - Seated (Max): 0.200" (5.08mm), Resistor-Ratio-Drift: 50ppm/°C, Number of Resistors: 7.