25EMPPC603EBC-166 IBM
Hersteller: IBM
Description: IC MPU 166MHZ 278FCPBGA
Packaging: Bulk
Package / Case: 278-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: PowerPC EM603e
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 278-FCPBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU 166MHZ 278FCPBGA
Packaging: Bulk
Package / Case: 278-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: PowerPC EM603e
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 278-FCPBGA (21x21)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
auf Bestellung 1280 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
8+ | 61.31 EUR |
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Technische Details 25EMPPC603EBC-166 IBM
Description: IC MPU 166MHZ 278FCPBGA, Packaging: Bulk, Package / Case: 278-BBGA, FCBGA, Mounting Type: Surface Mount, Speed: 166MHz, Operating Temperature: 0°C ~ 105°C (TJ), Core Processor: PowerPC EM603e, Voltage - I/O: 2.5V, 3.3V, Supplier Device Package: 278-FCPBGA (21x21), Number of Cores/Bus Width: 1 Core, 32-Bit, Graphics Acceleration: No.