24-4518-10

24-4518-10 Aries Electronics


518_Series.pdf Hersteller: Aries Electronics
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
auf Bestellung 88 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.33 EUR
10+ 4.85 EUR
25+ 4.59 EUR
50+ 4.48 EUR
Mindestbestellmenge: 4
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Technische Details 24-4518-10 Aries Electronics

Description: CONN IC DIP SOCKET 24POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.

Weitere Produktangebote 24-4518-10

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24-4518-10 24-4518-10 Hersteller : Aries Electronics 12016-open-frame-dip-collet-solder-tail-socket-336841.pdf IC & Component Sockets OPEN FRAME COLLET SOLDER TAIL 24 PINS
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