2-1571551-9 TE CONNECTIVITY / PARTNER STOCK
Hersteller: TE CONNECTIVITY / PARTNER STOCKDescription: TE CONNECTIVITY / PARTNER STOCK - 2-1571551-9 - IC- & Baustein-Sockel, 28 Kontakt(e), DIP-Sockel, 2.54 mm, DIPLOMATE 500, 15.24 mm
tariffCode: 85369010
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
Steckverbindertyp: DIP-Sockel
rohsCompliant: YES
Rastermaß: 2.54mm
Anzahl der Kontakte: 28Kontakt(e)
euEccn: NLR
Kontaktmaterial: Berylliumkupfer
hazardous: false
Reihenabstand: 15.24mm
rohsPhthalatesCompliant: YES
usEccn: EAR99
Produktpalette: DIPLOMATE 500
SVHC: No SVHC (16-Jan-2020)
auf Bestellung 3400 Stücke:
Lieferzeit 14-21 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 2-1571551-9 TE CONNECTIVITY / PARTNER STOCK
Description: CONN IC DIP SOCKET 28POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: FLASH, Contact Material - Post: Nickel.
Weitere Produktangebote 2-1571551-9 nach Preis ab 3.43 EUR bis 4.13 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 2-1571551-9 | Hersteller : TE Connectivity |
Category: Semiconductors - accessories - Unclass. Description: 2-1571551-9 Anzahl je Verpackung: 1 Stücke |
auf Bestellung 4237 Stücke: Lieferzeit 7-14 Tag (e) |
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| 2-1571551-9 | Hersteller : TE Connectivity |
Category: Semiconductors - accessories - Unclass. Description: 2-1571551-9 |
auf Bestellung 4237 Stücke: Lieferzeit 14-21 Tag (e) |
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2-1571551-9 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: FLASH Contact Material - Post: Nickel |
Produkt ist nicht verfügbar |