2-1571550-7 TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 25.0µin (0.63µm)
Contact Material - Post: Beryllium Copper
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Technische Details 2-1571550-7 TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 22POS GOLD, Packaging: Tube, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.4" (10.16mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 22 (2 x 11), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 25.0µin (0.63µm), Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 2-1571550-7
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
2-1571550-7 | Hersteller : TE Connectivity | IC & Component Sockets 522-AG11D-LF= 500 DIP PCB AU/SN |
Produkt ist nicht verfügbar |