19-0508-30 Aries Electronics
Hersteller: Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
Description: CONN SOCKET SIP 19POS GOLD
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 19 (1 x 19)
Termination: Wire Wrap
Housing Material: Polyamide (PA46), Nylon 4/6
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Part Status: Active
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Technische Details 19-0508-30 Aries Electronics
Description: CONN SOCKET SIP 19POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 19 (1 x 19), Termination: Wire Wrap, Housing Material: Polyamide (PA46), Nylon 4/6, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 19-0508-30
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
19-0508-30 | Hersteller : Aries Electronics | IC & Component Sockets SINGLE ROW COLLET WIRE WRAP 19 PINS |
Produkt ist nicht verfügbar |