Technische Details 13553474 Aptiv
Description: CONN RCPT 8POS 0.1 TIN SMD, Packaging: Bulk, Features: Pick and Place, Connector Type: Receptacle, Bottom or Top Entry, Mounting Type: Surface Mount, Number of Positions: 8, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Finish - Post: Tin, Insulation Height: 0.244" (6.20mm), Row Spacing - Mating: 0.100" (2.54mm), Number of Rows: 2.
Weitere Produktangebote 13553474
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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1355347-4 | Hersteller : TE Connectivity AMP Connectors |
Description: CONN RCPT 8POS 0.1 TIN SMD Packaging: Bulk Features: Pick and Place Connector Type: Receptacle, Bottom or Top Entry Mounting Type: Surface Mount Number of Positions: 8 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin Insulation Height: 0.244" (6.20mm) Row Spacing - Mating: 0.100" (2.54mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |