121-83-308-41-001101 Preci-Dip
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Technische Details 121-83-308-41-001101 Preci-Dip
Description: CONN IC DIP SOCKET 8POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Wire Wrap, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass.
Weitere Produktangebote 121-83-308-41-001101
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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121-83-308-41-001101 | Hersteller : Preci-Dip |
Description: CONN IC DIP SOCKET 8POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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121-83-308-41-001101 | Hersteller : Preci-dip | Board to Board & Mezzanine Connectors |
Produkt ist nicht verfügbar |