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0900-3 Preci-Dip
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Description: CONTACT SPRING LOADED SMD GOLD W
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Type: Sleeve & Plunger (Pogo Pins)
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass
Mating Cycles: 100000
Part Status: Active
Maximum Working Height: 0.217" (5.51mm)
Recommended Working Height: 0.165" (4.19mm)
Minimum Working Height: 0.162" (4.11mm)
Pad Layout Dimension: Circular - 0.072" (1.83mm)
Plunger Size: 0.042" (1.07mm) Dia
Operating Force - Initial: 25.49gf
Operating Force - Mid Compression: 91.77gf
auf Bestellung 9648 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
13+ | 1.36 EUR |
16+ | 1.15 EUR |
25+ | 1.1 EUR |
50+ | 1.08 EUR |
100+ | 1.03 EUR |
250+ | 0.94 EUR |
500+ | 0.84 EUR |
1000+ | 0.75 EUR |
2500+ | 0.68 EUR |
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Technische Details 0900-3 Preci-Dip
Description: CONTACT SPRING LOADED SMD GOLD W, Packaging: Bulk, Contact Finish: Gold, Mounting Type: Surface Mount, Contact Type: Sleeve & Plunger (Pogo Pins), Contact Finish Thickness: 20.0µin (0.51µm), Contact Material: Brass, Mating Cycles: 100000, Part Status: Active, Maximum Working Height: 0.217" (5.51mm), Recommended Working Height: 0.165" (4.19mm), Minimum Working Height: 0.162" (4.11mm), Pad Layout Dimension: Circular - 0.072" (1.83mm), Plunger Size: 0.042" (1.07mm) Dia, Operating Force - Initial: 25.49gf, Operating Force - Mid Compression: 91.77gf.