09-0503-30 Aries Electronics
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 9.61 EUR |
| 10+ | 9.45 EUR |
| 100+ | 6.74 EUR |
| 250+ | 6.55 EUR |
| 500+ | 6.39 EUR |
| 1000+ | 6.07 EUR |
| 2500+ | 5.97 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 09-0503-30 Aries Electronics
Description: CONN SOCKET SIP 9POS GOLD, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Number of Positions or Pins (Grid): 9 (1 x 9), Termination: Wire Wrap, Housing Material: Polyamide (PA), Nylon, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Material - Post: Brass.
Weitere Produktangebote 09-0503-30
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
| 09-0503-30 | Hersteller : Aries Electronics |
 Description: CONN SOCKET SIP 9POS GOLDPackaging: Bulk Mounting Type: Through Hole Type: SIP Number of Positions or Pins (Grid): 9 (1 x 9) Termination: Wire Wrap Housing Material: Polyamide (PA), Nylon, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass |
Produkt ist nicht verfügbar |