Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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116-83-310-41-011101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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116-83-310-41-012101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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116-83-310-41-013101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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116-83-310-41-018101 | Preci-Dip | Description: CONN IC DIP SOCKET 10POS GOLD |
Produkt ist nicht verfügbar |
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116-83-312-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 12POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-312-41-011101 | Preci-Dip | Description: CONN IC DIP SOCKET 12POS GOLD |
Produkt ist nicht verfügbar |
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116-83-312-41-012101 | Preci-Dip | Description: CONN IC DIP SOCKET 12POS GOLD |
Produkt ist nicht verfügbar |
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116-83-312-41-013101 | Preci-Dip | Description: CONN IC DIP SOCKET 12POS GOLD |
Produkt ist nicht verfügbar |
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116-83-312-41-018101 | Preci-Dip | Description: CONN IC DIP SOCKET 12POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-002101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-314-41-004101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
auf Bestellung 2396 Stücke: Lieferzeit 10-14 Tag (e) |
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116-83-314-41-007101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-314-41-009101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-011101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-012101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-013101 | Preci-Dip | Description: CONN IC DIP SOCKET 14POS GOLD |
Produkt ist nicht verfügbar |
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116-83-314-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 14POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-316-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-002101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-003101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-004101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-006101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-007101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-008101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-009101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-011101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-012101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-013101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-316-41-018101 | Preci-Dip | Description: CONN IC DIP SOCKET 16POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-001101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-002101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-318-41-004101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-318-41-007101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-008101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-009101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-011101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-012101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Features: Elevated, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-318-41-013101 | Preci-Dip | Description: CONN IC DIP SOCKET 18POS GOLD |
Produkt ist nicht verfügbar |
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116-83-318-41-018101 | Preci-Dip |
Description: CONN IC DIP SOCKET 18POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass |
Produkt ist nicht verfügbar |
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116-83-320-41-001101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-002101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-003101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-004101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-006101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-007101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-008101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
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116-83-320-41-009101 | Preci-Dip |
Description: CONN IC DIP SOCKET 20POS GOLD Packaging: Bulk Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |
116-83-310-41-011101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
116-83-310-41-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
116-83-310-41-013101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
116-83-310-41-018101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 10POS GOLD
Description: CONN IC DIP SOCKET 10POS GOLD
Produkt ist nicht verfügbar
116-83-312-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-002101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-003101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-004101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-006101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-007101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-008101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-009101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-312-41-011101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
116-83-312-41-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
116-83-312-41-013101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
116-83-312-41-018101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 12POS GOLD
Description: CONN IC DIP SOCKET 12POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-002101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-003101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-314-41-004101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-006101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
auf Bestellung 2396 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.68 EUR |
30+ | 3.08 EUR |
120+ | 2.87 EUR |
510+ | 2.39 EUR |
1020+ | 2.05 EUR |
116-83-314-41-007101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-008101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-314-41-009101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-011101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-013101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Description: CONN IC DIP SOCKET 14POS GOLD
Produkt ist nicht verfügbar
116-83-314-41-018101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-316-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-002101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-003101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-004101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-006101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-007101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-008101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-009101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-011101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-013101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-316-41-018101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 16POS GOLD
Description: CONN IC DIP SOCKET 16POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-002101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-003101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-318-41-004101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-006101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-318-41-007101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-008101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-009101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-011101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-012101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Elevated, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-318-41-013101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Description: CONN IC DIP SOCKET 18POS GOLD
Produkt ist nicht verfügbar
116-83-318-41-018101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Produkt ist nicht verfügbar
116-83-320-41-001101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-002101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-003101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-004101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-006101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-007101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-008101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
116-83-320-41-009101 |
Hersteller: Preci-Dip
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Bulk
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar