Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 581 nach 591
| Foto | Bezeichnung | Hersteller | Beschreibung |
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| PNEV5190MB | NXP USA Inc. |
 Description: PNEV5190MBPackaging: Bulk Type: Near Field Communication (NFC) Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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| MCIMX6Z0DVM09ABR | NXP USA Inc. |
Description: I.MX6ULZ, 289MAPBGA Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 289-MAPBGA (14x14) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB |
Produkt ist nicht verfügbar |
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SA56004ETK,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8HVSON Features: Output Switch, Programmable Limit Packaging: Bulk Package / Case: 8-VDFN Exposed Pad Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-HVSON (3x3) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C |
auf Bestellung 1710 Stücke: Lieferzeit 10-14 Tag (e) |
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BZV55-C9V1,135 | NXP USA Inc. |
Description: DIODE ZENER 9.1V 500MW LLDS Packaging: Bulk |
auf Bestellung 60000 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G125GN,115 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 8XSON Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 8-XSON (1.2x1) |
auf Bestellung 75824 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP2G125GF,115 | NXP USA Inc. |
Description: NOW NEXPERIA 74AUP2G125GF - BUS Packaging: Bulk Package / Case: 8-XFDFN Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 8-XSON (1.35x1) |
auf Bestellung 19776 Stücke: Lieferzeit 10-14 Tag (e) |
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| A3V07H600-2STG | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 600W 758-80 Packaging: Bulk Supplied Contents: Board(s) |
Produkt ist nicht verfügbar |
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PDTA143XM,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 250MW SOT883 Packaging: Bulk |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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MK10DX64VMC7 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 39x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 74 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| BT134-600G,127 | NXP USA Inc. |
Description: TRIAC 600V 4A SOT82-3 Packaging: Bulk |
auf Bestellung 58915 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC390DB,118 | NXP USA Inc. |
Description: IC DECADE COUNTR DL 4BIT 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C (TA) Trigger Type: Negative Edge Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC390DB,112 | NXP USA Inc. |
Description: IC DUAL DECADE RIPP COUNT 16SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Counter, Decade Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 71 MHz Number of Bits per Element: 4 |
auf Bestellung 2976 Stücke: Lieferzeit 10-14 Tag (e) |
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| PCA8546BTT/AY | NXP USA Inc. |
Description: 4 X 44 AUTOMOTIVE LCD DRIVER Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 176 Segment Operating Temperature: -40°C ~ 95°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 11 Characters, 22 Characters, 176 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 30 µA Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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MC68HC908LK24CPK | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 80FQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 80-FQFP (12x12) Number of I/O: 40 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MIMX8QM6AVUFFABR | NXP USA Inc. |
Description: I.MX 8QUADMAX Packaging: Tape & Reel (TR) Package / Case: 1313-BFBGA Mounting Type: Surface Mount Speed: 1.6GHz, 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1313-BGA (29x29) Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Additional Interfaces: CANbus, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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| BUK9507-30B,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 75A TO220AB Packaging: Tube |
auf Bestellung 11973 Stücke: Lieferzeit 10-14 Tag (e) |
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| MFS2320BMMA0EPR2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| MFS2320BMMA0EP | NXP USA Inc. |
Description: IC Packaging: Tray |
Produkt ist nicht verfügbar |
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74AHCT08D,112 | NXP USA Inc. |
Description: IC GATE AND 4CH 2-INP 14-SO Packaging: Bulk |
auf Bestellung 44162 Stücke: Lieferzeit 10-14 Tag (e) |
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NCX2202GW,125 | NXP USA Inc. |
Description: IC COMPARATOR 1 GEN PUR 5TSSOP Packaging: Bulk Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Open-Drain Mounting Type: Surface Mount Number of Elements: 1 Type: General Purpose Operating Temperature: -40°C ~ 85°C Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V Supplier Device Package: 5-TSSOP Propagation Delay (Max): 0.8µs Current - Quiescent (Max): 6µA Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Hysteresis: 20mV |
auf Bestellung 7380 Stücke: Lieferzeit 10-14 Tag (e) |
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MC33VR5500V1ES | NXP USA Inc. |
Description: VR5500 Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Switching Regulator Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
auf Bestellung 240 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC855TVR50D4 | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
auf Bestellung 9425 Stücke: Lieferzeit 10-14 Tag (e) |
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| MPC855TCVR50D4-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk |
auf Bestellung 1758 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC875VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860TVR66D4 | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk |
auf Bestellung 91 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC859DSLVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860DPVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860DTVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860ENVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860PCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860PVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860SRCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MC908AZ60ACFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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TDA8035HN/C1/S1EL | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HVQFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: Analog Voltage - Supply: 2.7V ~ 5.5V Supplier Device Package: 32-HVQFN (5x5) |
Produkt ist nicht verfügbar |
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74HC163D,653 | NXP USA Inc. |
Description: IC SYNC 4BIT BINAR COUNT 16SOIC Packaging: Bulk Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Synchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 55 MHz Number of Bits per Element: 4 |
auf Bestellung 20913 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC163PW,118 | NXP USA Inc. |
Description: IC SYNC 4BIT BINAR COUNT 16TSSOP Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Synchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-TSSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 55 MHz Number of Bits per Element: 4 |
auf Bestellung 14498 Stücke: Lieferzeit 10-14 Tag (e) |
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74HC163DB,112 | NXP USA Inc. |
Description: IC SYNC 4BIT BINAR COUNTR 16SSOP Packaging: Bulk Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Synchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 55 MHz Number of Bits per Element: 4 |
auf Bestellung 4890 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1075ATW/5V0/WDJ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Grade: Automotive |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1075ATW/5V0/WDJ | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Cut Tape (CT) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Interface: CAN, LIN Voltage - Supply: 4.5V ~ 28V Supplier Device Package: 32-HTSSOP Grade: Automotive |
auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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MRFE6S9060GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-4 Packaging: Tape & Reel (TR) Package / Case: TO-270BB Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 14W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Gull Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRFE6S9200HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880H Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 58W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-880H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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| UJA1132AHW/3F4/0Y | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| S9S12ZVL32AWLF | NXP USA Inc. |
Description: S12Z CPU, 32K FLASH Packaging: Tray |
Produkt ist nicht verfügbar |
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| UJA1132AHW/5F0/0Y | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| UJA1131AHW/5F4/0Y | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| UJA1131AHW/3F4/0Y | NXP USA Inc. |
Description: IC Packaging: Bulk |
Produkt ist nicht verfügbar |
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| MC33FS6505KAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| LS1043ABE9MQB | NXP USA Inc. |
Description: LAYERSCAPE 64-BIT ARM CORTEX-A53 Packaging: Tray Package / Case: 780-BFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2) USB: USB 3.0 + PHY (3) Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: ARM TZ, Boot Security SATA: SATA 6Gbps (1) Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART |
Produkt ist nicht verfügbar |
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P2010NXN2KHC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ PBGA689 Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI |
Produkt ist nicht verfügbar |
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MC100ES6111AC | NXP USA Inc. |
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP Packaging: Tray Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: ECL, PECL Type: Fanout Buffer (Distribution), Multiplexer Input: ECL, HSTL, PECL Operating Temperature: -40°C ~ 110°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:10 Differential - Input:Output: Yes/Yes Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 2.7 GHz |
Produkt ist nicht verfügbar |
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MKL27Z128VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN Packaging: Tape & Reel (TR) Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 32-HUQFN (5x5) Number of I/O: 23 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| MPF5020AVNA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| MPF5020CMBA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3 Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
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| S9S12G128J0CLLR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
Produkt ist nicht verfügbar |
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S912ZVC12AMLFR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 28 |
Produkt ist nicht verfügbar |
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S912ZVMC12AWKHR | NXP USA Inc. |
Description: S12Z CORE,128K FLASH,CAN,64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Number of I/O: 31 |
Produkt ist nicht verfügbar |
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MC9S08GT32ACFDER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48QFN Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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| 74LVC2G53GF,115 | NXP USA Inc. |
Description: IC SWITCH SPDT X 1 10OHM 8XSON Packaging: Bulk Package / Case: 8-XFDFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 10Ohm -3db Bandwidth: 300MHz Supplier Device Package: 8-XSON (1.35x1) Voltage - Supply, Single (V+): 1.65V ~ 5.5V Charge Injection: 7.5pC Switch Circuit: SPDT Multiplexer/Demultiplexer Circuit: 2:1 Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns Channel Capacitance (CS(off), CD(off)): 6pF Current - Leakage (IS(off)) (Max): 500nA Number of Circuits: 1 |
auf Bestellung 101525 Stücke: Lieferzeit 10-14 Tag (e) |
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BZX79-C7V5,113 | NXP USA Inc. |
Description: DIODE ZENER 7.5V 400MW ALF2 Packaging: Bulk |
auf Bestellung 458840 Stücke: Lieferzeit 10-14 Tag (e) |
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74LVC1G14GN,132 | NXP USA Inc. |
Description: IC INVERT SCHMITT 1CH 1INP 6XSON Features: Schmitt Trigger Packaging: Bulk Package / Case: 6-XFDFN Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.65V ~ 5.5V Current - Output High, Low: 32mA, 32mA Number of Inputs: 1 Supplier Device Package: 6-XSON (0.9x1) Input Logic Level - High: 1.14V ~ 2.79V Input Logic Level - Low: 0.46V ~ 1.58V Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 4 µA |
auf Bestellung 166794 Stücke: Lieferzeit 10-14 Tag (e) |
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| PNEV5190MB |
|
Hersteller: NXP USA Inc.
Description: PNEV5190MB
Packaging: Bulk
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Description: PNEV5190MB
Packaging: Bulk
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| MCIMX6Z0DVM09ABR |
|
Hersteller: NXP USA Inc.
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Produkt ist nicht verfügbar
| SA56004ETK,118 |
|
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
auf Bestellung 1710 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 634+ | 0.76 EUR |
| BZV55-C9V1,135 |
|
auf Bestellung 60000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13172+ | 0.032 EUR |
| 74AUP2G125GN,115 |
|
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
Description: IC BUFFER NON-INVERT 3.6V 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.2x1)
auf Bestellung 75824 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1750+ | 0.28 EUR |
| 74AUP2G125GF,115 |
|
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA 74AUP2G125GF - BUS
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
Description: NOW NEXPERIA 74AUP2G125GF - BUS
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON (1.35x1)
auf Bestellung 19776 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1612+ | 0.31 EUR |
| A3V07H600-2STG |
Hersteller: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
| PDTA143XM,315 |
|
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11871+ | 0.049 EUR |
| MK10DX64VMC7 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| BT134-600G,127 |
|
auf Bestellung 58915 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1259+ | 0.38 EUR |
| 74HC390DB,118 |
|
Hersteller: NXP USA Inc.
Description: IC DECADE COUNTR DL 4BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DECADE COUNTR DL 4BIT 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1003+ | 0.47 EUR |
| 74HC390DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
Description: IC DUAL DECADE RIPP COUNT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 71 MHz
Number of Bits per Element: 4
auf Bestellung 2976 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 871+ | 0.54 EUR |
| PCA8546BTT/AY |
Hersteller: NXP USA Inc.
Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MC68HC908LK24CPK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MIMX8QM6AVUFFABR |
|
Hersteller: NXP USA Inc.
Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Produkt ist nicht verfügbar
| BUK9507-30B,127 |
auf Bestellung 11973 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 761+ | 0.63 EUR |
| MFS2320BMMA0EPR2 |
|
Produkt ist nicht verfügbar
| 74AHCT08D,112 |
|
auf Bestellung 44162 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2674+ | 0.18 EUR |
| NCX2202GW,125 |
|
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
Description: IC COMPARATOR 1 GEN PUR 5TSSOP
Packaging: Bulk
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 1
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 5-TSSOP
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 6µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 20mV
auf Bestellung 7380 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 898+ | 0.53 EUR |
| MC33VR5500V1ES |
|
Hersteller: NXP USA Inc.
Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.75 EUR |
| 10+ | 7.9 EUR |
| 25+ | 7.53 EUR |
| 80+ | 6.54 EUR |
| MPC855TVR50D4 |
|
Hersteller: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
auf Bestellung 9425 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 222.2 EUR |
| MPC855TCVR50D4-NXP |
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 222.2 EUR |
| MPC875VR66 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860TVR66D4 |
|
auf Bestellung 91 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 315.84 EUR |
| MPC859DSLVR66A |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860DPVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860DTVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860ENVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860PCVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860PVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MPC860SRCVR66D4 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
| MC908AZ60ACFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| TDA8035HN/C1/S1EL |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 2.7V ~ 5.5V
Supplier Device Package: 32-HVQFN (5x5)
Produkt ist nicht verfügbar
| 74HC163D,653 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC 4BIT BINAR COUNT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
Description: IC SYNC 4BIT BINAR COUNT 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
auf Bestellung 20913 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2613+ | 0.18 EUR |
| 74HC163PW,118 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC 4BIT BINAR COUNT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
Description: IC SYNC 4BIT BINAR COUNT 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
auf Bestellung 14498 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2676+ | 0.18 EUR |
| 74HC163DB,112 |
|
Hersteller: NXP USA Inc.
Description: IC SYNC 4BIT BINAR COUNTR 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
Description: IC SYNC 4BIT BINAR COUNTR 16SSOP
Packaging: Bulk
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Synchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 55 MHz
Number of Bits per Element: 4
auf Bestellung 4890 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 958+ | 0.5 EUR |
| UJA1075ATW/5V0/WDJ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2000+ | 4.23 EUR |
| UJA1075ATW/5V0/WDJ |
|
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 4.5V ~ 28V
Supplier Device Package: 32-HTSSOP
Grade: Automotive
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.43 EUR |
| 10+ | 7.58 EUR |
| 25+ | 7.16 EUR |
| 100+ | 6.21 EUR |
| 250+ | 5.89 EUR |
| 500+ | 5.29 EUR |
| 1000+ | 4.46 EUR |
| MRFE6S9060GNR1 |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270BB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4 Gull
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| MRFE6S9200HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
| UJA1132AHW/3F4/0Y |
|
Produkt ist nicht verfügbar
| S9S12ZVL32AWLF |
Produkt ist nicht verfügbar
| UJA1132AHW/5F0/0Y |
|
Produkt ist nicht verfügbar
| UJA1131AHW/5F4/0Y |
|
Produkt ist nicht verfügbar
| UJA1131AHW/3F4/0Y |
|
Produkt ist nicht verfügbar
| MC33FS6505KAE |
|
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| LS1043ABE9MQB |
|
Hersteller: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A53
Packaging: Tray
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Description: LAYERSCAPE 64-BIT ARM CORTEX-A53
Packaging: Tray
Package / Case: 780-BFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2)
USB: USB 3.0 + PHY (3)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: ARM TZ, Boot Security
SATA: SATA 6Gbps (1)
Additional Interfaces: eMMC/SD/SDIO, I2C, SPI, UART
Produkt ist nicht verfügbar
| P2010NXN2KHC |
|
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
| MC100ES6111AC |
|
Hersteller: NXP USA Inc.
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Description: IC CLK BUFFER 2:10 2.7GHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: ECL, PECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: ECL, HSTL, PECL
Operating Temperature: -40°C ~ 110°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:10
Differential - Input:Output: Yes/Yes
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 2.7 GHz
Produkt ist nicht verfügbar
| MKL27Z128VFM4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HUQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HUQFN (5x5)
Number of I/O: 23
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MPF5020AVNA0ESR2 |
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| MPF5020CMBA0ESR2 |
|
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| S9S12G128J0CLLR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: IC MCU 16BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Produkt ist nicht verfügbar
| S912ZVC12AMLFR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
Produkt ist nicht verfügbar
| S912ZVMC12AWKHR |
Hersteller: NXP USA Inc.
Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Description: S12Z CORE,128K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
Produkt ist nicht verfügbar
| MC9S08GT32ACFDER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 74LVC2G53GF,115 |
|
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 500nA
Number of Circuits: 1
Description: IC SWITCH SPDT X 1 10OHM 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 10Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 8-XSON (1.35x1)
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 3.8ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 500nA
Number of Circuits: 1
auf Bestellung 101525 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1880+ | 0.25 EUR |
| BZX79-C7V5,113 |
|
auf Bestellung 458840 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 13172+ | 0.032 EUR |
| 74LVC1G14GN,132 |
|
Hersteller: NXP USA Inc.
Description: IC INVERT SCHMITT 1CH 1INP 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.14V ~ 2.79V
Input Logic Level - Low: 0.46V ~ 1.58V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
Description: IC INVERT SCHMITT 1CH 1INP 6XSON
Features: Schmitt Trigger
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (0.9x1)
Input Logic Level - High: 1.14V ~ 2.79V
Input Logic Level - Low: 0.46V ~ 1.58V
Max Propagation Delay @ V, Max CL: 6.5ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 166794 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2882+ | 0.16 EUR |