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MGD3140AM515EKR2 NXP USA Inc. Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MGD3140AM515EKT NXP USA Inc. Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
MC68340CAB16E MC68340CAB16E NXP USA Inc. FSCLS06741-1.pdf?t.download=true&u=5oefqw Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
5+111.95 EUR
Mindestbestellmenge: 5
T2080NSE8PTB NXP USA Inc. T2081.pdf Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
2+405.33 EUR
Mindestbestellmenge: 2
PHD13003C,126 PHD13003C,126 NXP USA Inc. PHD13003C.pdf Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
auf Bestellung 22000 Stücke:
Lieferzeit 10-14 Tag (e)
3852+0.13 EUR
Mindestbestellmenge: 3852
TJA1021ATK/0J TJA1021ATK/0J NXP USA Inc. TJA1021.pdf Description: TJA1021ATK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1021BTK/0J TJA1021BTK/0J NXP USA Inc. TJA1021.pdf Description: TJA1021BTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028DTK/0J NXP USA Inc. TJA1028.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028ATK/0J NXP USA Inc. TJA1028.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028BTK/0J NXP USA Inc. TJA1028.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028CTK/0J NXP USA Inc. TJA1028.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MRFE6P3300HR3 NXP USA Inc. MRFE6P3300HR3,HR5.pdf Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
1+632.1 EUR
PZU24B3A,115 PZU24B3A,115 NXP USA Inc. PZUXBA_SER.pdf Description: SINGLE ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
auf Bestellung 49600 Stücke:
Lieferzeit 10-14 Tag (e)
12488+0.033 EUR
Mindestbestellmenge: 12488
NT2L1011G0DUDZ NXP USA Inc. NTAG210_212.pdf Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
FS32K148HFT0VLQR FS32K148HFT0VLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9420AUKZ NXP USA Inc. Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Produkt ist nicht verfügbar
74HCT257D,652 74HCT257D,652 NXP USA Inc. 74HC_HCT257.pdf Description: IC MULTIPLEX QUAD 2IN 3ST 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 21243 Stücke:
Lieferzeit 10-14 Tag (e)
1472+0.33 EUR
Mindestbestellmenge: 1472
FXPS71407ST1 FXPS71407ST1 NXP USA Inc. FXPS71407S.pdf Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
S9S08DV32F2MLHR NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q204Y NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2040
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q500Y NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5002
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q200K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2002
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q224K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2240
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q500K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5002
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q204K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2040
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q233Y NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2331
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q23AY NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2332
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q233K NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2331
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q23AK NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q2332
Packaging: Tray
Produkt ist nicht verfügbar
FXLS93421AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: 2 AXIS MED/LOW XZ PSI5 3.0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
FXPS71407T1 NXP USA Inc. FXPS71407.pdf Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
MCIMX233CJM4C MCIMX233CJM4C NXP USA Inc. FLYRIMXPRDCMPR.pdf Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
MC33FS6510NAE MC33FS6510NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
QN9030THN/001Y QN9030THN/001Y NXP USA Inc. QN9090(T)QN9030(T).pdf Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.32 EUR
10+ 7.44 EUR
25+ 6.7 EUR
100+ 6.1 EUR
250+ 5.51 EUR
500+ 4.94 EUR
1000+ 4.17 EUR
Mindestbestellmenge: 3
MC68HC908JL8CSPE MC68HC908JL8CSPE NXP USA Inc. MC68HC908JL8.pdf Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT245DB,118 74HCT245DB,118 NXP USA Inc. 74HC_HCT245.pdf Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
auf Bestellung 7135 Stücke:
Lieferzeit 10-14 Tag (e)
1401+0.33 EUR
Mindestbestellmenge: 1401
NX30P6093AUKAZ NXP USA Inc. NX30P6093A.pdf Description: HIGH-VOLTAGE I2C CONTROLLED OVER
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 16mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 5.6A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Produkt ist nicht verfügbar
FS32K144MAT0CMHT FS32K144MAT0CMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MRFX1K80H-230MHZ MRFX1K80H-230MHZ NXP USA Inc. MRFX1K80H.pdf Description: MRFX1K80H REF BRD 230MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MCF51JM128VLKR MCF51JM128VLKR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+16.01 EUR
Mindestbestellmenge: 1000
MCF51JM128VLKR MCF51JM128VLKR NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.27 EUR
10+ 20.2 EUR
100+ 17.06 EUR
500+ 16.95 EUR
MK10DX32VLH5 MK10DX32VLH5 NXP USA Inc. K10P64M50SF0.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TJA1103BHN/0J NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Produkt ist nicht verfügbar
MF3D23C0DA8/00J NXP USA Inc. Description: MF3D23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D23C0DA4/00J NXP USA Inc. Description: MF3D23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3DH4300DA8/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
CBT3245ADS,112 CBT3245ADS,112 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
MCIMX6D6AVT08AC MCIMX6D6AVT08AC NXP USA Inc. IMX6DQIEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
PHE13003C,412 NXP USA Inc. phe13003c.pdf Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
3826+0.13 EUR
Mindestbestellmenge: 3826
BUK9511-55A,127 BUK9511-55A,127 NXP USA Inc. PHGLS22311-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Ta)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 4230 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1368 Stücke:
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634+0.77 EUR
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P3T1755DP/Q900Z P3T1755DP/Q900Z NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
Produkt ist nicht verfügbar
P3T1755DP/Q900Z P3T1755DP/Q900Z NXP USA Inc. P3T1755.pdf Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 516 Stücke:
Lieferzeit 10-14 Tag (e)
16+1.16 EUR
18+ 1.03 EUR
25+ 0.99 EUR
50+ 0.95 EUR
100+ 0.92 EUR
250+ 0.88 EUR
500+ 0.85 EUR
Mindestbestellmenge: 16
BT151U-650C,127 NXP USA Inc. bt151u-800c.pdf Description: THYRISTOR 650V 12A SOT533
Packaging: Bulk
auf Bestellung 3750 Stücke:
Lieferzeit 10-14 Tag (e)
994+0.47 EUR
Mindestbestellmenge: 994
WCT-15WAUTOS2 NXP USA Inc. Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MF3DH8300DA4/00J NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MC9S08AC16CFJER MC9S08AC16CFJER NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+5.58 EUR
Mindestbestellmenge: 2000
MC9S08AC16CFJER MC9S08AC16CFJER NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.59 EUR
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100+ 7.04 EUR
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500+ 6.08 EUR
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TEA18361LT/2J TEA18361LT/2J NXP USA Inc. Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Produkt ist nicht verfügbar
TEA18361T/2J TEA18361T/2J NXP USA Inc. Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
Produkt ist nicht verfügbar
MK40DX256VMC7 MK40DX256VMC7 NXP USA Inc. K40P100M72SF1.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MGD3140AM515EKR2
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
MGD3140AM515EKT
Hersteller: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
MC68340CAB16E FSCLS06741-1.pdf?t.download=true&u=5oefqw
MC68340CAB16E
Hersteller: NXP USA Inc.
Description: MICROPROCESSOR, 32-BIT, MC68000
Packaging: Bulk
auf Bestellung 30 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+111.95 EUR
Mindestbestellmenge: 5
T2080NSE8PTB T2081.pdf
Hersteller: NXP USA Inc.
Description: QORIQ, 64B POWER ARCH, 8X 1.5GHZ
Packaging: Bulk
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+405.33 EUR
Mindestbestellmenge: 2
PHD13003C,126 PHD13003C.pdf
PHD13003C,126
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
auf Bestellung 22000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3852+0.13 EUR
Mindestbestellmenge: 3852
TJA1021ATK/0J TJA1021.pdf
TJA1021ATK/0J
Hersteller: NXP USA Inc.
Description: TJA1021ATK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1021BTK/0J TJA1021.pdf
TJA1021BTK/0J
Hersteller: NXP USA Inc.
Description: TJA1021BTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028DTK/0J TJA1028.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028ATK/0J TJA1028.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028BTK/0J TJA1028.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
TJA1028CTK/0J TJA1028.pdf
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3.234V ~ 3.366V, 4.9V ~ 5.1V
Number of Drivers/Receivers: 1/1
Data Rate: 10.4kBaud
Protocol: LIN
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 200 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
MRFE6P3300HR3 MRFE6P3300HR3,HR5.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
auf Bestellung 82 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+632.1 EUR
PZU24B3A,115 PZUXBA_SER.pdf
PZU24B3A,115
Hersteller: NXP USA Inc.
Description: SINGLE ZENER DIODE
Tolerance: ±2%
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
auf Bestellung 49600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
12488+0.033 EUR
Mindestbestellmenge: 12488
NT2L1011G0DUDZ NTAG210_212.pdf
Hersteller: NXP USA Inc.
Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
FS32K148HFT0VLQR S32K1xx.pdf
FS32K148HFT0VLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9420AUKZ
Hersteller: NXP USA Inc.
Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Produkt ist nicht verfügbar
74HCT257D,652 74HC_HCT257.pdf
74HCT257D,652
Hersteller: NXP USA Inc.
Description: IC MULTIPLEX QUAD 2IN 3ST 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
auf Bestellung 21243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1472+0.33 EUR
Mindestbestellmenge: 1472
FXPS71407ST1 FXPS71407S.pdf
FXPS71407ST1
Hersteller: NXP USA Inc.
Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
S9S08DV32F2MLHR MC9S08DV60.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q204Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2040
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q500Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5002
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q200K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2002
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q224K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2240
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q500K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5002
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q204K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2040
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q233Y
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2331
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q23AY
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2332
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF4000EL/101Q233K
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2331
Packaging: Tray
Produkt ist nicht verfügbar
SAF4000EL/101Q23AK
Hersteller: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q2332
Packaging: Tray
Produkt ist nicht verfügbar
FXLS93421AESR2 FXLS9xxxx.pdf
Hersteller: NXP USA Inc.
Description: 2 AXIS MED/LOW XZ PSI5 3.0
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
FXPS71407T1 FXPS71407.pdf
Hersteller: NXP USA Inc.
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Produkt ist nicht verfügbar
MCIMX233CJM4C FLYRIMXPRDCMPR.pdf
MCIMX233CJM4C
Hersteller: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Produkt ist nicht verfügbar
MC33FS6510NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6510NAE
Hersteller: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Produkt ist nicht verfügbar
QN9030THN/001Y QN9090(T)QN9030(T).pdf
QN9030THN/001Y
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.32 EUR
10+ 7.44 EUR
25+ 6.7 EUR
100+ 6.1 EUR
250+ 5.51 EUR
500+ 4.94 EUR
1000+ 4.17 EUR
Mindestbestellmenge: 3
MC68HC908JL8CSPE MC68HC908JL8.pdf
MC68HC908JL8CSPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT245DB,118 74HC_HCT245.pdf
74HCT245DB,118
Hersteller: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Bulk
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
auf Bestellung 7135 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1401+0.33 EUR
Mindestbestellmenge: 1401
NX30P6093AUKAZ NX30P6093A.pdf
Hersteller: NXP USA Inc.
Description: HIGH-VOLTAGE I2C CONTROLLED OVER
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 16mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 5.6A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Produkt ist nicht verfügbar
FS32K144MAT0CMHT S32K1xx.pdf
FS32K144MAT0CMHT
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MRFX1K80H-230MHZ MRFX1K80H.pdf
MRFX1K80H-230MHZ
Hersteller: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
MCF51JM128VLKR MCF51JM128.pdf
MCF51JM128VLKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+16.01 EUR
Mindestbestellmenge: 1000
MCF51JM128VLKR MCF51JM128.pdf
MCF51JM128VLKR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+25.27 EUR
10+ 20.2 EUR
100+ 17.06 EUR
500+ 16.95 EUR
MK10DX32VLH5 K10P64M50SF0.pdf
MK10DX32VLH5
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
TJA1103BHN/0J
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Produkt ist nicht verfügbar
MF3D23C0DA8/00J
Hersteller: NXP USA Inc.
Description: MF3D23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3D23C0DA4/00J
Hersteller: NXP USA Inc.
Description: MF3D23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MF3DH4300DA8/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
CBT3245ADS,112 CBT3245A.pdf
CBT3245ADS,112
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
MCIMX6D6AVT08AC IMX6DQIEC.pdf
MCIMX6D6AVT08AC
Hersteller: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Produkt ist nicht verfügbar
PHE13003C,412 phe13003c.pdf
Hersteller: NXP USA Inc.
Description: TRANS NPN 400V 1.5A SOT54
Packaging: Bulk
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3826+0.13 EUR
Mindestbestellmenge: 3826
BUK9511-55A,127 PHGLS22311-1.pdf?t.download=true&u=5oefqw
BUK9511-55A,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Ta)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 166W (Ta)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Vgs (Max): ±10V
Drain to Source Voltage (Vdss): 55 V
Input Capacitance (Ciss) (Max) @ Vds: 4230 pF @ 25 V
Qualification: AEC-Q101
auf Bestellung 1368 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
634+0.77 EUR
Mindestbestellmenge: 634
P3T1755DP/Q900Z P3T1755.pdf
P3T1755DP/Q900Z
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
Produkt ist nicht verfügbar
P3T1755DP/Q900Z P3T1755.pdf
P3T1755DP/Q900Z
Hersteller: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
auf Bestellung 516 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
16+1.16 EUR
18+ 1.03 EUR
25+ 0.99 EUR
50+ 0.95 EUR
100+ 0.92 EUR
250+ 0.88 EUR
500+ 0.85 EUR
Mindestbestellmenge: 16
BT151U-650C,127 bt151u-800c.pdf
Hersteller: NXP USA Inc.
Description: THYRISTOR 650V 12A SOT533
Packaging: Bulk
auf Bestellung 3750 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
994+0.47 EUR
Mindestbestellmenge: 994
WCT-15WAUTOS2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
MF3DH8300DA4/00J MF3D_H_X3_SDS.pdf
Hersteller: NXP USA Inc.
Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Produkt ist nicht verfügbar
MC9S08AC16CFJER MC9S08AC16.pdf
MC9S08AC16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2000+5.58 EUR
Mindestbestellmenge: 2000
MC9S08AC16CFJER MC9S08AC16.pdf
MC9S08AC16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+13.59 EUR
10+ 9.36 EUR
25+ 8.26 EUR
100+ 7.04 EUR
250+ 6.45 EUR
500+ 6.08 EUR
1000+ 5.78 EUR
Mindestbestellmenge: 2
TEA18361LT/2J
TEA18361LT/2J
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Produkt ist nicht verfügbar
TEA18361T/2J
TEA18361T/2J
Hersteller: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
Produkt ist nicht verfügbar
MK40DX256VMC7 K40P100M72SF1.pdf
MK40DX256VMC7
Hersteller: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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