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74AHCT573D,112 74AHCT573D,112 NXP USA Inc. PHGLS23757-1.pdf?t.download=true&u=5oefqw Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Delay Time - Propagation: 3.5ns
Supplier Device Package: 20-SO
auf Bestellung 1733 Stücke:
Lieferzeit 10-14 Tag (e)
1250+0.39 EUR
Mindestbestellmenge: 1250
PMDPB56XN,115 PMDPB56XN,115 NXP USA Inc. PMDPB56XN.pdf Description: MOSFET 2N-CH 30V 3.1A 6HUSON
Packaging: Bulk
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.1A
Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V
Rds On (Max) @ Id, Vgs: 73mOhm @ 3.1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
auf Bestellung 54000 Stücke:
Lieferzeit 10-14 Tag (e)
1332+0.38 EUR
Mindestbestellmenge: 1332
MC32PF3001A7EPR2 MC32PF3001A7EPR2 NXP USA Inc. PF3001.pdf Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
S912ZVCA19A1WKHR NXP USA Inc. Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S912ZVCA19A1WKH NXP USA Inc. Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
SAF775CHN/N208W/MP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775CHN/N208W/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
BZV55-C47,115 NXP USA Inc. BZV55_SER.pdf Description: DIODE ZENER 47V 500MW LLDS
Packaging: Bulk
auf Bestellung 16970 Stücke:
Lieferzeit 10-14 Tag (e)
MPC8260ACZUMHBB MPC8260ACZUMHBB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MIMX9121DVVXCAA NXP USA Inc. Description: MIMX9121DVVXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9121CVVXCAA NXP USA Inc. Description: MIMX9121CVVXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
T1024NSN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
BYV25D-600,118 BYV25D-600,118 NXP USA Inc. BYV25D-600.pdf Description: DIODE RECT 600V 5A DPAK
Packaging: Bulk
auf Bestellung 76500 Stücke:
Lieferzeit 10-14 Tag (e)
859+0.57 EUR
Mindestbestellmenge: 859
BYV25FX-600,127 BYV25FX-600,127 NXP USA Inc. PHGLS22516-1.pdf?t.download=true&u=5oefqw Description: DIODE GEN PURP 600V 5A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 35 ns
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 5 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 4228 Stücke:
Lieferzeit 10-14 Tag (e)
900+0.54 EUR
Mindestbestellmenge: 900
LPC11E14FBD64/401, LPC11E14FBD64/401, NXP USA Inc. LPC11E1X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.82 EUR
10+ 6.63 EUR
25+ 5.8 EUR
Mindestbestellmenge: 2
MKE14Z64VLF4R NXP USA Inc. KE1xZP48M48SF0.pdf Description: MT64P 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.29 EUR
10+ 5.7 EUR
100+ 4.67 EUR
500+ 4.57 EUR
1000+ 3.85 EUR
Mindestbestellmenge: 3
MKE14F512VLL16R MKE14F512VLL16R NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+10.33 EUR
Mindestbestellmenge: 1000
MKE14F512VLL16R MKE14F512VLL16R NXP USA Inc. KE1xFP100M168SF0.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.22 EUR
10+ 14.31 EUR
100+ 11.85 EUR
TJA1104AHN/0J NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S9S08SG16E1CTJR S9S08SG16E1CTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
133+3.57 EUR
Mindestbestellmenge: 133
74LVC1G27GV,125 74LVC1G27GV,125 NXP USA Inc. PHGLS24395-1.pdf?t.download=true&u=5oefqw Description: IC GATE NOR 1CH 3-INP 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
7322+0.066 EUR
Mindestbestellmenge: 7322
AFM912NT1 NXP USA Inc. AFM912N.pdf Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
Produkt ist nicht verfügbar
PDTC114EK,115 PDTC114EK,115 NXP USA Inc. PHGLS12984-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS NPN
Packaging: Bulk
auf Bestellung 53500 Stücke:
Lieferzeit 10-14 Tag (e)
8876+0.049 EUR
Mindestbestellmenge: 8876
MC9RS08LA8CLF MC9RS08LA8CLF NXP USA Inc. MC9RS08LA8.pdf Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BTA2008-600E,412 BTA2008-600E,412 NXP USA Inc. PHGLS25735-1.pdf?t.download=true&u=5oefqw Description: TRIAC SENS GATE 600V 0.8A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 9A, 10A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 800 mA
Voltage - Off State: 600 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
1799+0.27 EUR
Mindestbestellmenge: 1799
BTA202X-800E,127 BTA202X-800E,127 NXP USA Inc. PHGLS29731-1.pdf?t.download=true&u=5oefqw Description: TRIAC SENS GATE 800V 2A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 2 A
Voltage - Off State: 800 V
auf Bestellung 12693 Stücke:
Lieferzeit 10-14 Tag (e)
994+0.47 EUR
Mindestbestellmenge: 994
MC9S08AC8CFJE MC9S08AC8CFJE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.13 EUR
10+ 9.52 EUR
80+ 7.88 EUR
1250+ 6.88 EUR
Mindestbestellmenge: 2
PEMI4QFN/LK,132 PEMI4QFN/LK,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 72000 Stücke:
Lieferzeit 10-14 Tag (e)
2959+0.16 EUR
Mindestbestellmenge: 2959
MFS2611AMBA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2632AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2611AMBA0AD NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2632AMDA0AD NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
BTA204W-600F,135 BTA204W-600F,135 NXP USA Inc. BTA204W-600F.pdf Description: TRIAC 600V 1A SC73
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
1302+0.36 EUR
Mindestbestellmenge: 1302
MC9328MX1DVH20 MC9328MX1DVH20 NXP USA Inc. MC9328MX1.pdf Description: IC MPU I.MX1 200MHZ 256BGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 256-PBGA (14x14)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
PCA9674APW,112 PCA9674APW,112 NXP USA Inc. PCA9674%28A%29_Rev7.pdf Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 452 Stücke:
Lieferzeit 10-14 Tag (e)
452+1.3 EUR
Mindestbestellmenge: 452
CBT3245ADS,118 CBT3245ADS,118 NXP USA Inc. CBT3245A.pdf Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
PHP18NQ11T,127 PHP18NQ11T,127 NXP USA Inc. PHP18NQ11T.pdf Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
Lieferzeit 10-14 Tag (e)
454+1.08 EUR
Mindestbestellmenge: 454
P1010NSE5DFA P1010NSE5DFA NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
74AUP2G58GFX 74AUP2G58GFX NXP USA Inc. 74AUP2G58.pdf Description: MAJORITY LOGIC GATE, AUP/ULP/V S
Packaging: Bulk
Package / Case: 10-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 10-XSON (1.7x1)
Number of Circuits: 2
auf Bestellung 95000 Stücke:
Lieferzeit 10-14 Tag (e)
3593+0.13 EUR
Mindestbestellmenge: 3593
74AUP2G157GD,125 74AUP2G157GD,125 NXP USA Inc. PHGLS25967-1.pdf?t.download=true&u=5oefqw Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 8-XSON (2x3)
auf Bestellung 93975 Stücke:
Lieferzeit 10-14 Tag (e)
2664+0.17 EUR
Mindestbestellmenge: 2664
MK50DX256CLK10 MK50DX256CLK10 NXP USA Inc. K50PB.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
1+27.67 EUR
10+ 19.93 EUR
25+ 17.95 EUR
96+ 15.78 EUR
MC33596FCE MC33596FCE NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Produkt ist nicht verfügbar
BZV55-C11,135 BZV55-C11,135 NXP USA Inc. PHGLS22257-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZV55-C11 - ZENER D
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 160000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
AFT18HW355SR5 AFT18HW355SR5 NXP USA Inc. AFT18HW355SR6.pdf Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 63W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
MKE02Z64VFM4R NXP USA Inc. MKE02P64M40SF0.pdf Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.1 EUR
10+ 4.64 EUR
25+ 4.53 EUR
50+ 4.51 EUR
100+ 4.04 EUR
250+ 4.03 EUR
500+ 3.88 EUR
1000+ 3.69 EUR
Mindestbestellmenge: 4
74LV373PW,112 74LV373PW,112 NXP USA Inc. 74LV373.pdf Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
Produkt ist nicht verfügbar
MFS2303BMBA3EPR2 MFS2303BMBA3EPR2 NXP USA Inc. FS23_SBC.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MFS2620AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2611AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MPF7100BMBA0ESR2 MPF7100BMBA0ESR2 NXP USA Inc. PF7100.pdf Description: POWER MANAGEMENT IC, I.MX 8, I.M
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PDTA143EM,315 PDTA143EM,315 NXP USA Inc. PDTA143E_SERIES_7.pdf Description: TRANS PNP W/RES 50V SOT-883
Packaging: Bulk
auf Bestellung 189945 Stücke:
Lieferzeit 10-14 Tag (e)
11871+0.049 EUR
Mindestbestellmenge: 11871
PDTA143ZE,115 PDTA143ZE,115 NXP USA Inc. PDTA143Z_SER.pdf Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
6662+0.081 EUR
Mindestbestellmenge: 6662
C9KEAZN16AMLCR NXP USA Inc. Description: IC
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Produkt ist nicht verfügbar
MPC8360VVAGDGA MPC8360VVAGDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
74HCT138DB,112 74HCT138DB,112 NXP USA Inc. 74HC_HCT138.pdf Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 51489 Stücke:
Lieferzeit 10-14 Tag (e)
1705+0.29 EUR
Mindestbestellmenge: 1705
MPX2202ASX MPX2202ASX NXP USA Inc. MPX2202.pdf Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
MPX2202A MPX2202A NXP USA Inc. MPX2202.pdf description Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
PDTA114TE,115 PDTA114TE,115 NXP USA Inc. PHGLS14726-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 84000 Stücke:
Lieferzeit 10-14 Tag (e)
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA114YMB,315 PDTA114YMB,315 NXP USA Inc. PHGLS24659-1.pdf?t.download=true&u=5oefqw Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 90000 Stücke:
Lieferzeit 10-14 Tag (e)
11225+0.047 EUR
Mindestbestellmenge: 11225
LFTAK46MQL3A NXP USA Inc. Description: 208 1.0MM PGA TO 144 PIN 0.5MM E
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
74AHCT573D,112 PHGLS23757-1.pdf?t.download=true&u=5oefqw
74AHCT573D,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 8mA, 8mA
Delay Time - Propagation: 3.5ns
Supplier Device Package: 20-SO
auf Bestellung 1733 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1250+0.39 EUR
Mindestbestellmenge: 1250
PMDPB56XN,115 PMDPB56XN.pdf
PMDPB56XN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 3.1A 6HUSON
Packaging: Bulk
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.1A
Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V
Rds On (Max) @ Id, Vgs: 73mOhm @ 3.1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
auf Bestellung 54000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1332+0.38 EUR
Mindestbestellmenge: 1332
MC32PF3001A7EPR2 PF3001.pdf
MC32PF3001A7EPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
S912ZVCA19A1WKHR
Hersteller: NXP USA Inc.
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S912ZVCA19A1WKH
Hersteller: NXP USA Inc.
Description: S12Z, 64LQFP-EP, 192K FLASH
Packaging: Tray
Produkt ist nicht verfügbar
SAF775CHN/N208W/MP
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
SAF775CHN/N208W/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Produkt ist nicht verfügbar
BZV55-C47,115 BZV55_SER.pdf
Hersteller: NXP USA Inc.
Description: DIODE ZENER 47V 500MW LLDS
Packaging: Bulk
auf Bestellung 16970 Stücke:
Lieferzeit 10-14 Tag (e)
MPC8260ACZUMHBB MPC8260A.pdf
MPC8260ACZUMHBB
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
MIMX9121DVVXCAA
Hersteller: NXP USA Inc.
Description: MIMX9121DVVXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
MIMX9121CVVXCAA
Hersteller: NXP USA Inc.
Description: MIMX9121CVVXCAA
Packaging: Bulk
Produkt ist nicht verfügbar
T1024NSN7KQA T1024FS.pdf
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Produkt ist nicht verfügbar
BYV25D-600,118 BYV25D-600.pdf
BYV25D-600,118
Hersteller: NXP USA Inc.
Description: DIODE RECT 600V 5A DPAK
Packaging: Bulk
auf Bestellung 76500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
859+0.57 EUR
Mindestbestellmenge: 859
BYV25FX-600,127 PHGLS22516-1.pdf?t.download=true&u=5oefqw
BYV25FX-600,127
Hersteller: NXP USA Inc.
Description: DIODE GEN PURP 600V 5A TO220F
Packaging: Bulk
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 35 ns
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: TO-220F
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 5 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 4228 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
900+0.54 EUR
Mindestbestellmenge: 900
LPC11E14FBD64/401, LPC11E1X.pdf
LPC11E14FBD64/401,
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+9.82 EUR
10+ 6.63 EUR
25+ 5.8 EUR
Mindestbestellmenge: 2
MKE14Z64VLF4R KE1xZP48M48SF0.pdf
Hersteller: NXP USA Inc.
Description: MT64P 48LQFP
Packaging: Cut Tape (CT)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.29 EUR
10+ 5.7 EUR
100+ 4.67 EUR
500+ 4.57 EUR
1000+ 3.85 EUR
Mindestbestellmenge: 3
MKE14F512VLL16R KE1xFP100M168SF0.pdf
MKE14F512VLL16R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+10.33 EUR
Mindestbestellmenge: 1000
MKE14F512VLL16R KE1xFP100M168SF0.pdf
MKE14F512VLL16R
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+18.22 EUR
10+ 14.31 EUR
100+ 11.85 EUR
TJA1104AHN/0J
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
S9S08SG16E1CTJR MC9S08SG32.pdf
S9S08SG16E1CTJR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 35000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
133+3.57 EUR
Mindestbestellmenge: 133
74LVC1G27GV,125 PHGLS24395-1.pdf?t.download=true&u=5oefqw
74LVC1G27GV,125
Hersteller: NXP USA Inc.
Description: IC GATE NOR 1CH 3-INP 6TSOP
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 3
Supplier Device Package: 6-TSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.6ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
7322+0.066 EUR
Mindestbestellmenge: 7322
AFM912NT1 AFM912N.pdf
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
Produkt ist nicht verfügbar
PDTC114EK,115 PHGLS12984-1.pdf?t.download=true&u=5oefqw
PDTC114EK,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS NPN
Packaging: Bulk
auf Bestellung 53500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8876+0.049 EUR
Mindestbestellmenge: 8876
MC9RS08LA8CLF MC9RS08LA8.pdf
MC9RS08LA8CLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
BTA2008-600E,412 PHGLS25735-1.pdf?t.download=true&u=5oefqw
BTA2008-600E,412
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 0.8A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 9A, 10A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Supplier Device Package: TO-92-3
Current - On State (It (RMS)) (Max): 800 mA
Voltage - Off State: 600 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1799+0.27 EUR
Mindestbestellmenge: 1799
BTA202X-800E,127 PHGLS29731-1.pdf?t.download=true&u=5oefqw
BTA202X-800E,127
Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 800V 2A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 12 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 2 A
Voltage - Off State: 800 V
auf Bestellung 12693 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
994+0.47 EUR
Mindestbestellmenge: 994
MC9S08AC8CFJE MC9S08AC16.pdf
MC9S08AC8CFJE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.13 EUR
10+ 9.52 EUR
80+ 7.88 EUR
1250+ 6.88 EUR
Mindestbestellmenge: 2
PEMI4QFN/LK,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI4QFN/LK,132
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 72000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2959+0.16 EUR
Mindestbestellmenge: 2959
MFS2611AMBA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2632AMDA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2611AMBA0AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2632AMDA0AD PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
BTA204W-600F,135 BTA204W-600F.pdf
BTA204W-600F,135
Hersteller: NXP USA Inc.
Description: TRIAC 600V 1A SC73
Packaging: Bulk
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1302+0.36 EUR
Mindestbestellmenge: 1302
MC9328MX1DVH20 MC9328MX1.pdf
MC9328MX1DVH20
Hersteller: NXP USA Inc.
Description: IC MPU I.MX1 200MHZ 256BGA
Packaging: Tray
Package / Case: 256-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 256-PBGA (14x14)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Produkt ist nicht verfügbar
PCA9674APW,112 PCA9674%28A%29_Rev7.pdf
PCA9674APW,112
Hersteller: NXP USA Inc.
Description: IC XPNDR 1MHZ I2C 16TSSOP
Features: POR
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 1 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
auf Bestellung 452 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
452+1.3 EUR
Mindestbestellmenge: 452
CBT3245ADS,118 CBT3245A.pdf
CBT3245ADS,118
Hersteller: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
PHP18NQ11T,127 PHP18NQ11T.pdf
PHP18NQ11T,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 110V 18A TO220AB
Packaging: Bulk
auf Bestellung 663 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
454+1.08 EUR
Mindestbestellmenge: 454
P1010NSE5DFA QP1010FS.pdf
P1010NSE5DFA
Hersteller: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Produkt ist nicht verfügbar
74AUP2G58GFX 74AUP2G58.pdf
74AUP2G58GFX
Hersteller: NXP USA Inc.
Description: MAJORITY LOGIC GATE, AUP/ULP/V S
Packaging: Bulk
Package / Case: 10-XFDFN
Output Type: Single-Ended
Mounting Type: Surface Mount
Logic Type: Configurable Multiple Function
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Schmitt Trigger Input: Yes
Supplier Device Package: 10-XSON (1.7x1)
Number of Circuits: 2
auf Bestellung 95000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3593+0.13 EUR
Mindestbestellmenge: 3593
74AUP2G157GD,125 PHGLS25967-1.pdf?t.download=true&u=5oefqw
74AUP2G157GD,125
Hersteller: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Packaging: Bulk
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Circuit: 1 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 8-XSON (2x3)
auf Bestellung 93975 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2664+0.17 EUR
Mindestbestellmenge: 2664
MK50DX256CLK10 K50PB.pdf
MK50DX256CLK10
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+27.67 EUR
10+ 19.93 EUR
25+ 17.95 EUR
96+ 15.78 EUR
MC33596FCE mc33596.pdf
MC33596FCE
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Produkt ist nicht verfügbar
BZV55-C11,135 PHGLS22257-1.pdf?t.download=true&u=5oefqw
BZV55-C11,135
Hersteller: NXP USA Inc.
Description: NOW NEXPERIA BZV55-C11 - ZENER D
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AC, MINI-MELF, SOD-80
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: LLDS; MiniMelf
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8 V
auf Bestellung 160000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
AFT18HW355SR5 AFT18HW355SR6.pdf
AFT18HW355SR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 63W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
Produkt ist nicht verfügbar
MKE02Z64VFM4R MKE02P64M40SF0.pdf
Hersteller: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+5.1 EUR
10+ 4.64 EUR
25+ 4.53 EUR
50+ 4.51 EUR
100+ 4.04 EUR
250+ 4.03 EUR
500+ 3.88 EUR
1000+ 3.69 EUR
Mindestbestellmenge: 4
74LV373PW,112 74LV373.pdf
74LV373PW,112
Hersteller: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
Produkt ist nicht verfügbar
MFS2303BMBA3EPR2 FS23_SBC.pdf
MFS2303BMBA3EPR2
Hersteller: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
Produkt ist nicht verfügbar
MFS2620AMDA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MFS2611AMDA0ADR2 PB_FS26.pdf
Hersteller: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Produkt ist nicht verfügbar
MPF7100BMBA0ESR2 PF7100.pdf
MPF7100BMBA0ESR2
Hersteller: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8, I.M
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PDTA143EM,315 PDTA143E_SERIES_7.pdf
PDTA143EM,315
Hersteller: NXP USA Inc.
Description: TRANS PNP W/RES 50V SOT-883
Packaging: Bulk
auf Bestellung 189945 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11871+0.049 EUR
Mindestbestellmenge: 11871
PDTA143ZE,115 PDTA143Z_SER.pdf
PDTA143ZE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 21000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6662+0.081 EUR
Mindestbestellmenge: 6662
C9KEAZN16AMLCR
Hersteller: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Produkt ist nicht verfügbar
MPC8360VVAGDGA MPC8360E%2C8358E.pdf
MPC8360VVAGDGA
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Produkt ist nicht verfügbar
74HCT138DB,112 74HC_HCT138.pdf
74HCT138DB,112
Hersteller: NXP USA Inc.
Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
auf Bestellung 51489 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1705+0.29 EUR
Mindestbestellmenge: 1705
MPX2202ASX MPX2202.pdf
MPX2202ASX
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
MPX2202A description MPX2202.pdf
MPX2202A
Hersteller: NXP USA Inc.
Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Produkt ist nicht verfügbar
PDTA114TE,115 PHGLS14726-1.pdf?t.download=true&u=5oefqw
PDTA114TE,115
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
auf Bestellung 84000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
13172+0.032 EUR
Mindestbestellmenge: 13172
PDTA114YMB,315 PHGLS24659-1.pdf?t.download=true&u=5oefqw
PDTA114YMB,315
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 10 kOhms
Resistor - Emitter Base (R2): 47 kOhms
auf Bestellung 90000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
11225+0.047 EUR
Mindestbestellmenge: 11225
LFTAK46MQL3A
Hersteller: NXP USA Inc.
Description: 208 1.0MM PGA TO 144 PIN 0.5MM E
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Produkt ist nicht verfügbar
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