Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 447 nach 591
Foto | Bezeichnung | Hersteller | Beschreibung |
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SP5748GSK0AMMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 |
Produkt ist nicht verfügbar |
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SP5748GHK0AMMJ6R | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA |
Produkt ist nicht verfügbar |
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SP5748GSK0AVMJ2R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5748GBK0AVMJ6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tape & Reel (TR) Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5748GBK0AMMN6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA Packaging: Tape & Reel (TR) Package / Case: 324-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 324-MAPBGA (19x19) Number of I/O: 246 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5748GTK0AMKU6R | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLASH 176LQFP Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 176-LQFP (24x24) Part Status: Active Number of I/O: 129 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SP5748GHK0AMMN6R | NXP USA Inc. | Description: IC MCU 32BIT 6MB FLASH 324MAPBGA |
Produkt ist nicht verfügbar |
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TEA2017DK1002 | NXP USA Inc. |
Description: TEA2017AAT PROGRAM BOARD Packaging: Bulk For Use With/Related Products: TEA2017 Type: Programmer Contents: Board(s) Part Status: Active |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI2QFN/HP,115 | NXP USA Inc. | Description: FILTER RC(PI) 45 OHM/18.5PF SMD |
auf Bestellung 15000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI4QFN/HP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/18.5PF SMD Packaging: Bulk Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 4 |
auf Bestellung 28000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI6QFN/HP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/18.5PF SMD Packaging: Bulk Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Part Status: Obsolete Number of Channels: 6 |
auf Bestellung 16000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI1QFN/HP,315 | NXP USA Inc. | Description: FILTER RC(PI) 45 OHM/18.5PF SMD |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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PEMI8QFN/HP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHM/18.5PF SMD Packaging: Bulk Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 18.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 17dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 8 |
auf Bestellung 24000 Stücke: Lieferzeit 10-14 Tag (e) |
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NT2H1611G0DUFV | NXP USA Inc. | Description: IC RFID READR/TRAN 13.56MZ WAFER |
Produkt ist nicht verfügbar |
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MC56F81866VLF | NXP USA Inc. |
Description: IC DSC 128KB/20KB LQPF48 Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: I²C, SCI, SPI Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
Produkt ist nicht verfügbar |
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SCC2698BC1A84 | NXP USA Inc. |
Description: OCTAL UART Packaging: Bulk Features: Configurable GPIO, Internal Oscillator, Timer/Counter Package / Case: 84-LCC (J-Lead) Number of Channels: 8 Mounting Type: Surface Mount Voltage - Supply: 5V Protocol: RS485 Supplier Device Package: 84-PLCC (29.26x29.26) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes Part Status: Active |
Produkt ist nicht verfügbar |
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SPC5673KAVJM1R | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5673KAVJM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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NT2H1311F0DTL125 | NXP USA Inc. | Description: NFC FORUM TYPE 2 TAG COMPLIANT I |
Produkt ist nicht verfügbar |
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NT2H1311TTDUDZ | NXP USA Inc. |
Description: IC RFID READR/TRAN 13.56MZ WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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NT2H1311G0DUFV | NXP USA Inc. | Description: IC RFID READR/TRAN 13.56MZ WAFER |
Produkt ist nicht verfügbar |
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NT2H1311TTDUFZ | NXP USA Inc. |
Description: IC RFID READR/TRAN 13.56MZ WAFER Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, NFC Supplier Device Package: Wafer |
Produkt ist nicht verfügbar |
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SPC5607BK0MLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 |
Produkt ist nicht verfügbar |
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PEMI8QFN/WM,132 | NXP USA Inc. | Description: FILTER RC(PI) 200 OHM/16PF SMD |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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SPC5748CSK0AVMJ2 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz, 120MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 48x10b, 16x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SPC5607BK0MLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 7x10b, 5x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Part Status: Active Number of I/O: 77 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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UJA1169ATK/FZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Active |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/FZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Active |
auf Bestellung 7080 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATKZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 9000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATKZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 11800 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/F/3Z | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/F/3Z | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 5798 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/3Z | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
Produkt ist nicht verfügbar |
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UJA1169ATK/3Z | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 2965 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/XZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
Produkt ist nicht verfügbar |
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UJA1169ATK/XZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
auf Bestellung 2845 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/X/FZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Tape & Reel (TR) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Active |
auf Bestellung 3000 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/X/FZ | NXP USA Inc. |
Description: IC MINI-CAN SYSTEM BASIS CHIP Packaging: Cut Tape (CT) Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN, SPI Voltage - Supply: 3V ~ 28V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) Part Status: Active |
auf Bestellung 4880 Stücke: Lieferzeit 10-14 Tag (e) |
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UJA1169ATK/F/3 | NXP USA Inc. |
Description: IC SBC CAN HIGH SPEED 20HVSON Packaging: Bulk Package / Case: 20-VFDFN Exposed Pad Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5V Applications: System Basis Chip Supplier Device Package: 20-HVSON (3.5x5.5) |
Produkt ist nicht verfügbar |
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T4241NXN7PQB | NXP USA Inc. | Description: QORIQ 64B POWER 24X 1.5GHZ THR |
Produkt ist nicht verfügbar |
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MCW68332A | NXP USA Inc. | Description: 32BIT MCU2KRAMTPUQSM |
Produkt ist nicht verfügbar |
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MC56F8247VLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 48KB (24K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 16x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 54 DigiKey Programmable: Not Verified |
auf Bestellung 600 Stücke: Lieferzeit 10-14 Tag (e) |
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PFXPS7140D4T1 | NXP USA Inc. | Description: PRESSURE SATELLITE, 40-140 KPA, |
Produkt ist nicht verfügbar |
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S9S12VR48F2VLCR | NXP USA Inc. | Description: IC MCU 16BIT 48KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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A2I09VD015NR1 | NXP USA Inc. |
Description: IC AMP GPS 575MHZ-960MHZ TO270WB Packaging: Tape & Reel (TR) Package / Case: TO-270-15 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 575MHz ~ 960MHz RF Type: General Purpose Voltage - Supply: 48V ~ 55V Gain: 34dB Current - Supply: 84mA Test Frequency: 920MHz Supplier Device Package: TO-270WB-15 Part Status: Last Time Buy |
Produkt ist nicht verfügbar |
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MC68HC908QT1CPE-NXP | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08 Packaging: Bulk Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-PDIP Part Status: Active Number of I/O: 5 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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SAF3560HV/V1100,55 | NXP USA Inc. |
Description: IC DGTL RADIO PROCESSOR 144HLQFP Packaging: Tray Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Interface: I²C, I²S, SPI, UART Type: Digital Radio Processor Operating Temperature: -40°C ~ 85°C (TA) On-Chip RAM: 64KB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 96kHz Supplier Device Package: 144-HLQFP (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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BGA3022518 | NXP USA Inc. |
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Mounting Type: Surface Mount Frequency: 40MHz ~ 1.2GHz RF Type: CATV Voltage - Supply: 7.6V ~ 8.4V Gain: 18dB Current - Supply: 350mA Noise Figure: 5.1dB P1dB: 30dBm Test Frequency: 40MHz ~ 1.2GHz Supplier Device Package: 8-HSO |
auf Bestellung 22332 Stücke: Lieferzeit 10-14 Tag (e) |
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MD7IC2012GNR1,528 | NXP USA Inc. |
Description: IC AMP WCDMA 2.17GHZ TO270WB Packaging: Bulk Package / Case: TO-270-14 Variant, Flat Leads Mounting Type: Surface Mount Frequency: 1.805GHz ~ 2.17GHz RF Type: WCDMA Voltage - Supply: 24V ~ 32V Gain: 34.7dB Current - Supply: 70mA P1dB: 40dBm Test Frequency: 2.17GHz Supplier Device Package: TO-270WB-14 Part Status: Active |
Produkt ist nicht verfügbar |
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MC9RS08KB12CSG | NXP USA Inc. |
Description: IC MCU 8BIT 12KB FLASH 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 12KB (12K x 8) RAM Size: 254 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I²C, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-SOIC Part Status: Last Time Buy Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 86 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1G374GW-Q100125 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 1BIT 6TSSOP Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Output Type: Tri-State, Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Standard Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Current - Quiescent (Iq): 500 nA Current - Output High, Low: 4mA, 4mA Trigger Type: Positive Edge Clock Frequency: 309 MHz Input Capacitance: 0.8 pF Supplier Device Package: SOT-363 Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF Part Status: Active Number of Bits per Element: 1 |
auf Bestellung 81698 Stücke: Lieferzeit 10-14 Tag (e) |
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74AUP1Z04GW/C125 | NXP USA Inc. |
Description: BUS DRIVER, AUP/ULP/V SERIES Packaging: Bulk Package / Case: 6-TSSOP, SC-88, SOT-363 Mounting Type: Surface Mount Logic Type: Inverter, X-Tal Driver Operating Temperature: -40°C ~ 125°C Supply Voltage: 0.8V ~ 3.6V Supplier Device Package: SOT-363 |
Produkt ist nicht verfügbar |
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74AUP2G0604GW125 | NXP USA Inc. | Description: IC INVERTER OD 2CH 2-INP SOT363 |
Produkt ist nicht verfügbar |
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74AUP2G16GW125 | NXP USA Inc. | Description: IC BUFFER NON-INVERT 3.6V SOT363 |
Produkt ist nicht verfügbar |
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PCA9632DP2Z | NXP USA Inc. |
Description: IC LED DRVR PS I2C 25MA 10TSSOP Packaging: Tape & Reel (TR) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 4 Frequency: 100kHz ~ 1MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 10-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
auf Bestellung 12294 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9632DP2Z | NXP USA Inc. |
Description: IC LED DRVR PS I2C 25MA 10TSSOP Packaging: Cut Tape (CT) Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Voltage - Output: 5.5V Mounting Type: Surface Mount Number of Outputs: 4 Frequency: 100kHz ~ 1MHz Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 10-TSSOP Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
auf Bestellung 12294 Stücke: Lieferzeit 10-14 Tag (e) |
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PCA9632TK118 | NXP USA Inc. | Description: IC LED DRVR LIN DIM 25MA 8HVSON |
Produkt ist nicht verfügbar |
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MMZ27333BT1147 | NXP USA Inc. |
Description: 2 W HIGH GAIN POWER AMPLIFIER FO Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MMZ27333BT1 | NXP USA Inc. |
Description: IC AMP GPS 1.5GHZ-2.7GHZ 24HVQFN Packaging: Tape & Reel (TR) Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1.5GHz ~ 2.7GHz RF Type: General Purpose Voltage - Supply: 5V Gain: 35.8dB Current - Supply: 430mA P1dB: 32.2dBm Test Frequency: 2.14GHz Supplier Device Package: 24-HVQFN (4x4) Part Status: Active |
Produkt ist nicht verfügbar |
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NZX27B,133 | NXP USA Inc. | Description: DIODE ZENER 27V 500MW ALF2 |
auf Bestellung 24048 Stücke: Lieferzeit 10-14 Tag (e) |
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SP5748GSK0AMMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
Produkt ist nicht verfügbar
SP5748GHK0AMMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Produkt ist nicht verfügbar
SP5748GSK0AVMJ2R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GBK0AVMJ6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tape & Reel (TR)
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GBK0AMMN6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 324-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 324-MAPBGA (19x19)
Number of I/O: 246
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GTK0AMKU6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 129
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SP5748GHK0AMMN6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Description: IC MCU 32BIT 6MB FLASH 324MAPBGA
Produkt ist nicht verfügbar
TEA2017DK1002 |
Hersteller: NXP USA Inc.
Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Part Status: Active
Description: TEA2017AAT PROGRAM BOARD
Packaging: Bulk
For Use With/Related Products: TEA2017
Type: Programmer
Contents: Board(s)
Part Status: Active
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 85.96 EUR |
PEMI2QFN/HP,115 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)PEMI4QFN/HP,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
auf Bestellung 28000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2959+ | 0.16 EUR |
PEMI6QFN/HP,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 6
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1902+ | 0.26 EUR |
PEMI1QFN/HP,315 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4121+ | 0.12 EUR |
PEMI8QFN/HP,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 45 OHM/18.5PF SMD
Packaging: Bulk
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 18.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 8
auf Bestellung 24000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1567+ | 0.31 EUR |
NT2H1611G0DUFV |
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
MC56F81866VLF |
Hersteller: NXP USA Inc.
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: IC DSC 128KB/20KB LQPF48
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I²C, SCI, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Produkt ist nicht verfügbar
SCC2698BC1A84 |
Hersteller: NXP USA Inc.
Description: OCTAL UART
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Description: OCTAL UART
Packaging: Bulk
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Package / Case: 84-LCC (J-Lead)
Number of Channels: 8
Mounting Type: Surface Mount
Voltage - Supply: 5V
Protocol: RS485
Supplier Device Package: 84-PLCC (29.26x29.26)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Part Status: Active
Produkt ist nicht verfügbar
SPC5673KAVJM1R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5673KAVJM1 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI, UART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
NT2H1311F0DTL125 |
Hersteller: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Produkt ist nicht verfügbar
NT2H1311TTDUDZ |
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
NT2H1311G0DUFV |
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Description: IC RFID READR/TRAN 13.56MZ WAFER
Produkt ist nicht verfügbar
NT2H1311TTDUFZ |
Hersteller: NXP USA Inc.
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Description: IC RFID READR/TRAN 13.56MZ WAFER
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Produkt ist nicht verfügbar
SPC5607BK0MLL6R |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
Produkt ist nicht verfügbar
PEMI8QFN/WM,132 |
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/16PF SMD
Description: FILTER RC(PI) 200 OHM/16PF SMD
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1697+ | 0.33 EUR |
SPC5748CSK0AVMJ2 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz, 120MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SPC5607BK0MLL6 |
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 7x10b, 5x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 77
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
UJA1169ATK/FZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 3.44 EUR |
UJA1169ATK/FZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 7080 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.85 EUR |
10+ | 6.15 EUR |
25+ | 5.82 EUR |
100+ | 5.04 EUR |
250+ | 4.78 EUR |
500+ | 4.29 EUR |
1000+ | 3.62 EUR |
UJA1169ATKZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 9000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 2.94 EUR |
UJA1169ATKZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 11800 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.84 EUR |
10+ | 5.25 EUR |
25+ | 4.97 EUR |
100+ | 4.3 EUR |
250+ | 4.08 EUR |
500+ | 3.66 EUR |
1000+ | 3.09 EUR |
UJA1169ATK/F/3Z |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 3.44 EUR |
UJA1169ATK/F/3Z |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 5798 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.85 EUR |
10+ | 6.15 EUR |
25+ | 5.82 EUR |
100+ | 5.04 EUR |
250+ | 4.78 EUR |
500+ | 4.29 EUR |
1000+ | 3.62 EUR |
UJA1169ATK/3Z |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
UJA1169ATK/3Z |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 2965 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4+ | 5.7 EUR |
10+ | 5.13 EUR |
25+ | 4.85 EUR |
100+ | 4.2 EUR |
250+ | 3.98 EUR |
500+ | 3.57 EUR |
1000+ | 3.01 EUR |
UJA1169ATK/XZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
UJA1169ATK/XZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
auf Bestellung 2845 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.28 EUR |
10+ | 5.64 EUR |
25+ | 5.33 EUR |
100+ | 4.62 EUR |
250+ | 4.38 EUR |
500+ | 3.93 EUR |
1000+ | 3.32 EUR |
UJA1169ATK/X/FZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Tape & Reel (TR)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3000+ | 3.72 EUR |
UJA1169ATK/X/FZ |
Hersteller: NXP USA Inc.
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
Description: IC MINI-CAN SYSTEM BASIS CHIP
Packaging: Cut Tape (CT)
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, SPI
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Part Status: Active
auf Bestellung 4880 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 7.41 EUR |
10+ | 6.66 EUR |
25+ | 6.3 EUR |
100+ | 5.46 EUR |
250+ | 5.18 EUR |
500+ | 4.65 EUR |
1000+ | 3.92 EUR |
UJA1169ATK/F/3 |
Hersteller: NXP USA Inc.
Description: IC SBC CAN HIGH SPEED 20HVSON
Packaging: Bulk
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Description: IC SBC CAN HIGH SPEED 20HVSON
Packaging: Bulk
Package / Case: 20-VFDFN Exposed Pad
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5V
Applications: System Basis Chip
Supplier Device Package: 20-HVSON (3.5x5.5)
Produkt ist nicht verfügbar
T4241NXN7PQB |
Hersteller: NXP USA Inc.
Description: QORIQ 64B POWER 24X 1.5GHZ THR
Description: QORIQ 64B POWER 24X 1.5GHZ THR
Produkt ist nicht verfügbar
MC56F8247VLH |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 48KB (24K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
37+ | 14.61 EUR |
PFXPS7140D4T1 |
Hersteller: NXP USA Inc.
Description: PRESSURE SATELLITE, 40-140 KPA,
Description: PRESSURE SATELLITE, 40-140 KPA,
Produkt ist nicht verfügbar
S9S12VR48F2VLCR |
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Produkt ist nicht verfügbar
A2I09VD015NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 575MHZ-960MHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WB-15
Part Status: Last Time Buy
Description: IC AMP GPS 575MHZ-960MHZ TO270WB
Packaging: Tape & Reel (TR)
Package / Case: TO-270-15 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 575MHz ~ 960MHz
RF Type: General Purpose
Voltage - Supply: 48V ~ 55V
Gain: 34dB
Current - Supply: 84mA
Test Frequency: 920MHz
Supplier Device Package: TO-270WB-15
Part Status: Last Time Buy
Produkt ist nicht verfügbar
MC68HC908QT1CPE-NXP |
Hersteller: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Part Status: Active
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAF3560HV/V1100,55 |
Hersteller: NXP USA Inc.
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Description: IC DGTL RADIO PROCESSOR 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: I²C, I²S, SPI, UART
Type: Digital Radio Processor
Operating Temperature: -40°C ~ 85°C (TA)
On-Chip RAM: 64KB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 96kHz
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
BGA3022518 |
Hersteller: NXP USA Inc.
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1.2GHz
RF Type: CATV
Voltage - Supply: 7.6V ~ 8.4V
Gain: 18dB
Current - Supply: 350mA
Noise Figure: 5.1dB
P1dB: 30dBm
Test Frequency: 40MHz ~ 1.2GHz
Supplier Device Package: 8-HSO
Description: IC RF AMP CATV 40MHZ-1.2GHZ 8HSO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Mounting Type: Surface Mount
Frequency: 40MHz ~ 1.2GHz
RF Type: CATV
Voltage - Supply: 7.6V ~ 8.4V
Gain: 18dB
Current - Supply: 350mA
Noise Figure: 5.1dB
P1dB: 30dBm
Test Frequency: 40MHz ~ 1.2GHz
Supplier Device Package: 8-HSO
auf Bestellung 22332 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
125+ | 4.01 EUR |
MD7IC2012GNR1,528 |
Hersteller: NXP USA Inc.
Description: IC AMP WCDMA 2.17GHZ TO270WB
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: WCDMA
Voltage - Supply: 24V ~ 32V
Gain: 34.7dB
Current - Supply: 70mA
P1dB: 40dBm
Test Frequency: 2.17GHz
Supplier Device Package: TO-270WB-14
Part Status: Active
Description: IC AMP WCDMA 2.17GHZ TO270WB
Packaging: Bulk
Package / Case: TO-270-14 Variant, Flat Leads
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.17GHz
RF Type: WCDMA
Voltage - Supply: 24V ~ 32V
Gain: 34.7dB
Current - Supply: 70mA
P1dB: 40dBm
Test Frequency: 2.17GHz
Supplier Device Package: TO-270WB-14
Part Status: Active
Produkt ist nicht verfügbar
MC9RS08KB12CSG |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Last Time Buy
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-SOIC
Part Status: Last Time Buy
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
3+ | 6.2 EUR |
10+ | 4.83 EUR |
74AUP1G374GW-Q100125 |
Hersteller: NXP USA Inc.
Description: IC FF D-TYPE SNGL 1BIT 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: SOT-363
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
Description: IC FF D-TYPE SNGL 1BIT 6TSSOP
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Current - Quiescent (Iq): 500 nA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 309 MHz
Input Capacitance: 0.8 pF
Supplier Device Package: SOT-363
Max Propagation Delay @ V, Max CL: 5.8ns @ 3.3V, 30pF
Part Status: Active
Number of Bits per Element: 1
auf Bestellung 81698 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
4691+ | 0.11 EUR |
74AUP1Z04GW/C125 |
Hersteller: NXP USA Inc.
Description: BUS DRIVER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter, X-Tal Driver
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 0.8V ~ 3.6V
Supplier Device Package: SOT-363
Description: BUS DRIVER, AUP/ULP/V SERIES
Packaging: Bulk
Package / Case: 6-TSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Logic Type: Inverter, X-Tal Driver
Operating Temperature: -40°C ~ 125°C
Supply Voltage: 0.8V ~ 3.6V
Supplier Device Package: SOT-363
Produkt ist nicht verfügbar
74AUP2G0604GW125 |
Hersteller: NXP USA Inc.
Description: IC INVERTER OD 2CH 2-INP SOT363
Description: IC INVERTER OD 2CH 2-INP SOT363
Produkt ist nicht verfügbar
74AUP2G16GW125 |
Hersteller: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V SOT363
Description: IC BUFFER NON-INVERT 3.6V SOT363
Produkt ist nicht verfügbar
PCA9632DP2Z |
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 12294 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2500+ | 1.21 EUR |
5000+ | 1.16 EUR |
PCA9632DP2Z |
Hersteller: NXP USA Inc.
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR PS I2C 25MA 10TSSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Voltage - Output: 5.5V
Mounting Type: Surface Mount
Number of Outputs: 4
Frequency: 100kHz ~ 1MHz
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 10-TSSOP
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
auf Bestellung 12294 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
7+ | 2.64 EUR |
10+ | 2.37 EUR |
25+ | 2.24 EUR |
100+ | 1.91 EUR |
250+ | 1.79 EUR |
500+ | 1.57 EUR |
1000+ | 1.3 EUR |
PCA9632TK118 |
Hersteller: NXP USA Inc.
Description: IC LED DRVR LIN DIM 25MA 8HVSON
Description: IC LED DRVR LIN DIM 25MA 8HVSON
Produkt ist nicht verfügbar
MMZ27333BT1147 |
Hersteller: NXP USA Inc.
Description: 2 W HIGH GAIN POWER AMPLIFIER FO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: 2 W HIGH GAIN POWER AMPLIFIER FO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MMZ27333BT1 |
Hersteller: NXP USA Inc.
Description: IC AMP GPS 1.5GHZ-2.7GHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 35.8dB
Current - Supply: 430mA
P1dB: 32.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Description: IC AMP GPS 1.5GHZ-2.7GHZ 24HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1.5GHz ~ 2.7GHz
RF Type: General Purpose
Voltage - Supply: 5V
Gain: 35.8dB
Current - Supply: 430mA
P1dB: 32.2dBm
Test Frequency: 2.14GHz
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Active
Produkt ist nicht verfügbar
NZX27B,133 |
Hersteller: NXP USA Inc.
Description: DIODE ZENER 27V 500MW ALF2
Description: DIODE ZENER 27V 500MW ALF2
auf Bestellung 24048 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
15000+ | 0.036 EUR |