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MFRC52202HN1,115 MFRC52202HN1,115 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
1500+7.43 EUR
Mindestbestellmenge: 1500
NCX2220GF,115 NCX2220GF,115 NXP USA Inc. NCX2220_Rev4.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NCX2220GT,115 NCX2220GT,115 NXP USA Inc. NCX2220.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NCX2222GTX NCX2222GTX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.55 EUR
Mindestbestellmenge: 5000
NCX2222GUX NCX2222GUX NXP USA Inc. NCX2222.pdf Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NT2H0301F0DTL,125 NT2H0301F0DTL,125 NXP USA Inc. Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Tape & Reel (TR)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
Produkt ist nicht verfügbar
NTB0101GN,132 NTB0101GN,132 NXP USA Inc. NTB0101.pdf Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTB0101GS,132 NTB0101GS,132 NXP USA Inc. NTB0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTB0104UK,012 NTB0104UK,012 NXP USA Inc. NTB0104.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.88 EUR
Mindestbestellmenge: 5000
NTB0104UK-Q100Z NTB0104UK-Q100Z NXP USA Inc. NTB0104_Q100.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NTS0101GN,132 NTS0101GN,132 NXP USA Inc. NTS0101.pdf Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0101GS,132 NTS0101GS,132 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0101GW,125 NTS0101GW,125 NXP USA Inc. NTS0101.pdf Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0102DP-Q100H NTS0102DP-Q100H NXP USA Inc. NTS0102_Q100.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
3000+0.78 EUR
6000+ 0.74 EUR
Mindestbestellmenge: 3000
NTS0104UK,012 NTS0104UK,012 NXP USA Inc. NTS0104.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0104UK-Q100Z NTS0104UK-Q100Z NXP USA Inc. NTS0104_Q100.pdf Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3DV42GU,115 NX3DV42GU,115 NXP USA Inc. NX3DV42.pdf Description: IC USB SWITCH DPDT XQFN10
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+0.54 EUR
8000+ 0.51 EUR
12000+ 0.49 EUR
Mindestbestellmenge: 4000
NX3DV642GU,115 NX3DV642GU,115 NXP USA Inc. NX3DV642.pdf Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.7 EUR
10000+ 0.67 EUR
Mindestbestellmenge: 5000
NX3L2267GM-Q100X NX3L2267GM-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3L2267GU-Q100X NX3L2267GU-Q100X NXP USA Inc. NX3L2267-Q100.pdf Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3L4051HR-Q100X NX3L4051HR-Q100X NXP USA Inc. NX3L4051-Q100.pdf Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9617ATPZ PCA9617ATPZ NXP USA Inc. PCA9617A.pdf Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
4000+0.95 EUR
Mindestbestellmenge: 4000
PMDPB28UN,115 PMDPB28UN,115 NXP USA Inc. PMDPB28UN.pdf Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
PMDPB38UNE,115 PMDPB38UNE,115 NXP USA Inc. PMDPB38UNE.pdf Description: MOSFET 2N-CH 20V 4A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4A
Input Capacitance (Ciss) (Max) @ Vds: 268pF @ 10V
Rds On (Max) @ Id, Vgs: 46mOhm @ 3A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.4nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Produkt ist nicht verfügbar
PMDPB56XN,115 PMDPB56XN,115 NXP USA Inc. PMDPB56XN.pdf Description: MOSFET 2N-CH 30V 3.1A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.1A
Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V
Rds On (Max) @ Id, Vgs: 73mOhm @ 3.1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Produkt ist nicht verfügbar
PMF87EN,115 PMF87EN,115 NXP USA Inc. PMF87EN.pdf Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
Produkt ist nicht verfügbar
PMPB20UN,115 PMPB20UN,115 NXP USA Inc. PMPB20UN.pdf Description: MOSFET N-CH 20V 6.6A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
Produkt ist nicht verfügbar
PMT200EN,115 PMT200EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
Produkt ist nicht verfügbar
PMT760EN,115 PMT760EN,115 NXP USA Inc. Description: MOSFET N-CH 100V 900MA SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
Produkt ist nicht verfügbar
PQJ7911AHN/C0C,515 NXP USA Inc. Description: IC TXRX ISM/SRD VAND 32HVQFN
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
SA58635UK,027 NXP USA Inc. SA58635.pdf Description: IC AMP CLASS G STER 25MW 16WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Package / Case: 16-UFBGA, WLCSP
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 5.5V
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Supplier Device Package: 16-WLCSP (1.7x1.7)
Produkt ist nicht verfügbar
SL3S4011FHK,125 SL3S4011FHK,125 NXP USA Inc. SL3S4011_4021.pdf Description: IC RFID TRANSP 860-960MHZ 8XQFN
Produkt ist nicht verfügbar
SL3S4021FHKH SL3S4021FHKH NXP USA Inc. Description: IC RFID TRANSP 860-960MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Standards: ISO 18000-6
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
Produkt ist nicht verfügbar
ASC3112HVK ASC3112HVK NXP USA Inc. ASC3101_3112_Br.pdf Description: IC RF TXRX+MCU AISG 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Memory Size: 256kB Flash, 16kB SRAM
Type: TxRx + MCU
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 10dBm
Data Rate (Max): 38.4kbps
Supplier Device Package: 144-HLQFP (20x20)
GPIO: 44
Modulation: OOK
RF Family/Standard: AISG
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
ASC8848AETE ASC8848AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
ASC8848AETK ASC8848AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
ASC8850AETE ASC8850AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ASC8850AETK ASC8850AETK NXP USA Inc. Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ASC8852AETE ASC8852AETE NXP USA Inc. 75017379.pdf Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
CLRC66302HN,151 CLRC66302HN,151 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 10043 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.93 EUR
10+ 13.14 EUR
25+ 12.03 EUR
80+ 10.87 EUR
230+ 10.02 EUR
490+ 9.98 EUR
Mindestbestellmenge: 2
CLRC66302HN,157 CLRC66302HN,157 NXP USA Inc. CLRC663.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
LPC1113FHN33/302K LPC1113FHN33/302K NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11E36FHN33/501E LPC11E36FHN33/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 96KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.57 EUR
10+ 6.69 EUR
80+ 5.48 EUR
Mindestbestellmenge: 3
LPC11E37FBD48/501E LPC11E37FBD48/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 9797 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.01 EUR
10+ 6.87 EUR
25+ 6.05 EUR
80+ 5.27 EUR
250+ 5.08 EUR
Mindestbestellmenge: 2
LPC11E37FBD64/501E LPC11E37FBD64/501E NXP USA Inc. LPC11E3X.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11E37FHI33/501E LPC11E37FHI33/501E NXP USA Inc. LPC11E3x_Draft_Rev2.3.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1785FBD208K NXP USA Inc. LPC178X_7X.pdf Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LPC1812JBD144E LPC1812JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1812JET100E LPC1812JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
1+24.09 EUR
10+ 19.26 EUR
80+ 16.27 EUR
LPC1813JBD144E LPC1813JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1813JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1815JBD144E LPC1815JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1815JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1817JBD144E LPC1817JBD144E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
LPC1817JET100E LPC1817JET100E NXP USA Inc. LPC185X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
LPC4312JBD144E LPC4312JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
1+28.92 EUR
LPC4313JBD144E LPC4313JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.74 EUR
10+ 23.77 EUR
LPC4315JBD144E LPC4315JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC4317JBD144E LPC4317JBD144E NXP USA Inc. LPC435X_3X_2X_1X.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MFRC63002HN,151 MFRC63002HN,151 NXP USA Inc. MFRC630.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1521 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.63 EUR
10+ 8.18 EUR
25+ 7.45 EUR
80+ 6.69 EUR
230+ 6.14 EUR
440+ 5.85 EUR
945+ 5.55 EUR
Mindestbestellmenge: 2
MFRC52202HN1,115 MFRC522.pdf
MFRC52202HN1,115
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1500+7.43 EUR
Mindestbestellmenge: 1500
NCX2220GF,115 NCX2220_Rev4.pdf
NCX2220GF,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT1089 (1.35x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NCX2220GT,115 NCX2220.pdf
NCX2220GT,115
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NCX2222GTX NCX2222.pdf
NCX2222GTX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Not For New Designs
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.55 EUR
Mindestbestellmenge: 5000
NCX2222GUX NCX2222.pdf
NCX2222GUX
Hersteller: NXP USA Inc.
Description: IC COMPARATOR 2 GEN PUR 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Output Type: Open-Drain
Mounting Type: Surface Mount
Number of Elements: 2
Type: General Purpose
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Single/Dual (±): 1.3V ~ 5.5V
Supplier Device Package: DFN1714-8
Propagation Delay (Max): 0.8µs
Current - Quiescent (Max): 5µA
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): 68mA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Hysteresis: 9mV
Part Status: Obsolete
Produkt ist nicht verfügbar
NT2H0301F0DTL,125
NT2H0301F0DTL,125
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 4HXSON
Packaging: Tape & Reel (TR)
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443
Supplier Device Package: 4-HXSON (2x1.5)
Part Status: Active
Produkt ist nicht verfügbar
NTB0101GN,132 NTB0101.pdf
NTB0101GN,132
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTB0101GS,132 NTB0101.pdf
NTB0101GS,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTB0104UK,012 NTB0104.pdf
NTB0104UK,012
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.88 EUR
Mindestbestellmenge: 5000
NTB0104UK-Q100Z NTB0104_Q100.pdf
NTB0104UK-Q100Z
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NTS0101GN,132 NTS0101.pdf
NTS0101GN,132
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1115 (0.9x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0101GS,132 NTS0101.pdf
NTS0101GS,132
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6XSON
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-XFDFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-XSON, SOT1202 (1x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0101GW,125 NTS0101.pdf
NTS0101GW,125
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 6TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 6-TSSOP, SC-88, SOT-363
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 6-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0102DP-Q100H NTS0102_Q100.pdf
NTS0102DP-Q100H
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Active
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3000+0.78 EUR
6000+ 0.74 EUR
Mindestbestellmenge: 3000
NTS0104UK,012 NTS0104.pdf
NTS0104UK,012
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Last Time Buy
Number of Circuits: 1
Produkt ist nicht verfügbar
NTS0104UK-Q100Z NTS0104_Q100.pdf
NTS0104UK-Q100Z
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 12WLCSP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 12-UFBGA, WLCSP
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 12-UFBGA, WLCSP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 4
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3DV42GU,115 NX3DV42.pdf
NX3DV42GU,115
Hersteller: NXP USA Inc.
Description: IC USB SWITCH DPDT XQFN10
Packaging: Tape & Reel (TR)
Features: Break-Before-Make, USB 2.0
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: USB
On-State Resistance (Max): 6.5Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 3V ~ 4.3V
Switch Circuit: DPDT
Part Status: Active
Number of Channels: 1
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+0.54 EUR
8000+ 0.51 EUR
12000+ 0.49 EUR
Mindestbestellmenge: 4000
NX3DV642GU,115 NX3DV642.pdf
NX3DV642GU,115
Hersteller: NXP USA Inc.
Description: IC SWITCH TPDT DIFF XQFN24
Packaging: Tape & Reel (TR)
Features: Break-Before-Make
Package / Case: 24-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Applications: MIPI
On-State Resistance (Max): 14Ohm
-3db Bandwidth: 950MHz
Supplier Device Package: 24-XQFN (2.5x3.4)
Voltage - Supply, Single (V+): 2.65V ~ 4.3V
Switch Circuit: 3PDT
Part Status: Active
Number of Channels: 1
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5000+0.7 EUR
10000+ 0.67 EUR
Mindestbestellmenge: 5000
NX3L2267GM-Q100X NX3L2267-Q100.pdf
NX3L2267GM-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.55x2)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3L2267GU-Q100X NX3L2267-Q100.pdf
NX3L2267GU-Q100X
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDTX2 750MOHM 10XQFN
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 10-XQFN (1.4x1.8)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 37pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 90mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 2
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
NX3L4051HR-Q100X NX3L4051-Q100.pdf
NX3L4051HR-Q100X
Hersteller: NXP USA Inc.
Description: IC MUX 8:1 750MOHM 16HXQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-XFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 15MHz
Supplier Device Package: 16-HXQFN (3x3)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Multiplexer/Demultiplexer Circuit: 8:1
Channel-to-Channel Matching (ΔRon): 70mOhm
Switch Time (Ton, Toff) (Max): 45ns, 25ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9617ATPZ PCA9617A.pdf
PCA9617ATPZ
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 1MHZ 8HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 5.5V, 2.2V ~ 5.5V
Applications: I2C
Current - Supply: 50µA
Data Rate (Max): 1MHz
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active
Capacitance - Input: 7 pF
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4000+0.95 EUR
Mindestbestellmenge: 4000
PMDPB28UN,115 PMDPB28UN.pdf
PMDPB28UN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4.6A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4.6A
Input Capacitance (Ciss) (Max) @ Vds: 265pF @ 10V
Rds On (Max) @ Id, Vgs: 37mOhm @ 4.6A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.7nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Part Status: Obsolete
Produkt ist nicht verfügbar
PMDPB38UNE,115 PMDPB38UNE.pdf
PMDPB38UNE,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 20V 4A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 20V
Current - Continuous Drain (Id) @ 25°C: 4A
Input Capacitance (Ciss) (Max) @ Vds: 268pF @ 10V
Rds On (Max) @ Id, Vgs: 46mOhm @ 3A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 4.4nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Produkt ist nicht verfügbar
PMDPB56XN,115 PMDPB56XN.pdf
PMDPB56XN,115
Hersteller: NXP USA Inc.
Description: MOSFET 2N-CH 30V 3.1A 6HUSON
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 510mW
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 3.1A
Input Capacitance (Ciss) (Max) @ Vds: 170pF @ 15V
Rds On (Max) @ Id, Vgs: 73mOhm @ 3.1A, 4.5V
Gate Charge (Qg) (Max) @ Vgs: 2.9nC @ 4.5V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 1.5V @ 250µA
Supplier Device Package: 6-HUSON (2x2)
Produkt ist nicht verfügbar
PMF87EN,115 PMF87EN.pdf
PMF87EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT323-3
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 80mOhm @ 1.7A, 10V
Power Dissipation (Max): 275mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-70
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 4.7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 135 pF @ 15 V
Produkt ist nicht verfügbar
PMPB20UN,115 PMPB20UN.pdf
PMPB20UN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 6.6A 6DFN
Packaging: Tape & Reel (TR)
Package / Case: 6-UDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Ta)
Rds On (Max) @ Id, Vgs: 25mOhm @ 6.6A, 4.5V
Power Dissipation (Max): 1.7W (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: 6-DFN2020MD (2x2)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 10 V
Produkt ist nicht verfügbar
PMT200EN,115
PMT200EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 1.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.8A (Ta)
Rds On (Max) @ Id, Vgs: 235mOhm @ 1.5A, 10V
Power Dissipation (Max): 800mW (Ta), 8.3W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 475 pF @ 80 V
Produkt ist nicht verfügbar
PMT760EN,115
PMT760EN,115
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 100V 900MA SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 900mA (Ta)
Rds On (Max) @ Id, Vgs: 950mOhm @ 800mA, 10V
Power Dissipation (Max): 800mW (Ta), 6.2W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 160 pF @ 80 V
Produkt ist nicht verfügbar
PQJ7911AHN/C0C,515
Hersteller: NXP USA Inc.
Description: IC TXRX ISM/SRD VAND 32HVQFN
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
SA58635UK,027 SA58635.pdf
Hersteller: NXP USA Inc.
Description: IC AMP CLASS G STER 25MW 16WLCSP
Packaging: Tape & Reel (TR)
Features: Depop, I2C, Short-Circuit and Thermal Protection, Shutdown, Volume Control
Package / Case: 16-UFBGA, WLCSP
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class G
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 5.5V
Max Output Power x Channels @ Load: 25mW x 2 @ 32Ohm
Supplier Device Package: 16-WLCSP (1.7x1.7)
Produkt ist nicht verfügbar
SL3S4011FHK,125 SL3S4011_4021.pdf
SL3S4011FHK,125
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
Produkt ist nicht verfügbar
SL3S4021FHKH
SL3S4021FHKH
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 860-960MHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 860MHz ~ 960MHz
Interface: I²C
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Standards: ISO 18000-6
Supplier Device Package: 8-XQFN (1.6x1.6)
Part Status: Active
Produkt ist nicht verfügbar
ASC3112HVK ASC3101_3112_Br.pdf
ASC3112HVK
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU AISG 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.176GHz, 4.352GHz, 6.528GHz
Memory Size: 256kB Flash, 16kB SRAM
Type: TxRx + MCU
Voltage - Supply: 1.8V ~ 3.3V
Power - Output: 10dBm
Data Rate (Max): 38.4kbps
Supplier Device Package: 144-HLQFP (20x20)
GPIO: 44
Modulation: OOK
RF Family/Standard: AISG
Serial Interfaces: I²C, SPI, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
ASC8848AETE 75017379.pdf
ASC8848AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
ASC8848AETK
ASC8848AETK
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
ASC8850AETE 75017379.pdf
ASC8850AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ASC8850AETK
ASC8850AETK
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Packaging: Tray
Package / Case: 484-TFBGA
Mounting Type: Surface Mount
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9®
Supplier Device Package: 484-TFBGA (15x15)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
ASC8852AETE 75017379.pdf
ASC8852AETE
Hersteller: NXP USA Inc.
Description: IC VIDEO PROCESSOR ADV 484TFBGA
Produkt ist nicht verfügbar
CLRC66302HN,151 CLRC663.pdf
CLRC66302HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 10043 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+16.93 EUR
10+ 13.14 EUR
25+ 12.03 EUR
80+ 10.87 EUR
230+ 10.02 EUR
490+ 9.98 EUR
Mindestbestellmenge: 2
CLRC66302HN,157 CLRC663.pdf
CLRC66302HN,157
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
LPC1113FHN33/302K LPC111X.pdf
LPC1113FHN33/302K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 24KB FLASH 32HVQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 32-HVQFN (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11E36FHN33/501E LPC11E3X.pdf
LPC11E36FHN33/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 32VQFN
Packaging: Tray
Package / Case: 32-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 156 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+8.57 EUR
10+ 6.69 EUR
80+ 5.48 EUR
Mindestbestellmenge: 3
LPC11E37FBD48/501E LPC11E3X.pdf
LPC11E37FBD48/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
auf Bestellung 9797 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.01 EUR
10+ 6.87 EUR
25+ 6.05 EUR
80+ 5.27 EUR
250+ 5.08 EUR
Mindestbestellmenge: 2
LPC11E37FBD64/501E LPC11E3X.pdf
LPC11E37FBD64/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC11E37FHI33/501E LPC11E3x_Draft_Rev2.3.pdf
LPC11E37FHI33/501E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1785FBD208K LPC178X_7X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 208LQFP
Produkt ist nicht verfügbar
LPC1812JBD144E LPC185X_3X_2X_1X.pdf
LPC1812JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1812JET100E LPC185X_3X_2X_1X.pdf
LPC1812JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+24.09 EUR
10+ 19.26 EUR
80+ 16.27 EUR
LPC1813JBD144E LPC185X_3X_2X_1X.pdf
LPC1813JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1813JET100E LPC185X_3X_2X_1X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1815JBD144E LPC185X_3X_2X_1X.pdf
LPC1815JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1815JET100E LPC185X_3X_2X_1X.pdf
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLSH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 4x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC1817JBD144E LPC185X_3X_2X_1X.pdf
LPC1817JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Produkt ist nicht verfügbar
LPC1817JET100E LPC185X_3X_2X_1X.pdf
LPC1817JET100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Produkt ist nicht verfügbar
LPC4312JBD144E LPC435X_3X_2X_1X.pdf
LPC4312JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+28.92 EUR
LPC4313JBD144E LPC435X_3X_2X_1X.pdf
LPC4313JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 104K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1+29.74 EUR
10+ 23.77 EUR
LPC4315JBD144E LPC435X_3X_2X_1X.pdf
LPC4315JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC4317JBD144E LPC435X_3X_2X_1X.pdf
LPC4317JBD144E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 204MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
MFRC63002HN,151 MFRC630.pdf
MFRC63002HN,151
Hersteller: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Active
auf Bestellung 1521 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.63 EUR
10+ 8.18 EUR
25+ 7.45 EUR
80+ 6.69 EUR
230+ 6.14 EUR
440+ 5.85 EUR
945+ 5.55 EUR
Mindestbestellmenge: 2
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