Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35440) > Seite 127 nach 591
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MRF7S27130HR3 | NXP USA Inc. |
 Description: RF MOSFET LDMOS 28V NI780Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
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MRF7S27130HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780H-2L Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
Produkt ist nicht verfügbar |
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MRF7S27130HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
Produkt ist nicht verfügbar |
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MRF7S27130HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.7GHz Power - Output: 23W Gain: 16.5dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
Produkt ist nicht verfügbar |
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| MRF7S38010HR3 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400 |
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| MRF7S38010HR5 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400 |
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| MRF7S38010HSR3 | NXP USA Inc. |
Description: FET RF 65V 3.6GHZ NI-400S Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 2W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400S-2S Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 160 mA |
Produkt ist nicht verfügbar |
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| MRFE6P3300HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 32V NI860C3 Packaging: Tape & Reel (TR) Package / Case: NI-860C3 Mounting Type: Chassis Mount Frequency: 857MHz ~ 863MHz Power - Output: 270W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 66 V Voltage - Test: 32 V Current - Test: 1.6 A |
Produkt ist nicht verfügbar |
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MRFE6S9045NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 10W Gain: 22.1dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 350 mA |
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MRFE6S9060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-2 Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 14W Gain: 21.1dB Technology: LDMOS Supplier Device Package: TO-270-2 Part Status: Active Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 450 mA |
Produkt ist nicht verfügbar |
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MRFE6S9125NBR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO272-4 Packaging: Tape & Reel (TR) Package / Case: TO-272BB Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-272 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
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MRFE6S9125NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V TO270-4 Packaging: Tape & Reel (TR) Package / Case: TO-270AB Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 27W Gain: 20.2dB Technology: LDMOS Supplier Device Package: TO-270 WB-4 Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
Produkt ist nicht verfügbar |
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MRFE6S9130HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 27W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 950 mA |
Produkt ist nicht verfügbar |
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| MRFE6S9135HSR5 | NXP USA Inc. |
Description: FET RF 66V 940MHZ NI-880S |
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MRFE6S9160HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 35W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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MRFE6S9160HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 35W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-780H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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MRFE6S9160HSR5 | NXP USA Inc. |
Description: FET RF 66V 880MHZ NI-780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 35W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-780S Part Status: Obsolete Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.2 A |
Produkt ist nicht verfügbar |
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MRFE6S9205HR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880H Packaging: Tape & Reel (TR) Package / Case: SOT-957A Mounting Type: Chassis Mount Frequency: 880MHz Power - Output: 58W Gain: 21.2dB Technology: LDMOS Supplier Device Package: NI-880H-2L Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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| MRFE6S9205HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880S Packaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 880MHz Power - Output: 58W Gain: 21.2dB Technology: LDMOS Supplier Device Package: NI-880S Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1.4 A |
Produkt ist nicht verfügbar |
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MRFG35002N6AT1 | NXP USA Inc. |
Description: FET RF 8V 3.55GHZ PLD-1.5 |
Produkt ist nicht verfügbar |
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MRFG35003ANR5 | NXP USA Inc. |
Description: FET RF 15V 3.55GHZ PLD-1.5 |
Produkt ist nicht verfügbar |
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MRFG35003N6AT1 | NXP USA Inc. |
Description: RF MOSFET PHEMT FET 6V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 3.55GHz Power - Output: 450mW Gain: 10dB Technology: pHEMT FET Supplier Device Package: PLD-1.5 Part Status: Obsolete Voltage - Rated: 8 V Voltage - Test: 6 V Current - Test: 180 mA |
Produkt ist nicht verfügbar |
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MRFG35005ANT1 | NXP USA Inc. |
Description: RF MOSFET PHEMT FET 12V PLD-1.5 Packaging: Tape & Reel (TR) Package / Case: PLD-1.5 Mounting Type: Surface Mount Frequency: 3.55GHz Power - Output: 4.5W Gain: 11dB Technology: pHEMT FET Supplier Device Package: PLD-1.5 Voltage - Rated: 15 V Voltage - Test: 12 V Current - Test: 80 mA |
Produkt ist nicht verfügbar |
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MRFG35020AR1 | NXP USA Inc. |
Description: FET RF 15V 3.5GHZ NI-360 |
Produkt ist nicht verfügbar |
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MRFG35020AR5 | NXP USA Inc. | Description: FET RF 15V 3.5GHZ NI-360 |
Produkt ist nicht verfügbar |
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MW7IC18100NBR1 | NXP USA Inc. |
Description: IC AMP GSM 1.805-2.05GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 1.805GHz ~ 2.05GHz RF Type: GSM, EDGE Voltage - Supply: 24V ~ 32V Gain: 30dB Current - Supply: 1.18A P1dB: 51.93dBm Test Frequency: 1.9GHz Supplier Device Package: TO-272 WB-14 |
Produkt ist nicht verfügbar |
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MWE6IC9100NBR1 | NXP USA Inc. |
Description: IC RF AMP GSM 960MHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 960MHz RF Type: GSM, EDGE Voltage - Supply: 28V Gain: 33.5dB Supplier Device Package: TO-272 WB-14 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| MXC9ACCSRYK-AB | NXP USA Inc. | Description: ACCY CARDS ZAS ACCESSORY |
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| MXC9ATLAS-PMB | NXP USA Inc. | Description: BOARD ATLAS PM |
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| USBMLPPCBDM | NXP USA Inc. |
Description: MULTILINK P&E POWERPC USB Packaging: Bulk For Use With/Related Products: MPC5xx / 55xx Type: Debugger (In-Circuit/In-System) Contents: Board(s) Part Status: Active |
Produkt ist nicht verfügbar |
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USBMLPPCNEXUS | NXP USA Inc. |
Description: MULTILINK P&E POWERPC NEXUS USB Packaging: Bulk For Use With/Related Products: MPC5xx / 55xx Type: Debugger (In-Circuit/In-System) Contents: Board(s) |
Produkt ist nicht verfügbar |
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TJA1041T/N1,512 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 70 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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TJA1041T/N1,518 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C Voltage - Supply: 4.75V ~ 5.25V Number of Drivers/Receivers: 1/1 Protocol: CANbus Supplier Device Package: 14-SO Receiver Hysteresis: 70 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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LH79520N0Q000B1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP |
Produkt ist nicht verfügbar |
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LH79524N0F100A1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 208LFBGA Packaging: Tray Package / Case: 208-LFBGA Mounting Type: Surface Mount Speed: 76.2MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 10x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 208-LFBGA (14x14) Number of I/O: 108 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LH79525N0Q100A1;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 176LQFP Packaging: Tray Package / Case: 176-LQFP Mounting Type: Surface Mount Speed: 76.2MHz RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM7® Data Converters: A/D 10x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 176-LQFP (20x20) Part Status: Obsolete Number of I/O: 86 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LH7A404N0F000B3;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 324LFBGA Packaging: Tray Package / Case: 324-LFBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Data Converters: A/D 9x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 324-LFBGA (17x17) Number of I/O: 64 DigiKey Programmable: Not Verified |
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LH75411N0Q100C0;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
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LH7A400N0G000B5;55 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256BGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 80K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: ARM9® Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB Peripherals: AC'97, DMA, LCD, POR, PWM, WDT Supplier Device Package: 256-BGA (17x17) Number of I/O: 60 DigiKey Programmable: Not Verified |
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3806620 | NXP USA Inc. |
Description: KIT BISS TRANSISTORS 17 VALUES Packaging: Case Mounting Type: Surface Mount Quantity: 425 Pieces (17 Values - 25 Each) Kit Type: Transistors |
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3806684 | NXP USA Inc. | Description: KIT SCHOTTKY DIODE 17 VALUES |
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BLF6G20-230P | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V LDMOST Packaging: Bag Package / Case: SOT-502A Current Rating (Amps): 5µA Mounting Type: Chassis Mount Frequency: 1.8GHz Power - Output: 50W Gain: 16.5dB Technology: LDMOS Supplier Device Package: LDMOST Part Status: Obsolete Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 2 A |
Produkt ist nicht verfügbar |
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MCF51JM128EVLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Part Status: Active Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51JM128VLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
auf Bestellung 492 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51JM128VQH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Part Status: Active Number of I/O: 51 DigiKey Programmable: Not Verified |
auf Bestellung 1260 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51JM128VLH | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Active Number of I/O: 51 DigiKey Programmable: Verified |
auf Bestellung 2031 Stücke: Lieferzeit 10-14 Tag (e) |
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MCF51JM128VLD | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I²C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF51JM64VLD | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 44LQFP Packaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 1600 Stücke: Lieferzeit 10-14 Tag (e) |
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DEMOJM | NXP USA Inc. |
Description: MCF51JM128/MC9S08JM60 EVAL BRD Packaging: Box Mounting Type: Socket Type: MCU Contents: Board(s), Cable(s), Accessories Board Type: Evaluation Platform Utilized IC / Part: MCF51JM128, MC9S08JM60 Part Status: Obsolete |
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| SL3ICS1002FUG/V7AF | NXP USA Inc. |
Description: IC UCODE G2XM FFC Packaging: Tube Package / Case: Die Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762 Supplier Device Package: Wafer Part Status: Active |
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SA58670ABS,115 | NXP USA Inc. |
Description: IC AMP CLASS D STER 2.1W 20HVQFN Packaging: Tape & Reel (TR) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 20-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm Supplier Device Package: 20-HVQFN (4x4) Part Status: Obsolete |
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SA58671UK,027 | NXP USA Inc. |
Description: IC AMP CLASS D STER 1.3W 16WLCSP |
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SA58637BS,118 | NXP USA Inc. |
Description: IC AMP CLSS AB STER 2.2W 20HVQFN |
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SA58670ABS,115 | NXP USA Inc. |
Description: IC AMP CLASS D STER 2.1W 20HVQFN Packaging: Cut Tape (CT) Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown Package / Case: 20-VFQFN Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class D Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.5V ~ 5.5V Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm Supplier Device Package: 20-HVQFN (4x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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SA58671UK,027 | NXP USA Inc. |
Description: IC AMP CLASS D STER 1.3W 16WLCSP |
Produkt ist nicht verfügbar |
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CWP-PRO-NL | NXP USA Inc. |
Description: SOFTWARE CODE WARRIOR Packaging: Box For Use With/Related Products: Code Warrior™ Software Type: Integrated Development Environment (IDE) Applications: Programming Operating System: Windows XP, 7 Edition: Professional License Length: Perpetual License - User Details: Fixed Node Media Delivery Type: Electronically Delivered Part Status: Active |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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TJA1080TS,118 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 20SSOP Packaging: Cut Tape (CT) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Interface: FlexRay Voltage - Supply: 4.75V ~ 5.25V Applications: Automotive Supplier Device Package: 20-SSOP |
Produkt ist nicht verfügbar |
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OM11005 | NXP USA Inc. |
Description: DISPLAY QVGA TFT FOR OM10100 Packaging: Box For Use With/Related Products: OM10100 Accessory Type: LCD Display |
Produkt ist nicht verfügbar |
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OM11013,598 | NXP USA Inc. |
Description: LPC2387 EVAL BRD Packaging: Box Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s), Cable(s) Core Processor: ARM7 Utilized IC / Part: LPC2387 |
Produkt ist nicht verfügbar |
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MC34671AEPR2 | NXP USA Inc. |
Description: IC BATT CHG LI-ION 1CELL 8UDFN Packaging: Cut Tape (CT) Package / Case: 8-UFDFN Exposed Pad Number of Cells: 1 Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Battery Chemistry: Lithium Ion/Polymer Supplier Device Package: 8-UDFN (3x2) Charge Current - Max: 600mA Fault Protection: Over Temperature, Over Voltage Voltage - Supply (Max): 10V Battery Pack Voltage: 4.2V Current - Charging: Constant - Programmable |
auf Bestellung 6196 Stücke: Lieferzeit 10-14 Tag (e) |
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| MRF7S27130HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
| MRF7S27130HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
| MRF7S27130HSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
| MRF7S27130HSR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.7GHz
Power - Output: 23W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Produkt ist nicht verfügbar
| MRF7S38010HR3 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 3.6GHZ NI-400
Description: FET RF 65V 3.6GHZ NI-400
Produkt ist nicht verfügbar
| MRF7S38010HR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 3.6GHZ NI-400
Description: FET RF 65V 3.6GHZ NI-400
Produkt ist nicht verfügbar
| MRF7S38010HSR3 |
|
Hersteller: NXP USA Inc.
Description: FET RF 65V 3.6GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
Description: FET RF 65V 3.6GHZ NI-400S
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
Produkt ist nicht verfügbar
| MRFE6P3300HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Tape & Reel (TR)
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
Produkt ist nicht verfügbar
| MRFE6S9045NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
| MRFE6S9060NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
Produkt ist nicht verfügbar
| MRFE6S9125NBR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Produkt ist nicht verfügbar
| MRFE6S9125NR1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 20.2dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Produkt ist nicht verfügbar
| MRFE6S9130HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 27W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 950 mA
Produkt ist nicht verfügbar
| MRFE6S9135HSR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 66V 940MHZ NI-880S
Description: FET RF 66V 940MHZ NI-880S
Produkt ist nicht verfügbar
| MRFE6S9160HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| MRFE6S9160HR5 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| MRFE6S9160HSR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 66V 880MHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Description: FET RF 66V 880MHZ NI-780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780S
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
Produkt ist nicht verfügbar
| MRFE6S9205HR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21.2dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V NI880H
Packaging: Tape & Reel (TR)
Package / Case: SOT-957A
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21.2dB
Technology: LDMOS
Supplier Device Package: NI-880H-2L
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
| MRFE6S9205HSR3 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21.2dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 58W
Gain: 21.2dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.4 A
Produkt ist nicht verfügbar
| MRFG35002N6AT1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 8V 3.55GHZ PLD-1.5
Description: FET RF 8V 3.55GHZ PLD-1.5
Produkt ist nicht verfügbar
| MRFG35003ANR5 |
|
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.55GHZ PLD-1.5
Description: FET RF 15V 3.55GHZ PLD-1.5
Produkt ist nicht verfügbar
| MRFG35003N6AT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 450mW
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 180 mA
Description: RF MOSFET PHEMT FET 6V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 450mW
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 8 V
Voltage - Test: 6 V
Current - Test: 180 mA
Produkt ist nicht verfügbar
| MRFG35005ANT1 |
|
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 4.5W
Gain: 11dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 80 mA
Description: RF MOSFET PHEMT FET 12V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 3.55GHz
Power - Output: 4.5W
Gain: 11dB
Technology: pHEMT FET
Supplier Device Package: PLD-1.5
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 80 mA
Produkt ist nicht verfügbar
| MRFG35020AR1 |
|
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.5GHZ NI-360
Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
| MRFG35020AR5 |
Hersteller: NXP USA Inc.
Description: FET RF 15V 3.5GHZ NI-360
Description: FET RF 15V 3.5GHZ NI-360
Produkt ist nicht verfügbar
| MW7IC18100NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC AMP GSM 1.805-2.05GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.05GHz
RF Type: GSM, EDGE
Voltage - Supply: 24V ~ 32V
Gain: 30dB
Current - Supply: 1.18A
P1dB: 51.93dBm
Test Frequency: 1.9GHz
Supplier Device Package: TO-272 WB-14
Description: IC AMP GSM 1.805-2.05GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 1.805GHz ~ 2.05GHz
RF Type: GSM, EDGE
Voltage - Supply: 24V ~ 32V
Gain: 30dB
Current - Supply: 1.18A
P1dB: 51.93dBm
Test Frequency: 1.9GHz
Supplier Device Package: TO-272 WB-14
Produkt ist nicht verfügbar
| MWE6IC9100NBR1 |
|
Hersteller: NXP USA Inc.
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Description: IC RF AMP GSM 960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 33.5dB
Supplier Device Package: TO-272 WB-14
Part Status: Obsolete
Produkt ist nicht verfügbar
| MXC9ACCSRYK-AB |
Hersteller: NXP USA Inc.
Description: ACCY CARDS ZAS ACCESSORY
Description: ACCY CARDS ZAS ACCESSORY
Produkt ist nicht verfügbar
| USBMLPPCBDM |
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Part Status: Active
Produkt ist nicht verfügbar
| USBMLPPCNEXUS |
Hersteller: NXP USA Inc.
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Produkt ist nicht verfügbar
| TJA1041T/N1,512 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| TJA1041T/N1,518 |
|
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
| LH79520N0Q000B1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Description: IC MCU 32BIT ROMLESS 176LQFP
Produkt ist nicht verfügbar
| LH79524N0F100A1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH79525N0Q100A1;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH7A404N0F000B3;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LH75411N0Q100C0;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Description: IC MCU 32BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
| LH7A400N0G000B5;55 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 3806620 |
Hersteller: NXP USA Inc.
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
Produkt ist nicht verfügbar
| 3806684 |
Hersteller: NXP USA Inc.
Description: KIT SCHOTTKY DIODE 17 VALUES
Description: KIT SCHOTTKY DIODE 17 VALUES
Produkt ist nicht verfügbar
| BLF6G20-230P |
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
Produkt ist nicht verfügbar
| MCF51JM128EVLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 31.05 EUR |
| 10+ | 24.81 EUR |
| 80+ | 20.95 EUR |
| 450+ | 20.82 EUR |
| MCF51JM128VLK |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
auf Bestellung 492 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 25.31 EUR |
| 10+ | 18.13 EUR |
| 25+ | 16.29 EUR |
| 80+ | 14.51 EUR |
| 230+ | 13.31 EUR |
| 450+ | 12.71 EUR |
| MCF51JM128VQH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
auf Bestellung 1260 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.13 EUR |
| 10+ | 19.29 EUR |
| 80+ | 16.29 EUR |
| 840+ | 16.19 EUR |
| MCF51JM128VLH |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
auf Bestellung 2031 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 24.78 EUR |
| 10+ | 17.73 EUR |
| 25+ | 15.92 EUR |
| 80+ | 14.17 EUR |
| 230+ | 12.99 EUR |
| 800+ | 12.14 EUR |
| MCF51JM128VLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF51JM64VLD |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.54 EUR |
| 10+ | 17.21 EUR |
| 80+ | 14.54 EUR |
| 800+ | 14.45 EUR |
| DEMOJM |
|
Hersteller: NXP USA Inc.
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
Produkt ist nicht verfügbar
| SL3ICS1002FUG/V7AF |
Hersteller: NXP USA Inc.
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
Produkt ist nicht verfügbar
| SA58670ABS,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Tape & Reel (TR)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA58671UK,027 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
| SA58637BS,118 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Produkt ist nicht verfügbar
| SA58670ABS,115 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Packaging: Cut Tape (CT)
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| SA58671UK,027 |
|
Hersteller: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Description: IC AMP CLASS D STER 1.3W 16WLCSP
Produkt ist nicht verfügbar
| CWP-PRO-NL |
|
Hersteller: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 9522.18 EUR |
| TJA1080TS,118 |
|
Hersteller: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Applications: Automotive
Supplier Device Package: 20-SSOP
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Applications: Automotive
Supplier Device Package: 20-SSOP
Produkt ist nicht verfügbar
| OM11005 |
Hersteller: NXP USA Inc.
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
Produkt ist nicht verfügbar
| OM11013,598 |
Hersteller: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
Produkt ist nicht verfügbar
| MC34671AEPR2 |
|
Hersteller: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
auf Bestellung 6196 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.71 EUR |
| 10+ | 3.34 EUR |
| 25+ | 3.15 EUR |
| 100+ | 2.68 EUR |
| 250+ | 2.52 EUR |
| 500+ | 2.2 EUR |
| 1000+ | 1.82 EUR |