Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (39331) > Seite 441 nach 656
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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| 3222-2-00-01-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC .040DIA TINLEAD Packaging: Bulk Contact Finish: Tin-Lead Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.062" (1.57mm) Terminal Type: PC Pin Flange Diameter: 0.070" (1.77mm) Length - Overall: 0.252" (6.40mm) Termination: Swage Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.040" (1.02mm) Dia Length - Below Flange: 0.082" (2.08mm) Length - Above Flange: 0.150" (3.81mm) |
Produkt ist nicht verfügbar |
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825-22-003-10-001101 | Mill-Max Manufacturing Corp. |
 Description: CONN SPRING PISTON 3POS PCBPackaging: Bulk Connector Type: Piston Contact Finish: Gold Mounting Type: Through Hole Material: Copper Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 20.0µin (0.51µm) Number of Contacts: 3 Number of Rows: 1 |
auf Bestellung 510 Stücke: Lieferzeit 10-14 Tag (e) |
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| 351-10-145-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER VERT 45POS 2.54MM |
Produkt ist nicht verfügbar |
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| 351-10-145-00-011000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER VERT 45POS 2.54MM |
Produkt ist nicht verfügbar |
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399-10-110-10-009000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER R/A 10POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 10 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT) Contact Length - Mating: 0.157" (4.00mm) |
auf Bestellung 2859 Stücke: Lieferzeit 10-14 Tag (e) |
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| 346-99-110-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCB Packaging: Tube Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-111-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 11 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-111-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 11 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.175" (4.45mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-112-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-112-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Contact Length - Post: 0.175" (4.45mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-113-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 13 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-113-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 13 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Contact Length - Post: 0.175" (4.45mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-119-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
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| 346-99-119-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 19 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.175" (4.45mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 346-99-114-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
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| 1401-0-15-15-30-14-10-0 | Mill-Max Manufacturing Corp. |
Description: PIN RECEPTACLE Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.072" (1.83mm) Length - Overall: 0.165" (4.19mm) Termination: Solder Mounting Hole Diameter: 0.055" (1.40mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: No Tail Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Pin Hole Diameter: 0.043" (1.09mm) Socket Depth: 0.145" (3.68mm) |
Produkt ist nicht verfügbar |
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316-93-159-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.236" (6.00mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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316-93-159-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.315" (8.00mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 334-90-114-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD Packaging: Bulk Connector Type: Header Contact Finish: Tin-Lead Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Post, Extended Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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| 334-90-113-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
Produkt ist nicht verfügbar |
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| 334-90-114-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
Produkt ist nicht verfügbar |
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| 334-90-114-00-000000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
Produkt ist nicht verfügbar |
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| 334-90-113-00-100000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
Produkt ist nicht verfügbar |
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316-93-159-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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110-47-328-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLD Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
auf Bestellung 240 Stücke: Lieferzeit 10-14 Tag (e) |
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| 712-43-102-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 2POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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| 712-41-258-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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| 712-41-260-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 60POS 0.1 GOLD PCB |
Produkt ist nicht verfügbar |
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803-99-042-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB |
Produkt ist nicht verfügbar |
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| 833-43-014-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
Produkt ist nicht verfügbar |
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| 833-43-014-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
Produkt ist nicht verfügbar |
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| 833-43-014-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD SMD |
Produkt ist nicht verfügbar |
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| 833-43-014-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14P 0.079 GOLD PCB R/A |
Produkt ist nicht verfügbar |
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851-93-058-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.05 GOLD PCB |
Produkt ist nicht verfügbar |
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851-93-059-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 59POS 0.05 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Contact Length - Post: 0.115" (2.92mm) Insulation Height: 0.185" (4.70mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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851-41-007-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 7POS 0.05 GOLD PCB |
Produkt ist nicht verfügbar |
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| 515-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-13-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 515-13-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 510-91-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
Produkt ist nicht verfügbar |
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| 510-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 510-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 614-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 614-93-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 614-93-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 551-90-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 511-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 511-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 511-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 510-93-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
Produkt ist nicht verfügbar |
||||||||||||||||
| 510-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 510-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 614-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||||||||||
| 614-13-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
| 3222-2-00-01-00-00-08-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .040DIA TINLEAD
Packaging: Bulk
Contact Finish: Tin-Lead
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.77mm)
Length - Overall: 0.252" (6.40mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.082" (2.08mm)
Length - Above Flange: 0.150" (3.81mm)
Description: CONN PC PIN CIRC .040DIA TINLEAD
Packaging: Bulk
Contact Finish: Tin-Lead
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.77mm)
Length - Overall: 0.252" (6.40mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Length - Below Flange: 0.082" (2.08mm)
Length - Above Flange: 0.150" (3.81mm)
Produkt ist nicht verfügbar
| 825-22-003-10-001101 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING PISTON 3POS PCB
Packaging: Bulk
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Through Hole
Material: Copper Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 20.0µin (0.51µm)
Number of Contacts: 3
Number of Rows: 1
Description: CONN SPRING PISTON 3POS PCB
Packaging: Bulk
Connector Type: Piston
Contact Finish: Gold
Mounting Type: Through Hole
Material: Copper Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 20.0µin (0.51µm)
Number of Contacts: 3
Number of Rows: 1
auf Bestellung 510 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.63 EUR |
| 10+ | 4.21 EUR |
| 25+ | 3.99 EUR |
| 50+ | 3.89 EUR |
| 100+ | 3.71 EUR |
| 250+ | 3.25 EUR |
| 500+ | 3.15 EUR |
| 351-10-145-00-010000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 45POS 2.54MM
Description: CONN HEADER VERT 45POS 2.54MM
Produkt ist nicht verfügbar
| 351-10-145-00-011000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 45POS 2.54MM
Description: CONN HEADER VERT 45POS 2.54MM
Produkt ist nicht verfügbar
| 399-10-110-10-009000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 10
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.157" (4.00mm)
auf Bestellung 2859 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 4.45 EUR |
| 10+ | 4.05 EUR |
| 100+ | 3.56 EUR |
| 500+ | 3.03 EUR |
| 1000+ | 2.58 EUR |
| 346-99-110-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 10
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-111-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 11
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 11
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-111-41-013000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 11
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 11
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-112-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-112-41-013000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-113-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-113-41-013000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-119-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
| 346-99-119-41-013000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 19
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 19
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.175" (4.45mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 346-99-114-41-012000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
| 1401-0-15-15-30-14-10-0 |
Hersteller: Mill-Max Manufacturing Corp.
Description: PIN RECEPTACLE
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.165" (4.19mm)
Termination: Solder
Mounting Hole Diameter: 0.055" (1.40mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: No Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Socket Depth: 0.145" (3.68mm)
Description: PIN RECEPTACLE
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.165" (4.19mm)
Termination: Solder
Mounting Hole Diameter: 0.055" (1.40mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: No Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Socket Depth: 0.145" (3.68mm)
Produkt ist nicht verfügbar
| 316-93-159-41-006000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 316-93-159-41-003000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 334-90-114-00-010000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 334-90-113-00-050000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
Produkt ist nicht verfügbar
| 334-90-114-00-050000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
Produkt ist nicht verfügbar
| 334-90-114-00-000000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
Produkt ist nicht verfügbar
| 334-90-113-00-100000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
Produkt ist nicht verfügbar
| 316-93-159-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
| 110-47-328-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.63 EUR |
| 10+ | 3.15 EUR |
| 25+ | 3.02 EUR |
| 50+ | 2.95 EUR |
| 100+ | 2.82 EUR |
| 712-43-102-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 2POS 0.1 GOLD PCB
Description: CONN RCPT 2POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
| 712-41-258-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.1 GOLD PCB
Description: CONN RCPT 58POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
| 712-41-260-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 60POS 0.1 GOLD PCB
Description: CONN RCPT 60POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
| 803-99-042-10-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
| 833-43-014-10-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
Produkt ist nicht verfügbar
| 833-43-014-10-002000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
Produkt ist nicht verfügbar
| 833-43-014-30-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD SMD
Description: CONN RCPT 14POS 0.079 GOLD SMD
Produkt ist nicht verfügbar
| 833-43-014-20-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
Produkt ist nicht verfügbar
| 851-93-058-10-002000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.05 GOLD PCB
Description: CONN RCPT 58POS 0.05 GOLD PCB
Produkt ist nicht verfügbar
| 851-93-059-10-002000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.05 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.115" (2.92mm)
Insulation Height: 0.185" (4.70mm)
Number of Rows: 1
Description: CONN RCPT 59POS 0.05 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Contact Length - Post: 0.115" (2.92mm)
Insulation Height: 0.185" (4.70mm)
Number of Rows: 1
Produkt ist nicht verfügbar
| 851-41-007-10-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.05 GOLD PCB
Description: CONN RCPT 7POS 0.05 GOLD PCB
Produkt ist nicht verfügbar
| 515-91-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-91-225-18-091002 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-91-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-93-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-93-225-18-091002 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-93-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-13-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-13-225-18-091002 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 515-13-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 510-91-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
Produkt ist nicht verfügbar
| 510-91-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 510-91-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 614-93-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Active
Produkt ist nicht verfügbar
| 614-93-225-18-091007 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 614-93-225-18-091012 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 551-90-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 511-91-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 511-91-225-18-091002 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 511-91-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 510-93-225-18-091002 |
Hersteller: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
Produkt ist nicht verfügbar
| 510-93-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 510-93-225-18-091003 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 614-13-225-18-091001 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Produkt ist nicht verfügbar
| 614-13-225-18-091007 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar