Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (39330) > Seite 422 nach 656
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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523-93-281-19-081003 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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614-93-084-12-051001 | Mill-Max Manufacturing Corp. |
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614-93-084-11-045012 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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614-93-084-12-051007 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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614-93-084-12-051012 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Carrier, Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 84 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-93-084-13-081001 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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614-93-084-13-081007 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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3116-2-00-15-00-00-08-0 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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800-40-001-62-001000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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801-99-001-62-001000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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801-41-001-62-001000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole Number of Positions: 1 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit, Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.143" (3.63mm) Insulation Height: 0.276" (7.00mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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511-93-012-05-001002 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (5 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-93-012-05-001003 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (5 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-93-022-05-001002 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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511-93-022-05-001003 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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511-93-025-05-000001 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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111-93-432-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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515-93-032-01-503001 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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515-93-032-01-503002 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (1 x 1) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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515-93-032-01-503003 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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515-13-032-01-503001 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (1 x 1) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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515-13-032-01-503002 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (1 x 1) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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515-13-032-01-503003 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (1 x 1) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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803-91-080-10-001000 | Mill-Max Manufacturing Corp. |
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803-91-076-30-001000 | Mill-Max Manufacturing Corp. |
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349-10-126-00-560000 | Mill-Max Manufacturing Corp. | Description: CONN HEADER SMD 26POS 2.54MM |
Produkt ist nicht verfügbar |
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0152-0-15-80-30-84-04-0 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Contact Finish: Tin Flange Diameter: 0.072" (1.83mm) Length - Overall: 0.600" (15.24mm) Termination: Press-Fit Mounting Hole Diameter: 0.057" (1.45mm) Contact Finish Thickness: 100.0µin (2.54µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Pin Hole Diameter: 0.043" (1.09mm) Tail Diameter: 0.025" (0.64mm) Socket Depth: 0.150" (3.81mm) |
auf Bestellung 499 Stücke: Lieferzeit 10-14 Tag (e) |
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342-40-103-00-593000 | Mill-Max Manufacturing Corp. |
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342-40-103-00-594000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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110-13-322-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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110-13-322-61-801000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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110-13-624-61-801000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Open Frame, Decoupling Capacitor Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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430-10-220-00-240000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Tube Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole, Solder Cup Material: Brass Alloy Pitch: 0.100" (2.54mm) Row Spacing: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Number of Contacts: 20 Number of Rows: 2 |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
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430-10-222-00-240000 | Mill-Max Manufacturing Corp. |
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430-10-226-00-240000 | Mill-Max Manufacturing Corp. |
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430-10-228-00-240000 | Mill-Max Manufacturing Corp. |
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430-10-230-00-240000 | Mill-Max Manufacturing Corp. |
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430-10-232-00-240000 | Mill-Max Manufacturing Corp. |
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430-10-234-00-240000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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510-93-132-14-071001 | Mill-Max Manufacturing Corp. |
Description: PGA SOCK 132PIN 14X14 SOLDER TL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 132 (14 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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523-93-132-14-071001 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 132 (14 x 14) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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515-93-135-14-051001 | Mill-Max Manufacturing Corp. |
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515-93-135-14-051002 | Mill-Max Manufacturing Corp. |
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515-93-135-14-051003 | Mill-Max Manufacturing Corp. |
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515-93-136-14-051001 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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515-93-136-14-051002 | Mill-Max Manufacturing Corp. |
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515-93-136-14-051003 | Mill-Max Manufacturing Corp. |
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714-93-131-31-012000 | Mill-Max Manufacturing Corp. |
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714-93-131-31-018000 | Mill-Max Manufacturing Corp. |
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714-93-131-31-007000 | Mill-Max Manufacturing Corp. |
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714-93-130-41-001000 | Mill-Max Manufacturing Corp. |
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714-93-131-41-001000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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310-13-164-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN HDR STRIP 64 POS GOLD |
Produkt ist nicht verfügbar |
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110-91-648-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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515-13-076-11-041003 | Mill-Max Manufacturing Corp. |
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515-13-081-09-000001 | Mill-Max Manufacturing Corp. |
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515-13-081-09-000002 | Mill-Max Manufacturing Corp. |
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515-13-081-09-000003 | Mill-Max Manufacturing Corp. |
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515-13-084-10-031001 | Mill-Max Manufacturing Corp. |
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515-13-084-10-031002 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
523-93-281-19-081003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA WRAPOST
Description: SKT PGA WRAPOST
Produkt ist nicht verfügbar
614-93-084-12-051001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-084-11-045012 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-084-12-051007 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-084-12-051012 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Packaging: Bulk
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-93-084-13-081001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-084-13-081007 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
3116-2-00-15-00-00-08-0 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .017DIA GOLD
Description: CONN PC PIN CIRC .017DIA GOLD
Produkt ist nicht verfügbar
800-40-001-62-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 1POS
Description: CONN HEADER VERT 1POS
Produkt ist nicht verfügbar
801-99-001-62-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 1POS TIN-LEAD PCB
Description: CONN RCPT 1POS TIN-LEAD PCB
Produkt ist nicht verfügbar
801-41-001-62-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 1POS GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.143" (3.63mm)
Insulation Height: 0.276" (7.00mm)
Number of Rows: 1
Description: CONN RCPT 1POS GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 1
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.143" (3.63mm)
Insulation Height: 0.276" (7.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
511-93-012-05-001002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-93-012-05-001003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (5 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-93-022-05-001002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
511-93-022-05-001003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
511-93-025-05-000001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
111-93-432-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
515-93-032-01-503001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-032-01-503002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
515-93-032-01-503003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-032-01-503001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
515-13-032-01-503002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
515-13-032-01-503003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
803-91-080-10-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 80POS 0.1 GOLD PCB
Description: CONN RCPT 80POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
803-91-076-30-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 76POS 0.1 GOLD SMD
Description: CONN RCPT 76POS 0.1 GOLD SMD
Produkt ist nicht verfügbar
349-10-126-00-560000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 26POS 2.54MM
Description: CONN HEADER SMD 26POS 2.54MM
Produkt ist nicht verfügbar
0152-0-15-80-30-84-04-0 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Tin
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.600" (15.24mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 100.0µin (2.54µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm)
Socket Depth: 0.150" (3.81mm)
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Tin
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.600" (15.24mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 100.0µin (2.54µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm)
Socket Depth: 0.150" (3.81mm)
auf Bestellung 499 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
10+ | 1.9 EUR |
11+ | 1.61 EUR |
100+ | 1.45 EUR |
342-40-103-00-593000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR 3POS 0.1 STACK T/H TIN
Description: CONN HDR 3POS 0.1 STACK T/H TIN
Produkt ist nicht verfügbar
342-40-103-00-594000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR 3POS 0.1 STACK T/H TIN
Description: CONN HDR 3POS 0.1 STACK T/H TIN
Produkt ist nicht verfügbar
110-13-322-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
110-13-322-61-801000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-13-624-61-801000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
430-10-220-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 20POS SLD PCB
Packaging: Tube
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole, Solder Cup
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Contacts: 20
Number of Rows: 2
Description: CONN SPRING TARGET 20POS SLD PCB
Packaging: Tube
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole, Solder Cup
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Contacts: 20
Number of Rows: 2
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)430-10-222-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 22POS SLD PCB
Description: CONN SPRING TARGET 22POS SLD PCB
Produkt ist nicht verfügbar
430-10-226-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 26POS SLD PCB
Description: CONN SPRING TARGET 26POS SLD PCB
Produkt ist nicht verfügbar
430-10-228-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 28POS SLD PCB
Description: CONN SPRING TARGET 28POS SLD PCB
Produkt ist nicht verfügbar
430-10-230-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 30POS SLD PCB
Description: CONN SPRING TARGET 30POS SLD PCB
Produkt ist nicht verfügbar
430-10-232-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 32POS SLD PCB
Description: CONN SPRING TARGET 32POS SLD PCB
Produkt ist nicht verfügbar
430-10-234-00-240000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 34POS SLD PCB
Description: CONN SPRING TARGET 34POS SLD PCB
Produkt ist nicht verfügbar
510-93-132-14-071001 |
Hersteller: Mill-Max Manufacturing Corp.
Description: PGA SOCK 132PIN 14X14 SOLDER TL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Description: PGA SOCK 132PIN 14X14 SOLDER TL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
523-93-132-14-071001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: PGA SOCK 132PIN 14X14 WIRE WRAP
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: PGA SOCK 132PIN 14X14 WIRE WRAP
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 132 (14 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
515-93-135-14-051001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-135-14-051002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-135-14-051003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-136-14-051001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-136-14-051002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-136-14-051003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
714-93-131-31-012000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-93-131-31-018000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-93-131-31-007000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-93-130-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 30POS 0.1 GOLD PCB
Description: CONN RCPT 30POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-93-131-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
310-13-164-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR STRIP 64 POS GOLD
Description: CONN HDR STRIP 64 POS GOLD
Produkt ist nicht verfügbar
110-91-648-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
515-13-076-11-041003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-081-09-000001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-081-09-000002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-081-09-000003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-084-10-031001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-084-10-031002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar