Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (39559) > Seite 376 nach 660
Foto | Bezeichnung | Hersteller | Beschreibung |
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851-43-020-10-003000 | Mill-Max Manufacturing Corp. | Description: STANDARD SOCKET HEADER |
Produkt ist nicht verfügbar |
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515-93-154-13-021001 | Mill-Max Manufacturing Corp. |
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515-93-154-13-021002 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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515-93-154-13-021003 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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515-13-154-13-021001 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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515-13-154-13-021002 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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515-13-154-13-021003 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-93-154-13-021001 | Mill-Max Manufacturing Corp. |
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614-93-154-13-021007 | Mill-Max Manufacturing Corp. |
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614-93-154-13-021012 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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614-13-154-13-021001 | Mill-Max Manufacturing Corp. |
![]() Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
Produkt ist nicht verfügbar |
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614-13-154-13-021007 | Mill-Max Manufacturing Corp. |
![]() Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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614-13-154-13-021012 | Mill-Max Manufacturing Corp. |
![]() Features: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-93-154-13-021001 | Mill-Max Manufacturing Corp. |
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510-93-154-13-021003 | Mill-Max Manufacturing Corp. |
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551-90-154-13-021003 | Mill-Max Manufacturing Corp. |
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511-93-154-13-021001 | Mill-Max Manufacturing Corp. |
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511-93-154-13-021002 | Mill-Max Manufacturing Corp. |
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511-93-154-13-021003 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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510-13-154-13-021001 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-13-154-13-021002 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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510-13-154-13-021003 | Mill-Max Manufacturing Corp. |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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551-90-154-13-021005 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
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511-13-154-13-021001 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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511-13-154-13-021002 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 154 (13 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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801-43-013-10-003000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole Number of Positions: 13 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.165" (4.20mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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850-10-014-10-001000 | Mill-Max Manufacturing Corp. |
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310-44-135-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 35POS 0.1 TIN PCB |
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310-47-136-41-001000 | Mill-Max Manufacturing Corp. |
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801-99-009-62-001000 | Mill-Max Manufacturing Corp. |
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115-93-420-41-003000 | Mill-Max Manufacturing Corp. |
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940-44-068-17-400004 | Mill-Max Manufacturing Corp. |
![]() Features: Closed Frame Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: PLCC Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 150.0µin (3.81µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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110-47-628-41-001000 | Mill-Max Manufacturing Corp. |
![]() Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
auf Bestellung 376 Stücke: Lieferzeit 10-14 Tag (e) |
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310-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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315-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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315-41-159-41-003000 | Mill-Max Manufacturing Corp. |
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315-91-159-41-003000 | Mill-Max Manufacturing Corp. |
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346-41-159-41-012000 | Mill-Max Manufacturing Corp. |
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346-91-159-41-012000 | Mill-Max Manufacturing Corp. |
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346-41-159-41-013000 | Mill-Max Manufacturing Corp. |
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346-91-159-41-013000 | Mill-Max Manufacturing Corp. |
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316-41-159-41-006000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.236" (6.00mm) Number of Rows: 1 |
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316-91-159-41-006000 | Mill-Max Manufacturing Corp. |
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311-41-159-41-001000 | Mill-Max Manufacturing Corp. |
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311-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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714-41-159-41-001000 | Mill-Max Manufacturing Corp. |
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714-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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316-41-159-41-003000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.315" (8.00mm) Number of Rows: 1 |
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316-91-159-41-003000 | Mill-Max Manufacturing Corp. |
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322-41-159-41-001000 | Mill-Max Manufacturing Corp. |
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322-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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712-41-159-41-001000 | Mill-Max Manufacturing Corp. |
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712-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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310-41-159-41-105000 | Mill-Max Manufacturing Corp. |
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310-91-159-41-105000 | Mill-Max Manufacturing Corp. |
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316-41-159-41-007000 | Mill-Max Manufacturing Corp. |
![]() Packaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.402" (10.20mm) Number of Rows: 1 |
Produkt ist nicht verfügbar |
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316-91-159-41-007000 | Mill-Max Manufacturing Corp. |
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323-41-159-41-001000 | Mill-Max Manufacturing Corp. |
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323-91-159-41-001000 | Mill-Max Manufacturing Corp. |
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316-41-159-41-008000 | Mill-Max Manufacturing Corp. |
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Produkt ist nicht verfügbar |
851-43-020-10-003000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Description: STANDARD SOCKET HEADER
Produkt ist nicht verfügbar
515-93-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-154-13-021002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-93-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
515-13-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
515-13-154-13-021002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
515-13-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-93-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-154-13-021007 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-93-154-13-021012 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
Produkt ist nicht verfügbar
614-13-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Produkt ist nicht verfügbar
614-13-154-13-021007 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
614-13-154-13-021012 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-93-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
510-93-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
551-90-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Description: CONN HDR SOLDRTL
Produkt ist nicht verfügbar
511-93-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
511-93-154-13-021002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
511-93-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
Produkt ist nicht verfügbar
510-13-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-13-154-13-021002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
510-13-154-13-021003 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
551-90-154-13-021005 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Description: CONN HDR SOLDRTL
Produkt ist nicht verfügbar
511-13-154-13-021001 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
511-13-154-13-021002 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 154 (13 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
801-43-013-10-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.165" (4.20mm)
Number of Rows: 1
Description: CONN RCPT 13POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 13
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.165" (4.20mm)
Number of Rows: 1
Produkt ist nicht verfügbar
850-10-014-10-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 14POS 1.27MM
Description: CONN HEADER VERT 14POS 1.27MM
Produkt ist nicht verfügbar
310-44-135-61-001000 |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 35POS 0.1 TIN PCB
Description: CONN RCPT 35POS 0.1 TIN PCB
Produkt ist nicht verfügbar
310-47-136-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 36POS 0.1 GOLD PCB
Description: CONN RCPT 36POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
801-99-009-62-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 9POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 9POS 0.1 TIN-LEAD PCB
Produkt ist nicht verfügbar
115-93-420-41-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Description: CONN IC DIP SOCKET 20POS GOLD
Produkt ist nicht verfügbar
940-44-068-17-400004 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SKT PLCC
Features: Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN SKT PLCC
Features: Closed Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: PLCC
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150.0µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
110-47-628-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
auf Bestellung 376 Stücke:
Lieferzeit 10-14 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 3.54 EUR |
14+ | 3.09 EUR |
28+ | 2.95 EUR |
56+ | 2.89 EUR |
112+ | 2.76 EUR |
252+ | 2.49 EUR |
310-91-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
315-91-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
315-41-159-41-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
315-91-159-41-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
346-41-159-41-012000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
346-91-159-41-012000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
346-41-159-41-013000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
346-91-159-41-013000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
316-41-159-41-006000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
316-91-159-41-006000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
311-41-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
311-91-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-41-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
714-91-159-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
316-41-159-41-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Produkt ist nicht verfügbar
316-91-159-41-003000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
322-41-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
322-91-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
712-41-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
712-91-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
310-41-159-41-105000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD SMD
Description: CONN RCPT 59POS 0.1 GOLD SMD
Produkt ist nicht verfügbar
310-91-159-41-105000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD SMD
Description: CONN RCPT 59POS 0.1 GOLD SMD
Produkt ist nicht verfügbar
316-41-159-41-007000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.402" (10.20mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.402" (10.20mm)
Number of Rows: 1
Produkt ist nicht verfügbar
316-91-159-41-007000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
323-41-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
323-91-159-41-001000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Description: CONN RCPT 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar
316-41-159-41-008000 |
![]() |
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Produkt ist nicht verfügbar