Produkte > MILL-MAX MANUFACTURING CORP. > Alle Produkte des Herstellers MILL-MAX MANUFACTURING CORP. (39330) > Seite 204 nach 656
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
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| 210-33-314-41-101000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC SKT DBLPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| 210-33-316-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| 210-33-318-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| 210-33-422-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 30.0µin (0.76µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| 210-33-624-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-33-632-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 2103-4-01-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.305" (7.75mm) Termination: Swage Mounting Hole Diameter: 0.052" (1.32mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End, Slotted Pin Size - Above Flange: 0.062" (1.57mm) Dia Length - Below Flange: 0.149" (3.78mm) Length - Above Flange: 0.125" (3.18mm) |
Produkt ist nicht verfügbar |
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| 2104-1-01-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC |
Produkt ist nicht verfügbar |
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| 210-41-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-308-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-310-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-314-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-318-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-320-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-322-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-324-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-41-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-41-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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| 210-43-636-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-43-964-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.9" (22.86mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 64 (2 x 32) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-44-314-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT |
Produkt ist nicht verfügbar |
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| 210-44-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT |
Produkt ist nicht verfügbar |
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| 210-44-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-44-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT |
Produkt ist nicht verfügbar |
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| 210-47-422-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT |
Produkt ist nicht verfügbar |
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| 210-47-424-41-001000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDRTL DBL SKT |
Produkt ist nicht verfügbar |
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| 2107-3-01-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.094" (2.39mm) Terminal Type: PC Pin Flange Diameter: 0.070" (1.78mm) Length - Overall: 0.269" (6.83mm) Termination: Swage Mounting Hole Diameter: 0.052" (1.32mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End, Slotted Pin Size - Above Flange: 0.070" (1.78mm) Dia Length - Below Flange: 0.113" (2.87mm) Length - Above Flange: 0.128" (3.25mm) |
Produkt ist nicht verfügbar |
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| 2107-4-01-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.125" (3.18mm) Terminal Type: PC Pin Flange Diameter: 0.070" (1.78mm) Length - Overall: 0.301" (7.65mm) Termination: Swage Mounting Hole Diameter: 0.052" (1.32mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End, Slotted Pin Size - Above Flange: 0.070" (1.78mm) Dia Length - Below Flange: 0.145" (3.68mm) Length - Above Flange: 0.128" (3.25mm) |
Produkt ist nicht verfügbar |
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| 2108-2-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.062" (1.57mm) Terminal Type: Single End Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.240" (6.10mm) Termination: Swage Length - Above Board: 0.156" (3.96mm) Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.040" (1.02mm) Number of Turrets: Double Length - Below Flange: 0.084" (2.13mm) Staking Side OD: 0.040" (1.02mm) Staking Side ID: 0.024" (0.61mm) |
Produkt ist nicht verfügbar |
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| 2108-3-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.094" (2.39mm) Terminal Type: Single End Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.271" (6.88mm) Termination: Swage Length - Above Board: 0.156" (3.96mm) Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.040" (1.02mm) Number of Turrets: Double Length - Below Flange: 0.115" (2.92mm) Staking Side OD: 0.040" (1.02mm) Staking Side ID: 0.024" (0.61mm) Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-83-320-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-83-422-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 300.0µin (7.62µm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
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| 210-83-640-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-88-422-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-88-624-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-88-632-41-101000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-91-306-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-91-318-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
Produkt ist nicht verfügbar |
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| 210-91-424-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-91-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-91-628-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-91-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
Produkt ist nicht verfügbar |
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| 210-91-636-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-91-964-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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| 210-93-636-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
Produkt ist nicht verfügbar |
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2111-2-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.062" (1.57mm) Terminal Type: Single End Flange Diameter: 0.047" (1.19mm) Length - Overall: 0.154" (3.91mm) Termination: Swage Length - Above Board: 0.070" (1.78mm) Mounting Hole Diameter: 0.033" (0.84mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.032" (0.81mm) Number of Turrets: Double Length - Below Flange: 0.084" (2.13mm) Staking Side OD: 0.030" (0.76mm) Staking Side ID: 0.020" (0.51mm) |
auf Bestellung 713 Stücke: Lieferzeit 10-14 Tag (e) |
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| 2112-4-01-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.125" (3.18mm) Terminal Type: PC Pin Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.272" (6.91mm) Termination: Swage Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End, Slotted Pin Size - Above Flange: 0.062" (1.57mm) Dia Length - Below Flange: 0.147" (3.73mm) Length - Above Flange: 0.125" (3.18mm) |
Produkt ist nicht verfügbar |
||||||||
| 2113-1-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: Single End Flange Diameter: 0.062" (1.57mm) Length - Overall: 0.147" (3.73mm) Termination: Swage Length - Above Board: 0.094" (2.39mm) Mounting Hole Diameter: 0.043" (1.09mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.040" (1.02mm) Number of Turrets: Single Length - Below Flange: 0.053" (1.35mm) Staking Side OD: 0.040" (1.02mm) Staking Side ID: 0.020" (0.51mm) |
Produkt ist nicht verfügbar |
||||||||
| 223-33-624-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-33-628-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-33-964-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-88-314-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-88-316-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-88-318-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-88-422-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Material - Post: Brass Alloy Part Status: Obsolete |
Produkt ist nicht verfügbar |
||||||||
| 223-88-624-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 223-88-632-41-101000 | Mill-Max Manufacturing Corp. |
Description: SKT IC CLOSED |
Produkt ist nicht verfügbar |
||||||||
| 2297-2-17-80-16-14-02-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.070" (1.78mm) Length - Overall: 0.545" (13.84mm) Termination: Press-Fit, Knurled Mounting Hole Diameter: 0.067" (1.70mm) Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Tail Type: Wire Wrap Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm) Pin Hole Diameter: 0.051" (1.30mm) Tail Diameter: 0.025" (0.64mm) Square Socket Depth: 0.150" (3.81mm) Part Status: Active |
Produkt ist nicht verfügbar |
||||||||
| 2297-2-17-80-16-27-02-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.070" (1.78mm) Length - Overall: 0.545" (13.84mm) Termination: Press-Fit, Knurled Mounting Hole Diameter: 0.067" (1.70mm) Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Wire Wrap Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm) Pin Hole Diameter: 0.051" (1.30mm) Tail Diameter: 0.025" (0.64mm) Square Socket Depth: 0.150" (3.81mm) Part Status: Active |
Produkt ist nicht verfügbar |
| 210-33-314-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 210-33-316-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 210-33-318-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC SKT DBL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 210-33-422-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC SKT DBL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 210-33-624-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-33-632-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 2103-4-01-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.305" (7.75mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.062" (1.57mm) Dia
Length - Below Flange: 0.149" (3.78mm)
Length - Above Flange: 0.125" (3.18mm)
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.305" (7.75mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.062" (1.57mm) Dia
Length - Below Flange: 0.149" (3.78mm)
Length - Above Flange: 0.125" (3.18mm)
Produkt ist nicht verfügbar
| 2104-1-01-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
Produkt ist nicht verfügbar
| 210-41-306-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-308-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-310-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-314-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-316-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-318-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-320-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-322-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-324-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-41-624-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-41-632-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 210-43-636-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-43-964-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.9" (22.86mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-44-314-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Description: STANDRD SOLDRTL DBL SKT
Produkt ist nicht verfügbar
| 210-44-316-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Description: STANDRD SOLDRTL DBL SKT
Produkt ist nicht verfügbar
| 210-44-624-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: STANDRD SOLDRTL DBL SKT
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-44-632-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Description: STANDRD SOLDRTL DBL SKT
Produkt ist nicht verfügbar
| 210-47-422-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Description: STANDRD SOLDRTL DBL SKT
Produkt ist nicht verfügbar
| 210-47-424-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDRTL DBL SKT
Description: STANDRD SOLDRTL DBL SKT
Produkt ist nicht verfügbar
| 2107-3-01-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.094" (2.39mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.269" (6.83mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.070" (1.78mm) Dia
Length - Below Flange: 0.113" (2.87mm)
Length - Above Flange: 0.128" (3.25mm)
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.094" (2.39mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.269" (6.83mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.070" (1.78mm) Dia
Length - Below Flange: 0.113" (2.87mm)
Length - Above Flange: 0.128" (3.25mm)
Produkt ist nicht verfügbar
| 2107-4-01-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.125" (3.18mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.301" (7.65mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.070" (1.78mm) Dia
Length - Below Flange: 0.145" (3.68mm)
Length - Above Flange: 0.128" (3.25mm)
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.125" (3.18mm)
Terminal Type: PC Pin
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.301" (7.65mm)
Termination: Swage
Mounting Hole Diameter: 0.052" (1.32mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.070" (1.78mm) Dia
Length - Below Flange: 0.145" (3.68mm)
Length - Above Flange: 0.128" (3.25mm)
Produkt ist nicht verfügbar
| 2108-2-00-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.240" (6.10mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Double
Length - Below Flange: 0.084" (2.13mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.024" (0.61mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.240" (6.10mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Double
Length - Below Flange: 0.084" (2.13mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.024" (0.61mm)
Produkt ist nicht verfügbar
| 2108-3-00-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.094" (2.39mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.271" (6.88mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Double
Length - Below Flange: 0.115" (2.92mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.024" (0.61mm)
Part Status: Active
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.094" (2.39mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.271" (6.88mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Double
Length - Below Flange: 0.115" (2.92mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.024" (0.61mm)
Part Status: Active
Produkt ist nicht verfügbar
| 210-83-320-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-83-422-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 300.0µin (7.62µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 300.0µin (7.62µm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 210-83-640-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-88-422-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-88-624-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-88-632-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-91-306-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-91-318-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Produkt ist nicht verfügbar
| 210-91-424-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-91-624-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-91-628-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-91-632-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Produkt ist nicht verfügbar
| 210-91-636-41-001000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-91-964-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 210-93-636-41-001000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
Produkt ist nicht verfügbar
| 2111-2-00-80-00-00-07-0 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.047" (1.19mm)
Length - Overall: 0.154" (3.91mm)
Termination: Swage
Length - Above Board: 0.070" (1.78mm)
Mounting Hole Diameter: 0.033" (0.84mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.032" (0.81mm)
Number of Turrets: Double
Length - Below Flange: 0.084" (2.13mm)
Staking Side OD: 0.030" (0.76mm)
Staking Side ID: 0.020" (0.51mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.062" (1.57mm)
Terminal Type: Single End
Flange Diameter: 0.047" (1.19mm)
Length - Overall: 0.154" (3.91mm)
Termination: Swage
Length - Above Board: 0.070" (1.78mm)
Mounting Hole Diameter: 0.033" (0.84mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.032" (0.81mm)
Number of Turrets: Double
Length - Below Flange: 0.084" (2.13mm)
Staking Side OD: 0.030" (0.76mm)
Staking Side ID: 0.020" (0.51mm)
auf Bestellung 713 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 15+ | 1.18 EUR |
| 18+ | 1 EUR |
| 100+ | 0.9 EUR |
| 2112-4-01-80-00-00-07-0 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.125" (3.18mm)
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.272" (6.91mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.062" (1.57mm) Dia
Length - Below Flange: 0.147" (3.73mm)
Length - Above Flange: 0.125" (3.18mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.125" (3.18mm)
Terminal Type: PC Pin
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.272" (6.91mm)
Termination: Swage
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End, Slotted
Pin Size - Above Flange: 0.062" (1.57mm) Dia
Length - Below Flange: 0.147" (3.73mm)
Length - Above Flange: 0.125" (3.18mm)
Produkt ist nicht verfügbar
| 2113-1-00-80-00-00-07-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.147" (3.73mm)
Termination: Swage
Length - Above Board: 0.094" (2.39mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Single
Length - Below Flange: 0.053" (1.35mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.020" (0.51mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.062" (1.57mm)
Length - Overall: 0.147" (3.73mm)
Termination: Swage
Length - Above Board: 0.094" (2.39mm)
Mounting Hole Diameter: 0.043" (1.09mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.040" (1.02mm)
Number of Turrets: Single
Length - Below Flange: 0.053" (1.35mm)
Staking Side OD: 0.040" (1.02mm)
Staking Side ID: 0.020" (0.51mm)
Produkt ist nicht verfügbar
| 223-33-624-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-33-628-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-33-964-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-88-314-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-88-316-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-88-318-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-88-422-41-101000 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Description: SKT IC CLOSED
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass Alloy
Part Status: Obsolete
Produkt ist nicht verfügbar
| 223-88-624-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 223-88-632-41-101000 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT IC CLOSED
Description: SKT IC CLOSED
Produkt ist nicht verfügbar
| 2297-2-17-80-16-14-02-0 |
|
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.545" (13.84mm)
Termination: Press-Fit, Knurled
Mounting Hole Diameter: 0.067" (1.70mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm)
Pin Hole Diameter: 0.051" (1.30mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.150" (3.81mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.545" (13.84mm)
Termination: Press-Fit, Knurled
Mounting Hole Diameter: 0.067" (1.70mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm)
Pin Hole Diameter: 0.051" (1.30mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.150" (3.81mm)
Part Status: Active
Produkt ist nicht verfügbar
| 2297-2-17-80-16-27-02-0 |
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Hersteller: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.545" (13.84mm)
Termination: Press-Fit, Knurled
Mounting Hole Diameter: 0.067" (1.70mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm)
Pin Hole Diameter: 0.051" (1.30mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.150" (3.81mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.070" (1.78mm)
Length - Overall: 0.545" (13.84mm)
Termination: Press-Fit, Knurled
Mounting Hole Diameter: 0.067" (1.70mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.022" ~ 0.034" (0.56mm ~ 0.86mm)
Pin Hole Diameter: 0.051" (1.30mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.150" (3.81mm)
Part Status: Active
Produkt ist nicht verfügbar