Produkte > MICROCHIP TECHNOLOGY > Alle Produkte des Herstellers MICROCHIP TECHNOLOGY (354744) > Seite 1718 nach 5913
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MPFS095T-FCVG784E | Microchip Technology |
 Description: IC SOC RISC-V 784BGAPackaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: 0°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095T-1FCVG784E | Microchip Technology |
Description: IC SOC RISC-V 784BGA Packaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: 0°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095T-FCVG784I | Microchip Technology |
Description: IC SOC RISC-V 784BGA Packaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095TLS-FCVG784I | Microchip Technology |
Description: IC SOC RISC-V 784BGA Packaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095T-FCSG325I | Microchip Technology |
Description: IC SOC RISC-V 325LFBGA Packaging: Bulk Package / Case: 325-LFBGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 325-LFBGA (11x14.5) Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS160T-1FCVG484I | Microchip Technology |
Description: IC SOC RISC-V 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA RAM Size: 1.4125MB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 161K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS025TL-FCVG484I | Microchip Technology |
Description: IC SOC RISC-V 484FBGA Packaging: Tray Package / Case: 484-BFBGA RAM Size: 230.4KB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 23K Logic Modules Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 484-FBGA (19x19) Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095T-1FCVG784I | Microchip Technology |
Description: IC SOC RISC-V 784BGA Packaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095TS-1FCVG784I | Microchip Technology |
Description: IC SOC RISC-V 784BGA Packaging: Tray Package / Case: 784-BGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 784-BGA Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095T-FCVG484I | Microchip Technology |
Description: IC SOC RISC-V 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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MPFS095TL-FCVG484I | Microchip Technology |
Description: IC SOC RISC-V 484FCBGA Packaging: Tray Package / Case: 484-BFBGA, FCBGA RAM Size: 857.6kB Operating Temperature: -40°C ~ 100°C Core Processor: RISC-V Primary Attributes: FPGA - 93K Logic Modules Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG Peripherals: DMA, PCI, PWM Supplier Device Package: 484-FCBGA (19x19) Architecture: MPU, FPGA Flash Size: 128KB Part Status: Active |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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MCP1811BT-025/LT | Microchip Technology |
Description: IC REG LINEAR 2.5V 150MA SC70-5 Packaging: Tape & Reel (TR) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C (TJ) Output Configuration: Positive Current - Quiescent (Iq): 0.5 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: SC-70-5 Voltage - Output (Min/Fixed): 2.5V Control Features: Enable Part Status: Obsolete PSRR: 50dB (1kHz) Voltage Dropout (Max): 0.6V @ 150mA Protection Features: Over Current Current - Supply (Max): 110 µA |
Produkt ist nicht verfügbar |
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MCP1811BT-025/LT | Microchip Technology |
Description: IC REG LINEAR 2.5V 150MA SC70-5 Packaging: Cut Tape (CT) Package / Case: 5-TSSOP, SC-70-5, SOT-353 Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C (TJ) Output Configuration: Positive Current - Quiescent (Iq): 0.5 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: SC-70-5 Voltage - Output (Min/Fixed): 2.5V Control Features: Enable Part Status: Obsolete PSRR: 50dB (1kHz) Voltage Dropout (Max): 0.6V @ 150mA Protection Features: Over Current Current - Supply (Max): 110 µA |
Produkt ist nicht verfügbar |
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ATTINY861V-10MUR | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 32VQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 10MHz Program Memory Size: 8KB (4K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Part Status: Active Number of I/O: 16 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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ATTINY861V-10MUR | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 32VQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 10MHz Program Memory Size: 8KB (4K x 16) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 11x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 32-VQFN (5x5) Part Status: Active Number of I/O: 16 DigiKey Programmable: Verified |
auf Bestellung 5922 Stücke: Lieferzeit 10-14 Tag (e) |
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MSCSM70TLM10C3AG | Microchip Technology |
Description: SIC 4N-CH 700V 241A MODULE Packaging: Box Package / Case: Module Mounting Type: Through Hole Configuration: 4 N-Channel Operating Temperature: -40°C ~ 175°C (TJ) Technology: Silicon Carbide (SiC) Power - Max: 690W (Tc) Drain to Source Voltage (Vdss): 700V Current - Continuous Drain (Id) @ 25°C: 241A (Tc) Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V Vgs(th) (Max) @ Id: 2.4V @ 8mA (Typ) Supplier Device Package: Module Part Status: Active |
auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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APT10M19BVRG | Microchip Technology |
Description: MOSFET N-CH 100V 75A TO247 Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 19mOhm @ 500mA, 10V Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: TO-247 [B] Part Status: Active Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 300 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6120 pF @ 25 V |
auf Bestellung 37 Stücke: Lieferzeit 10-14 Tag (e) |
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dsPIC33EP32GS502T-I/MM | Microchip Technology |
Description: IC MCU 16BIT 32KB FLASH 28QFN Packaging: Tape & Reel (TR) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 70 MIPs Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC Data Converters: A/D 12x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-QFN-S (6x6) Part Status: Active Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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dsPIC33EP32GS502T-I/MM | Microchip Technology |
Description: IC MCU 16BIT 32KB FLASH 28QFN Packaging: Cut Tape (CT) Package / Case: 28-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 70 MIPs Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC Data Converters: A/D 12x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I²C, IrDA, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-QFN-S (6x6) Part Status: Active Number of I/O: 21 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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ATMEGA88PA-MMH | Microchip Technology |
 Description: IC MCU 8BIT 8KB FLASH 28VQFNPackaging: Tray Package / Case: 28-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (4K x 16) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 28-VQFN (4x4) Part Status: Active Number of I/O: 23 DigiKey Programmable: Not Verified |
auf Bestellung 478 Stücke: Lieferzeit 10-14 Tag (e) |
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ATTINY44A-PU | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 20MHz Program Memory Size: 4KB (2K x 16) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT Supplier Device Package: 14-PDIP Part Status: Active Number of I/O: 12 DigiKey Programmable: Verified |
auf Bestellung 1070 Stücke: Lieferzeit 10-14 Tag (e) |
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AT89LV52-12PI | Microchip Technology |
Description: IC MCU 8BIT 8KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 12MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V Connectivity: UART/USART Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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AT89LV51-12PI | Microchip Technology |
Description: IC MCU 8BIT 4KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 12MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V Connectivity: UART/USART Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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1N5809 | Microchip Technology |
Description: DIODE GEN PURP 100V 3A AXIAL Packaging: Bulk Package / Case: B, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 30 ns Technology: Standard Capacitance @ Vr, F: 60pF @ 10V, 1MHz Current - Average Rectified (Io): 3A Supplier Device Package: B, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A Current - Reverse Leakage @ Vr: 5 µA @ 100 V |
auf Bestellung 760 Stücke: Lieferzeit 10-14 Tag (e) |
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1N5804 | Microchip Technology |
Description: DIODE GEN PURP 100V 1A AXIAL Packaging: Bulk Package / Case: A, Axial Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 25 ns Technology: Standard Capacitance @ Vr, F: 25pF @ 10V, 1MHz Current - Average Rectified (Io): 1A Supplier Device Package: A, Axial Operating Temperature - Junction: -65°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 100 V Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A Current - Reverse Leakage @ Vr: 1 µA @ 100 V |
auf Bestellung 345 Stücke: Lieferzeit 10-14 Tag (e) |
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MNS2N3700UB/TR | Microchip Technology |
Description: MNS2N3700UB Packaging: Tape & Reel (TR) Part Status: Active Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Supplier Device Package: UB |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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MNS2N3700UB/TR | Microchip Technology |
Description: MNS2N3700UB Packaging: Cut Tape (CT) Part Status: Active Package / Case: 3-SMD, No Lead Mounting Type: Surface Mount Supplier Device Package: UB |
auf Bestellung 100 Stücke: Lieferzeit 10-14 Tag (e) |
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ATTINY24A-MMHR | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 20VQFN Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT Supplier Device Package: 20-VQFN (3x3) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 12000 Stücke: Lieferzeit 10-14 Tag (e) |
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ATTINY24A-MMHR | Microchip Technology |
Description: IC MCU 8BIT 2KB FLASH 20VQFN Packaging: Cut Tape (CT) Package / Case: 20-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 2KB (1K x 16) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128 x 8 Core Processor: AVR Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: USI Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT Supplier Device Package: 20-VQFN (3x3) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
auf Bestellung 16524 Stücke: Lieferzeit 10-14 Tag (e) |
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| DSA400-3333Q0172KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 156.25MHz Frequency - Output 2: 156.25MHz Part Status: Active Frequency - Output 3: 156.25MHz Frequency - Output 4: 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-3333Q0078KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 125MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-3333Q0172KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 156.25MHz Frequency - Output 2: 156.25MHz Part Status: Active Frequency - Output 3: 156.25MHz Frequency - Output 4: 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-4444Q0001KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-4441Q0170KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL, LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 50MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-1111Q0169KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 56mA Frequency - Output 1: 25MHz Frequency - Output 2: 50MHz Part Status: Active Frequency - Output 3: 50MHz Frequency - Output 4: 25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-3333Q0171KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz, 156.25MHz Frequency - Output 2: 125MHz, 156.25MHz Part Status: Active Frequency - Output 3: 125MHz, 156.25MHz Frequency - Output 4: 125MHz, 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-3333Q0001KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
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| DSA400-3333Q0172KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 156.25MHz Frequency - Output 2: 156.25MHz Part Status: Active Frequency - Output 3: 156.25MHz Frequency - Output 4: 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0001KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0167KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0001KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0078KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 125MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0172KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 156.25MHz Frequency - Output 2: 156.25MHz Part Status: Active Frequency - Output 3: 156.25MHz Frequency - Output 4: 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0167KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0001KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0078KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 125MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-1111Q0169KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 56mA Frequency - Output 1: 25MHz Frequency - Output 2: 50MHz Part Status: Active Frequency - Output 3: 50MHz Frequency - Output 4: 25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0171KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz, 156.25MHz Frequency - Output 2: 125MHz, 156.25MHz Part Status: Active Frequency - Output 3: 125MHz, 156.25MHz Frequency - Output 4: 125MHz, 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0171KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz, 156.25MHz Frequency - Output 2: 125MHz, 156.25MHz Part Status: Active Frequency - Output 3: 125MHz, 156.25MHz Frequency - Output 4: 125MHz, 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0168KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz, 125MHz Frequency - Output 2: 100MHz, 125MHz Part Status: Active Frequency - Output 3: 100MHz, 125MHz Frequency - Output 4: 100MHz, 125MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0171KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz, 156.25MHz Frequency - Output 2: 125MHz, 156.25MHz Part Status: Active Frequency - Output 3: 125MHz, 156.25MHz Frequency - Output 4: 125MHz, 156.25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0167KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4441Q0170KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL, LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 50MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-1111Q0169KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 56mA Frequency - Output 1: 25MHz Frequency - Output 2: 50MHz Part Status: Active Frequency - Output 3: 50MHz Frequency - Output 4: 25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4441Q0170KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL, LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 50MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4444Q0001KL2VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0001KL1TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 100MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-3333Q0078KL1VAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tube Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVDS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±50ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 48mA Frequency - Output 1: 125MHz Frequency - Output 2: 125MHz Part Status: Active Frequency - Output 3: 125MHz Frequency - Output 4: 125MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-1111Q0169KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 56mA Frequency - Output 1: 25MHz Frequency - Output 2: 50MHz Part Status: Active Frequency - Output 3: 50MHz Frequency - Output 4: 25MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
||||||||
| DSA400-4441Q0170KL2TVAO | Microchip Technology |
Description: OSC MEMS AUTO -40C-105C SMD Packaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm) Output: HCSL, LVCMOS Function: Enable/Disable (Reprogrammable) Type: MEMS (Silicon) Operating Temperature: -40°C ~ 105°C Frequency Stability: ±25ppm Voltage - Supply: 2.25V ~ 3.6V Height: 0.035" (0.90mm) Ratings: AEC-Q100 Current - Supply (Max): 88mA Frequency - Output 1: 50MHz Frequency - Output 2: 100MHz Part Status: Active Frequency - Output 3: 100MHz Frequency - Output 4: 100MHz Base Resonator: MEMS |
Produkt ist nicht verfügbar |
| MPFS095T-FCVG784E |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 374.79 EUR |
| MPFS095T-1FCVG784E |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: 0°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 412.26 EUR |
| MPFS095T-FCVG784I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 412.26 EUR |
| MPFS095TLS-FCVG784I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 624.85 EUR |
| MPFS095T-FCSG325I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 325LFBGA
Packaging: Bulk
Package / Case: 325-LFBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 325-LFBGA (11x14.5)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 325LFBGA
Packaging: Bulk
Package / Case: 325-LFBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 325-LFBGA (11x14.5)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 362.79 EUR |
| MPFS160T-1FCVG484I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 1.4125MB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 161K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 1.4125MB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 161K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 605.26 EUR |
| MPFS025TL-FCVG484I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 484FBGA
Packaging: Tray
Package / Case: 484-BFBGA
RAM Size: 230.4KB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 23K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 145.52 EUR |
| MPFS095T-1FCVG784I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 493.29 EUR |
| MPFS095TS-1FCVG784I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 784BGA
Packaging: Tray
Package / Case: 784-BGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 784-BGA
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 624.85 EUR |
| MPFS095T-FCVG484I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 330.65 EUR |
| MPFS095TL-FCVG484I |
|
Hersteller: Microchip Technology
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
Description: IC SOC RISC-V 484FCBGA
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
RAM Size: 857.6kB
Operating Temperature: -40°C ~ 100°C
Core Processor: RISC-V
Primary Attributes: FPGA - 93K Logic Modules
Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Peripherals: DMA, PCI, PWM
Supplier Device Package: 484-FCBGA (19x19)
Architecture: MPU, FPGA
Flash Size: 128KB
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 389.8 EUR |
| MCP1811BT-025/LT |
|
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 150MA SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Description: IC REG LINEAR 2.5V 150MA SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
| MCP1811BT-025/LT |
|
Hersteller: Microchip Technology
Description: IC REG LINEAR 2.5V 150MA SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Description: IC REG LINEAR 2.5V 150MA SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 0.5 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: SC-70-5
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
Part Status: Obsolete
PSRR: 50dB (1kHz)
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current
Current - Supply (Max): 110 µA
Produkt ist nicht verfügbar
| ATTINY861V-10MUR |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| ATTINY861V-10MUR |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB FLASH 32VQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 11x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Verified
auf Bestellung 5922 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.46 EUR |
| 25+ | 5.01 EUR |
| 100+ | 4.52 EUR |
| MSCSM70TLM10C3AG |
Hersteller: Microchip Technology
Description: SIC 4N-CH 700V 241A MODULE
Packaging: Box
Package / Case: Module
Mounting Type: Through Hole
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA (Typ)
Supplier Device Package: Module
Part Status: Active
Description: SIC 4N-CH 700V 241A MODULE
Packaging: Box
Package / Case: Module
Mounting Type: Through Hole
Configuration: 4 N-Channel
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 690W (Tc)
Drain to Source Voltage (Vdss): 700V
Current - Continuous Drain (Id) @ 25°C: 241A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 9000pF @ 700V
Rds On (Max) @ Id, Vgs: 9.5mOhm @ 80A, 20V
Gate Charge (Qg) (Max) @ Vgs: 430nC @ 20V
Vgs(th) (Max) @ Id: 2.4V @ 8mA (Typ)
Supplier Device Package: Module
Part Status: Active
auf Bestellung 14 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 607.48 EUR |
| APT10M19BVRG |
|
Hersteller: Microchip Technology
Description: MOSFET N-CH 100V 75A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 500mA, 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 300 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6120 pF @ 25 V
Description: MOSFET N-CH 100V 75A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 500mA, 10V
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-247 [B]
Part Status: Active
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 300 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6120 pF @ 25 V
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.57 EUR |
| dsPIC33EP32GS502T-I/MM |
|
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| dsPIC33EP32GS502T-I/MM |
|
Hersteller: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-QFN-S (6x6)
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| ATMEGA88PA-MMH | |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28VQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28VQFN
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Part Status: Active
Number of I/O: 23
DigiKey Programmable: Not Verified
auf Bestellung 478 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.4 EUR |
| 25+ | 3.11 EUR |
| 100+ | 2.83 EUR |
| ATTINY44A-PU |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (2K x 16)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 14-PDIP
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Verified
auf Bestellung 1070 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 8+ | 2.43 EUR |
| 25+ | 2.21 EUR |
| 100+ | 2.01 EUR |
| AT89LV52-12PI |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| AT89LV51-12PI |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 12MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Connectivity: UART/USART
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 1N5809 |
|
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 3A AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
Description: DIODE GEN PURP 100V 3A AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 30 ns
Technology: Standard
Capacitance @ Vr, F: 60pF @ 10V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 4 A
Current - Reverse Leakage @ Vr: 5 µA @ 100 V
auf Bestellung 760 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 10.68 EUR |
| 100+ | 9.93 EUR |
| 1N5804 |
|
Hersteller: Microchip Technology
Description: DIODE GEN PURP 100V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
Description: DIODE GEN PURP 100V 1A AXIAL
Packaging: Bulk
Package / Case: A, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 25 ns
Technology: Standard
Capacitance @ Vr, F: 25pF @ 10V, 1MHz
Current - Average Rectified (Io): 1A
Supplier Device Package: A, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 875 mV @ 1 A
Current - Reverse Leakage @ Vr: 1 µA @ 100 V
auf Bestellung 345 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 3+ | 8.75 EUR |
| 100+ | 8.12 EUR |
| MNS2N3700UB/TR |
Hersteller: Microchip Technology
Description: MNS2N3700UB
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
Description: MNS2N3700UB
Packaging: Tape & Reel (TR)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 100+ | 19.63 EUR |
| MNS2N3700UB/TR |
Hersteller: Microchip Technology
Description: MNS2N3700UB
Packaging: Cut Tape (CT)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
Description: MNS2N3700UB
Packaging: Cut Tape (CT)
Part Status: Active
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Supplier Device Package: UB
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 21.14 EUR |
| ATTINY24A-MMHR |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 6000+ | 1.42 EUR |
| ATTINY24A-MMHR |
|
Hersteller: Microchip Technology
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (1K x 16)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: USI
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
auf Bestellung 16524 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 1.71 EUR |
| 25+ | 1.6 EUR |
| 100+ | 1.42 EUR |
| DSA400-3333Q0172KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0078KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0172KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0001KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4441Q0170KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-1111Q0169KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0171KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0001KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0172KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0001KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0167KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0001KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0078KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0172KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 156.25MHz
Frequency - Output 2: 156.25MHz
Part Status: Active
Frequency - Output 3: 156.25MHz
Frequency - Output 4: 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0167KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0001KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0078KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-1111Q0169KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0171KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0171KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0168KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz, 125MHz
Frequency - Output 2: 100MHz, 125MHz
Part Status: Active
Frequency - Output 3: 100MHz, 125MHz
Frequency - Output 4: 100MHz, 125MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz, 125MHz
Frequency - Output 2: 100MHz, 125MHz
Part Status: Active
Frequency - Output 3: 100MHz, 125MHz
Frequency - Output 4: 100MHz, 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0171KL2TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz, 156.25MHz
Frequency - Output 2: 125MHz, 156.25MHz
Part Status: Active
Frequency - Output 3: 125MHz, 156.25MHz
Frequency - Output 4: 125MHz, 156.25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0167KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4441Q0170KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-1111Q0169KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4441Q0170KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4444Q0001KL2VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0001KL1TVAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 100MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-3333Q0078KL1VAO |
|
Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tube
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVDS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 48mA
Frequency - Output 1: 125MHz
Frequency - Output 2: 125MHz
Part Status: Active
Frequency - Output 3: 125MHz
Frequency - Output 4: 125MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-1111Q0169KL2TVAO |
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Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 56mA
Frequency - Output 1: 25MHz
Frequency - Output 2: 50MHz
Part Status: Active
Frequency - Output 3: 50MHz
Frequency - Output 4: 25MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar
| DSA400-4441Q0170KL2TVAO |
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Hersteller: Microchip Technology
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Description: OSC MEMS AUTO -40C-105C SMD
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Output: HCSL, LVCMOS
Function: Enable/Disable (Reprogrammable)
Type: MEMS (Silicon)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Height: 0.035" (0.90mm)
Ratings: AEC-Q100
Current - Supply (Max): 88mA
Frequency - Output 1: 50MHz
Frequency - Output 2: 100MHz
Part Status: Active
Frequency - Output 3: 100MHz
Frequency - Output 4: 100MHz
Base Resonator: MEMS
Produkt ist nicht verfügbar