| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
||
|---|---|---|---|---|---|---|---|
 |
EC7401QI | Intel |
 Description: IC REG CTRLR BUCK 40QFNPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Output Type: PWM Signal Mounting Type: Surface Mount Function: Step-Down Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: Positive, Isolation Capable Frequency - Switching: 80kHz ~ 1MHz Topology: Buck Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Supplier Device Package: 40-QFN (6x6) Control Features: Enable, Frequency Control, Power Good, Soft Start Output Phases: 4 Duty Cycle (Max): 66.7% Clock Sync: No Number of Outputs: 4 |
Produkt ist nicht verfügbar |
|||
 |
ER2120QI | Intel |
Description: IC REG BUCK ADJUSTABLE 2A 24QFN |
Produkt ist nicht verfügbar |
|||
 |
ER3105DI | Intel |
Description: IC REG BUCK ADJ 500MA 12DFN Packaging: Tape & Reel (TR) Package / Case: 12-VFDFN Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Number of Outputs: 1 Function: Step-Down Current - Output: 500mA Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 300kHz ~ 2MHz Voltage - Input (Max): 36V Topology: Buck Supplier Device Package: 12-DFN (4x3) Synchronous Rectifier: Yes Voltage - Output (Max): 34V Voltage - Input (Min): 3V Voltage - Output (Min/Fixed): 0.6V |
Produkt ist nicht verfügbar |
|||
 |
ES1010SI | Intel |
Description: IC HOT SWAP CTRLR GP 8SOIC Features: Latched Fault Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Hot Swap Controller Operating Temperature: -40°C ~ 85°C Voltage - Supply: 10.2V ~ 13.8V Applications: General Purpose Internal Switch(s): No Supplier Device Package: 8-SOIC Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO Part Status: Obsolete Number of Channels: 1 Current - Supply: 3 mA |
Produkt ist nicht verfügbar |
|||
 |
EY1602SI-ADJ | Intel |
Description: IC REG LINEAR POS ADJ 50MA 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 50mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 24 µA Voltage - Input (Max): 40V Number of Regulators: 1 Supplier Device Package: 8-SOIC-EP Voltage - Output (Max): 12V Voltage - Output (Min/Fixed): 1.223V Control Features: Enable PSRR: 58dB (100Hz) Voltage Dropout (Max): 0.35V @ 50mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 82 µA |
Produkt ist nicht verfügbar |
|||
 |
EY1603TI-ADJ | Intel |
Description: IC REG LIN POS ADJ 14HTSSOP Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad Output Type: Adjustable Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 24 µA Voltage - Input (Max): 40V Number of Regulators: 1 Supplier Device Package: 14-HTSSOP Voltage - Output (Max): 12V Voltage - Output (Min/Fixed): 1.223V Control Features: Enable PSRR: 66dB (100Hz) Voltage Dropout (Max): 0.46V @ 150mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 125 µA |
Produkt ist nicht verfügbar |
|||
 |
EC7100VQI | Intel |
Description: IC REG CTRLR FPGA 1OUT 20QFN Packaging: Cut Tape (CT) Package / Case: 20-VFQFN Exposed Pad Voltage - Output: 0.5V ~ 5V Mounting Type: Surface Mount Number of Outputs: 1 Voltage - Input: 3.3V ~ 25V Operating Temperature: -10°C ~ 100°C Applications: Controller, FPGA Supplier Device Package: 20-QFN (3x4) Part Status: Obsolete |
Produkt ist nicht verfügbar |
|||
|
|
ER2120QI | Intel |
Description: IC REG BUCK ADJUSTABLE 2A 24QFN |
Produkt ist nicht verfügbar |
|||
|
|
ED8106N00QI | Intel | Description: IC REG CTRLR BUCK 24QFN |
Produkt ist nicht verfügbar |
|||
 |
EVB-EC7100VQI | Intel |
Description: EVAL BOARD PWM DC-DC CTRLR Packaging: Box Voltage - Output: 0.5V ~ 5V Voltage - Input: 3.3V ~ 25V Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: EC7100VQI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated Part Status: Obsolete |
Produkt ist nicht verfügbar |
|||
 |
EVB-ER3105DI | Intel |
Description: EVAL DC-DC BUCK CONVERTER .5A Packaging: Box Voltage - Input: 3V ~ 36V Current - Output: 500mA Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: ER3105DI Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1, Non-Isolated Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
 |
EVB-ES1010SI | Intel |
Description: EVAL BOARD 12V HOTSWAP CTRLR Packaging: Box Function: Hot Swap Controller Type: Power Management Utilized IC / Part: ES1010SI Supplied Contents: Board(s) Part Status: Obsolete |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
 |
EVB-EY1602SI-ADJ | Intel |
Description: EVAL BOARD LINEAR REG 50MA 40V Packaging: Box Voltage - Output: 2.5V ~ 12V Voltage - Input: 6V ~ 40V Current - Output: 50mA Regulator Type: Positive Adjustable Board Type: Fully Populated Utilized IC / Part: EY1602 Supplied Contents: Board(s) Channels per IC: 1 - Single Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
 |
EVB-EY1603TI-ADJ | Intel |
Description: EVAL BOARD LINEAR REG 150MA 40V |
Produkt ist nicht verfügbar |
|||
|
|
ED8106N00QI | Intel | Description: IC REG CTRLR BUCK 24QFN |
auf Bestellung 1754 Stücke: Lieferzeit 10-14 Tag (e) |
|||
 |
5CSEBA2U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
 |
5CSEBA4U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
Produkt ist nicht verfügbar |
|||
 |
5CSEMA4U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA4U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
 |
5CSXFC2C6U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSXFC2C6U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSXFC4C6U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 60 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSXFC4C6U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 34 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA2U19I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
|||
 |
5CGXFC5C6F23A7N | Intel |
Description: IC FPGA 240 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 77000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 29080 Total RAM Bits: 5001216 Number of I/O: 240 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
|||
 |
5CGXFC7D6F31A7N | Intel |
Description: IC FPGA 480 I/O 896FBGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 99 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 46 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA2U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 90 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 108 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA2U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U19I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 484UBGA Packaging: Tray Package / Case: 484-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 484-UBGA (19x19) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 207 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U23C7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA4U23C8SN | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
|
||
|
|
5CSEBA4U23I7SN | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEBA5U23I7 | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA2U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA2U23C6N | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA2U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA2U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA2U23I7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA4U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA4U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSEMA4U23C8N | Intel |
Description: IC SOC CORTEX-A9 600MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 600MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSXFC2C6U23A7N | Intel |
Description: IC SOC CORTEX-A9 700MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 700MHz RAM Size: 64KB Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
|||
|
|
5CSXFC4C6U23C7N | Intel |
Description: IC SOC CORTEX-A9 800MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 800MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 40K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA |
Produkt ist nicht verfügbar |
| EC7401QI |
|
Hersteller: Intel
Description: IC REG CTRLR BUCK 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 80kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Supplier Device Package: 40-QFN (6x6)
Control Features: Enable, Frequency Control, Power Good, Soft Start
Output Phases: 4
Duty Cycle (Max): 66.7%
Clock Sync: No
Number of Outputs: 4
Description: IC REG CTRLR BUCK 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Output Type: PWM Signal
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive, Isolation Capable
Frequency - Switching: 80kHz ~ 1MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Supplier Device Package: 40-QFN (6x6)
Control Features: Enable, Frequency Control, Power Good, Soft Start
Output Phases: 4
Duty Cycle (Max): 66.7%
Clock Sync: No
Number of Outputs: 4
Produkt ist nicht verfügbar
| ER3105DI |
|
Hersteller: Intel
Description: IC REG BUCK ADJ 500MA 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Description: IC REG BUCK ADJ 500MA 12DFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 300kHz ~ 2MHz
Voltage - Input (Max): 36V
Topology: Buck
Supplier Device Package: 12-DFN (4x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 34V
Voltage - Input (Min): 3V
Voltage - Output (Min/Fixed): 0.6V
Produkt ist nicht verfügbar
| ES1010SI |
|
Hersteller: Intel
Description: IC HOT SWAP CTRLR GP 8SOIC
Features: Latched Fault
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 10.2V ~ 13.8V
Applications: General Purpose
Internal Switch(s): No
Supplier Device Package: 8-SOIC
Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO
Part Status: Obsolete
Number of Channels: 1
Current - Supply: 3 mA
Description: IC HOT SWAP CTRLR GP 8SOIC
Features: Latched Fault
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Hot Swap Controller
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 10.2V ~ 13.8V
Applications: General Purpose
Internal Switch(s): No
Supplier Device Package: 8-SOIC
Programmable Features: Current Limit, Fault Timeout, Slew Rate, UVLO
Part Status: Obsolete
Number of Channels: 1
Current - Supply: 3 mA
Produkt ist nicht verfügbar
| EY1602SI-ADJ |
|
Hersteller: Intel
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 8-SOIC-EP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.35V @ 50mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 82 µA
Description: IC REG LINEAR POS ADJ 50MA 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 8-SOIC-EP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 58dB (100Hz)
Voltage Dropout (Max): 0.35V @ 50mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 82 µA
Produkt ist nicht verfügbar
| EY1603TI-ADJ |
|
Hersteller: Intel
Description: IC REG LIN POS ADJ 14HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 14-HTSSOP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 66dB (100Hz)
Voltage Dropout (Max): 0.46V @ 150mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 125 µA
Description: IC REG LIN POS ADJ 14HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 24 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: 14-HTSSOP
Voltage - Output (Max): 12V
Voltage - Output (Min/Fixed): 1.223V
Control Features: Enable
PSRR: 66dB (100Hz)
Voltage Dropout (Max): 0.46V @ 150mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 125 µA
Produkt ist nicht verfügbar
| EC7100VQI |
|
Hersteller: Intel
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
Description: IC REG CTRLR FPGA 1OUT 20QFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: 0.5V ~ 5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 3.3V ~ 25V
Operating Temperature: -10°C ~ 100°C
Applications: Controller, FPGA
Supplier Device Package: 20-QFN (3x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
| EVB-EC7100VQI |
|
Hersteller: Intel
Description: EVAL BOARD PWM DC-DC CTRLR
Packaging: Box
Voltage - Output: 0.5V ~ 5V
Voltage - Input: 3.3V ~ 25V
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EC7100VQI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
Description: EVAL BOARD PWM DC-DC CTRLR
Packaging: Box
Voltage - Output: 0.5V ~ 5V
Voltage - Input: 3.3V ~ 25V
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: EC7100VQI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
Produkt ist nicht verfügbar
| EVB-ER3105DI |
|
Hersteller: Intel
Description: EVAL DC-DC BUCK CONVERTER .5A
Packaging: Box
Voltage - Input: 3V ~ 36V
Current - Output: 500mA
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER3105DI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
Description: EVAL DC-DC BUCK CONVERTER .5A
Packaging: Box
Voltage - Input: 3V ~ 36V
Current - Output: 500mA
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: ER3105DI
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1, Non-Isolated
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 121.44 EUR |
| EVB-ES1010SI |
|
Hersteller: Intel
Description: EVAL BOARD 12V HOTSWAP CTRLR
Packaging: Box
Function: Hot Swap Controller
Type: Power Management
Utilized IC / Part: ES1010SI
Supplied Contents: Board(s)
Part Status: Obsolete
Description: EVAL BOARD 12V HOTSWAP CTRLR
Packaging: Box
Function: Hot Swap Controller
Type: Power Management
Utilized IC / Part: ES1010SI
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 110.72 EUR |
| EVB-EY1602SI-ADJ |
|
Hersteller: Intel
Description: EVAL BOARD LINEAR REG 50MA 40V
Packaging: Box
Voltage - Output: 2.5V ~ 12V
Voltage - Input: 6V ~ 40V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1602
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Part Status: Obsolete
Description: EVAL BOARD LINEAR REG 50MA 40V
Packaging: Box
Voltage - Output: 2.5V ~ 12V
Voltage - Input: 6V ~ 40V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: EY1602
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 113.24 EUR |
| EVB-EY1603TI-ADJ |
|
Hersteller: Intel
Description: EVAL BOARD LINEAR REG 150MA 40V
Description: EVAL BOARD LINEAR REG 150MA 40V
Produkt ist nicht verfügbar
| ED8106N00QI |
Hersteller: Intel
Description: IC REG CTRLR BUCK 24QFN
Description: IC REG CTRLR BUCK 24QFN
auf Bestellung 1754 Stücke:
Lieferzeit 10-14 Tag (e)| 5CSEBA2U19C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEBA2U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEBA2U19I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Produkt ist nicht verfügbar
| 5CSEMA4U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA4U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC2C6U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC2C6U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 190.73 EUR |
| 5CSXFC4C6U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 60 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 270.79 EUR |
| 5CSXFC4C6U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 406.21 EUR |
| 5CSEBA2U19I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
| 5CGXFC5C6F23A7N |
|
Hersteller: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 77000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 29080
Total RAM Bits: 5001216
Number of I/O: 240
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| 5CSEBA2U19C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA2U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA2U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 99 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 105.71 EUR |
| 5CSEBA2U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA2U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA2U23C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA2U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 46 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 153.79 EUR |
| 5CSEBA2U23C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 90 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 130.63 EUR |
| 5CSEBA2U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 108 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 229.89 EUR |
| 5CSEBA2U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
| 5CSEBA4U19C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U19C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Produkt ist nicht verfügbar
| 5CSEBA4U19C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U19C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U19C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U19I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 800MHZ 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 484-UBGA (19x19)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 207 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 197.84 EUR |
| 5CSEBA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA4U23C7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Produkt ist nicht verfügbar
| 5CSEBA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Produkt ist nicht verfügbar
| 5CSEBA4U23C8SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 165.09 EUR |
| 5CSEBA4U23I7SN |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEBA5U23I7 |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA2U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 5CSEMA2U23C6N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA2U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA2U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA2U23I7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA4U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
| 5CSEMA4U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSEMA4U23C8N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 600MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 600MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC2C6U23A7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 700MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 700MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar
| 5CSXFC4C6U23C7N |
|
Hersteller: Intel
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A9 800MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 800MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Produkt ist nicht verfügbar