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EM6353BY1SP3B-4.4+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6353BY2SP3B-2.9+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6353BY2SP3B-4.6+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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6000+0.33 EUR
Mindestbestellmenge: 3000
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EM6353BZ2SP3B-2.9+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6353BZ2SP3B-3.1+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Produkt ist nicht verfügbar
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EM6353BZ2SP3B-4.6+ EM Microelectronic Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6354XSP5B-1.8+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
Produkt ist nicht verfügbar
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EM6354XSP5B-2.9+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
Produkt ist nicht verfügbar
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EM6354YSP5B-4.6+ EM Microelectronic Description: RESET CIRCUIT WITH ADJUSTABLE DE
Produkt ist nicht verfügbar
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EM6420V1LF40D+ EM Microelectronic em6420_ds.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6420V4LF40D+ EM Microelectronic em6420_ds.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
Produkt ist nicht verfügbar
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EM6819F2-B006-SO08A+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 5.6KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
Produkt ist nicht verfügbar
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EM6819F2-B006-SO08B+ EM6819F2-B006-SO08B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 8-SOIC
Produkt ist nicht verfügbar
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EM6819F2-B006-TP016B+ EM6819F2-B006-TP016B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 5.6KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
Produkt ist nicht verfügbar
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EM6819F4-A005-LF20D+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
Produkt ist nicht verfügbar
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EM6819F4-A005-TP16B+ EM6819F4-A005-TP16B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
Produkt ist nicht verfügbar
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EM6819F4-A005-TP20B+ EM6819F4-A005-TP20B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-TSSOP
Produkt ist nicht verfügbar
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EM6819F4-B000-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F4-B000-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F4-B005-SO08B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
Produkt ist nicht verfügbar
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EM6819F4-B005-TP016B+ EM6819F4-B005-TP016B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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EM6819F4-B100-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F4-B100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F4-B300-TP028B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-A000-LF20D+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
Produkt ist nicht verfügbar
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EM6819F6-A000-LF32D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
Produkt ist nicht verfügbar
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EM6819F6-A000-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A000-TP28B+ EM6819F6-A000-TP28B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
Produkt ist nicht verfügbar
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EM6819F6-A100-LF20D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A100-TP28B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-B100-LF20D+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B100-TP16B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 12
Produkt ist nicht verfügbar
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EM6819F6-B100-TP20B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B100-TP28B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-B300-TP020B+ EM Microelectronic 6819-DS.pdf Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B300-TP028B+ EM6819F6-B300-TP028B+ EM Microelectronic Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
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EM7180V1CS16B+ EM Microelectronic Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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EM7604V00SP6B+ EM7604V00SP6B+ EM Microelectronic em7604_ds.pdf Description: CRYSTAL 32.7680KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
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EM7604V00SP6B+ EM7604V00SP6B+ EM Microelectronic em7604_ds.pdf Description: CRYSTAL 32.7680KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
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EM7604V20SCP4B+ EM7604V20SCP4B+ EM Microelectronic em7604-c7_ds_0.pdf Description: CRYSTAL 32.6780KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
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EM7604V20SCP4B+ EM7604V20SCP4B+ EM Microelectronic em7604-c7_ds_0.pdf Description: CRYSTAL 32.6780KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
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EM8500-A001-LF24B+ EM8500-A001-LF24B+ EM Microelectronic 8500-ds.pdf Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
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EM8500-A001-LF24B+ EM8500-A001-LF24B+ EM Microelectronic 8500-ds.pdf Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
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EM8502-A005-LF24B+ EM8502-A005-LF24B+ EM Microelectronic Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
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EM8502-A005-LF24B+ EM8502-A005-LF24B+ EM Microelectronic Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
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EM8900-V001-DF10B+ EM8900-V001-DF10B+ EM Microelectronic 8900-ds.pdf Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
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EM8900-V001-DF10B+ EM8900-V001-DF10B+ EM Microelectronic 8900-ds.pdf Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
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EM9301V02LF24B+ EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V02LF24D+ EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 3dBm
Protocol: Bluetooth v4.0
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
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EM9301V02WW7 EM Microelectronic Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9301V22LF24B+ EM Microelectronic Description: IC RF TXRX+MCU BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9304V01CS25B EM Microelectronic 9304-DS.pdf Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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EM9304V01CS25B EM Microelectronic 9304-DS.pdf Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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EM9304V01LF28B EM9304V01LF28B EM Microelectronic 9304-DS.pdf Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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EM9304V01LF28B EM9304V01LF28B EM Microelectronic 9304-DS.pdf Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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EM9304V01WW31 EM Microelectronic 9304-DS.pdf Description: IC RF TXRX+MCU 802.15.4 WAFER
Packaging: Tape & Reel (TR)
Package / Case: Die
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB RAM, 136kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V ~ 1.9V
Power - Output: 6.2dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3mA ~ 5.8mA
Data Rate (Max): 2Mbps
Current - Transmitting: 2.2mA ~ 14.8mA
Supplier Device Package: Wafer
GPIO: 12
Modulation: FSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, HCI, I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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EM9304V141LF28B EM Microelectronic Description: IC RF TXRX+MCU 802.15.4 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB RAM, 136kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V ~ 1.9V
Power - Output: 6.2dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3mA ~ 5.8mA
Data Rate (Max): 2Mbps
Current - Transmitting: 2.2mA ~ 14.8mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 12
Modulation: FSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, HCI, I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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EM9305AS101LF28B EM Microelectronic 9305-FS%20%28updated%2004.04.2023%29.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
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EM9305AS201CS23B EM Microelectronic 9305-FS%20%28updated%2004.04.2023%29.pdf Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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EM6353BY1SP3B-4.4+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.4V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-2.9+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BY2SP3B-4.6+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Open Drain or Open Collector
Type: Simple Reset/Power-On Reset
Reset: Active Low
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
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EM6353BZ2SP3B-2.9+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 2.93V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6353BZ2SP3B-3.1+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Produkt ist nicht verfügbar
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EM6353BZ2SP3B-4.6+
Hersteller: EM Microelectronic
Description: ULTRA LOW POWER RESET CIRCUIT WI
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Output: Push-Pull, Totem Pole
Type: Simple Reset/Power-On Reset
Reset: Active High
Operating Temperature: -40°C ~ 125°C (TA)
Number of Voltages Monitored: 1
Reset Timeout: 155ms Minimum
Voltage - Threshold: 4.63V
Supplier Device Package: SOT-23-3
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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EM6354XSP5B-1.8+
Hersteller: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
Produkt ist nicht verfügbar
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EM6354XSP5B-2.9+
Hersteller: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
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EM6354YSP5B-4.6+
Hersteller: EM Microelectronic
Description: RESET CIRCUIT WITH ADJUSTABLE DE
Produkt ist nicht verfügbar
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EM6420V1LF40D+ em6420_ds.pdf
Hersteller: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
Produkt ist nicht verfügbar
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EM6420V4LF40D+ em6420_ds.pdf
Hersteller: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.2V ~ 2V, 2.2V ~ 3.6V
Current - Supply: 7.5µA, 12µA
Number of Inputs: Up to 16
Supplier Device Package: 40-QFN (6x6)
Proximity Detection: No
LED Driver Channels: Up to 16
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EM6819F2-B006-SO08A+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 5.6KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
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EM6819F2-B006-SO08B+
EM6819F2-B006-SO08B+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 8-SOIC
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EM6819F2-B006-TP016B+ 6819-DS.pdf
EM6819F2-B006-TP016B+
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 5.6KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 5.6KB (2K x 22.5)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
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EM6819F4-A005-LF20D+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
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EM6819F4-A005-TP16B+ 6819-DS.pdf
EM6819F4-A005-TP16B+
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
Produkt ist nicht verfügbar
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EM6819F4-A005-TP20B+
EM6819F4-A005-TP20B+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-TSSOP
Produkt ist nicht verfügbar
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EM6819F4-B000-TP028B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
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EM6819F4-B000-TP20B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F4-B005-SO08B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Voltage Detect, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
Produkt ist nicht verfügbar
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EM6819F4-B005-TP016B+
EM6819F4-B005-TP016B+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
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EM6819F4-B100-TP028B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F4-B100-TP20B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F4-B300-TP028B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 11.5KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 11.5KB (4K x 23)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-A000-LF20D+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 20-QFN (4x4)
Produkt ist nicht verfügbar
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EM6819F6-A000-LF32D+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Connectivity: I2C, SPI, UART/USART
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EM6819F6-A000-TP20B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A000-TP28B+
EM6819F6-A000-TP28B+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 0.9V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
Produkt ist nicht verfügbar
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EM6819F6-A100-LF20D+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A100-TP20B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-A100-TP28B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-B100-LF20D+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B100-TP16B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 12
Produkt ist nicht verfügbar
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EM6819F6-B100-TP20B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B100-TP28B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-QFN (4x4)
Number of I/O: 24
Produkt ist nicht verfügbar
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EM6819F6-B300-TP020B+ 6819-DS.pdf
Hersteller: EM Microelectronic
Description: IC MCU 8BIT 16.9KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 15MHz
Program Memory Size: 16.9KB (6K x 22.5)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: CR816L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, Voltage Detect, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
Produkt ist nicht verfügbar
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EM6819F6-B300-TP028B+
EM6819F6-B300-TP028B+
Hersteller: EM Microelectronic
Description: SUB-1V (0.6V) 8BIT FLASH MCU DC-
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 8
Voltage - Input: 1.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 28-TSSOP
Produkt ist nicht verfügbar
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EM7180V1CS16B+
Hersteller: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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EM7604V00SP6B+ em7604_ds.pdf
EM7604V00SP6B+
Hersteller: EM Microelectronic
Description: CRYSTAL 32.7680KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.95 EUR
Mindestbestellmenge: 3000
Im Einkaufswagen  Stück im Wert von  UAH
EM7604V00SP6B+ em7604_ds.pdf
EM7604V00SP6B+
Hersteller: EM Microelectronic
Description: CRYSTAL 32.7680KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Size / Dimension: 0.114" L x 0.063" W (2.90mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.057" (1.45mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
Supplier Device Package: 4-VDFN (3.2x2.5)
auf Bestellung 8853 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.71 EUR
10+2.32 EUR
25+1.96 EUR
100+1.54 EUR
250+1.34 EUR
500+1.22 EUR
1000+1.11 EUR
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EM7604V20SCP4B+ em7604-c7_ds_0.pdf
EM7604V20SCP4B+
Hersteller: EM Microelectronic
Description: CRYSTAL 32.6780KHZ SMD
Packaging: Cut Tape (CT)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
auf Bestellung 2393 Stücke:
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Anzahl Preis
2+9.08 EUR
10+6.08 EUR
25+5.31 EUR
100+4.43 EUR
250+4.01 EUR
500+3.75 EUR
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EM7604V20SCP4B+ em7604-c7_ds_0.pdf
EM7604V20SCP4B+
Hersteller: EM Microelectronic
Description: CRYSTAL 32.6780KHZ SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.059" W (3.20mm x 1.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -10°C ~ 85°C
Voltage - Supply: 1.2V ~ 5.5V
Current - Supply (Max): 1mA
Height - Seated (Max): 0.039" (1.00mm)
Part Status: Active
Frequency: 32.768 kHz
Base Resonator: Crystal
auf Bestellung 2000 Stücke:
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Anzahl Preis
1000+3.25 EUR
Mindestbestellmenge: 1000
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EM8500-A001-LF24B+ 8500-ds.pdf
EM8500-A001-LF24B+
Hersteller: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Produkt ist nicht verfügbar
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EM8500-A001-LF24B+ 8500-ds.pdf
EM8500-A001-LF24B+
Hersteller: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 0.1V ~ 1.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
auf Bestellung 164 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.00 EUR
10+5.39 EUR
25+5.09 EUR
100+4.41 EUR
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EM8502-A005-LF24B+
EM8502-A005-LF24B+
Hersteller: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
Produkt ist nicht verfügbar
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EM8502-A005-LF24B+
EM8502-A005-LF24B+
Hersteller: EM Microelectronic
Description: POWER MANAGEMENT CONTROLLER WITH
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.8V
Current - Supply: 380nA
Supplier Device Package: 24-QFN (4x4)
auf Bestellung 2497 Stücke:
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Anzahl Preis
3+8.20 EUR
10+5.34 EUR
25+4.59 EUR
100+3.74 EUR
250+3.33 EUR
500+3.07 EUR
1000+2.89 EUR
Mindestbestellmenge: 3
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EM8900-V001-DF10B+ 8900-ds.pdf
EM8900-V001-DF10B+
Hersteller: EM Microelectronic
Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
auf Bestellung 4000 Stücke:
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Anzahl Preis
4000+1.36 EUR
Mindestbestellmenge: 4000
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EM8900-V001-DF10B+ 8900-ds.pdf
EM8900-V001-DF10B+
Hersteller: EM Microelectronic
Description: ULTRA-LOW VOLTAGE DCDC BOOST CON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 0V ~ 4.2V
Operating Temperature: -40°C ~ 85°C
Applications: Converter, Power Supplies
Supplier Device Package: 10-DFN (3x3)
Part Status: Active
auf Bestellung 8432 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.80 EUR
10+3.03 EUR
25+2.57 EUR
100+2.05 EUR
250+1.80 EUR
500+1.64 EUR
1000+1.51 EUR
Mindestbestellmenge: 4
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EM9301V02LF24B+
Hersteller: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9301V02LF24D+
Hersteller: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 3dBm
Protocol: Bluetooth v4.0
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9301V02WW7
Hersteller: EM Microelectronic
Description: IC RF TXRX BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V, 2.3V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA ~ 13mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12mA ~ 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9301V22LF24B+
Hersteller: EM Microelectronic
Description: IC RF TXRX+MCU BLE 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-WFQFN Exposed Pad
Sensitivity: -80dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 4dBm
Protocol: Bluetooth v4.1
Current - Receiving: 12.9mA
Data Rate (Max): 5Mbps
Current - Transmitting: 12.1mA
Supplier Device Package: 24-QFN (5x5)
GPIO: 1
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, HCI, SPI, UART
Produkt ist nicht verfügbar
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EM9304V01CS25B 9304-DS.pdf
Hersteller: EM Microelectronic
Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Tape & Reel (TR)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+2.62 EUR
Mindestbestellmenge: 4000
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EM9304V01CS25B 9304-DS.pdf
Hersteller: EM Microelectronic
Description: OPTIMIZED BLUETOOTH 5.0 LOW ENER
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 25-WLCSP (2.34x2.21)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I²S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 19925 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.28 EUR
10+4.74 EUR
25+4.48 EUR
100+3.88 EUR
250+3.69 EUR
500+3.31 EUR
1000+2.79 EUR
Mindestbestellmenge: 4
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EM9304V01LF28B 9304-DS.pdf
EM9304V01LF28B
Hersteller: EM Microelectronic
Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+2.41 EUR
Mindestbestellmenge: 2500
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EM9304V01LF28B 9304-DS.pdf
EM9304V01LF28B
Hersteller: EM Microelectronic
Description: IC RF TXRX+MCU BLE 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Power - Output: 6.1dBm
Protocol: Bluetooth v5.0
Current - Receiving: 3.3mA
Data Rate (Max): 1Mbps
Current - Transmitting: 2.2mA ~ 9.9mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 1
RF Family/Standard: Bluetooth
Serial Interfaces: GPIO, I2S, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4665 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.17 EUR
10+4.64 EUR
25+4.38 EUR
100+3.80 EUR
250+3.60 EUR
500+3.23 EUR
1000+2.73 EUR
Mindestbestellmenge: 4
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EM9304V01WW31 9304-DS.pdf
Hersteller: EM Microelectronic
Description: IC RF TXRX+MCU 802.15.4 WAFER
Packaging: Tape & Reel (TR)
Package / Case: Die
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB RAM, 136kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V ~ 1.9V
Power - Output: 6.2dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3mA ~ 5.8mA
Data Rate (Max): 2Mbps
Current - Transmitting: 2.2mA ~ 14.8mA
Supplier Device Package: Wafer
GPIO: 12
Modulation: FSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, HCI, I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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EM9304V141LF28B
Hersteller: EM Microelectronic
Description: IC RF TXRX+MCU 802.15.4 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-WFQFN Exposed Pad
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB RAM, 136kB ROM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V ~ 1.9V
Power - Output: 6.2dBm
Protocol: Bluetooth v5.0, Zigbee®
Current - Receiving: 3mA ~ 5.8mA
Data Rate (Max): 2Mbps
Current - Transmitting: 2.2mA ~ 14.8mA
Supplier Device Package: 28-QFN (4x4)
GPIO: 12
Modulation: FSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: GPIO, HCI, I2C, JTAG, SPI, UART
Produkt ist nicht verfügbar
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EM9305AS101LF28B 9305-FS%20%28updated%2004.04.2023%29.pdf
Hersteller: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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EM9305AS201CS23B 9305-FS%20%28updated%2004.04.2023%29.pdf
Hersteller: EM Microelectronic
Description: LINEAR IC
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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